IC ADC 16BIT 1CH 500KSPS 16-DFN
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DFN |
| 包装说明 | HVSON, SOLCC16,.12,18 |
| 针数 | 16 |
| 制造商包装代码 | DE |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 2.6 V |
| 最小模拟输入电压 | -2.4 V |
| 最长转换时间 | 1.5 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-N16 |
| JESD-609代码 | e3 |
| 长度 | 4 mm |
| 最大线性误差 (EL) | 0.0031% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC16,.12,18 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2.5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.5 MHz |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.45 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| LTC2382IDE-16#PBF | LTC2382CDE-16#PBF | LTC2382CDE-16#TRPBF | LTC2382IDE-16#TRPBF | |
|---|---|---|---|---|
| 描述 | IC ADC 16BIT 1CH 500KSPS 16-DFN | IC ADC 16BIT 1CH 500KSPS 16-DFN | IC ADC 16BIT 1CH 500KSPS 16-DFN | IC ADC 16BIT 1CH 500KSPS 16-DFN |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DFN | DFN | DFN | DFN |
| 包装说明 | HVSON, SOLCC16,.12,18 | HVSON, SOLCC16,.12,18 | HVSON, SOLCC16,.12,18 | HVSON, SOLCC16,.12,18 |
| 针数 | 16 | 16 | 16 | 16 |
| 制造商包装代码 | DE | DE | DE | DE |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
| 最小模拟输入电压 | -2.4 V | -2.4 V | -2.4 V | -2.4 V |
| 最长转换时间 | 1.5 µs | 1.5 µs | 1.5 µs | 1.5 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDSO-N16 | R-PDSO-N16 | R-PDSO-N16 | R-PDSO-N16 |
| JESD-609代码 | e3 | e3 | e3 | e3 |
| 长度 | 4 mm | 4 mm | 4 mm | 4 mm |
| 最大线性误差 (EL) | 0.0031% | 0.0031% | 0.0031% | 0.0031% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C |
| 输出位码 | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | HVSON | HVSON | HVSON |
| 封装等效代码 | SOLCC16,.12,18 | SOLCC16,.12,18 | SOLCC16,.12,18 | SOLCC16,.12,18 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 标称供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.45 mm | 0.45 mm | 0.45 mm | 0.45 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm |
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