Datasheet> 器件分类 > 模拟混合信号IC> 驱动程序和接口> NCD5703BDR2G

NCD5703BDR2G: 产品描述METAL SPIN OF NCD5703B. H; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小452KB，共20页; 制造商ON Semiconductor(安森美); 官网地址http://www.onsemi.cn

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NCD5703BDR2G概述

METAL SPIN OF NCD5703B. H

NCD5703BDR2G规格参数

参数名称	属性值
Brand Name	ON Semiconductor
是否无铅	不含铅
厂商名称	ON Semiconductor(安森美)
包装说明	SOIC-8
制造商包装代码	751-07
Reach Compliance Code	compliant
ECCN代码	EAR99
Factory Lead Time	5 weeks
Samacsys Description	METAL SPIN OF NCD5703B. H
接口集成电路类型	BUFFER OR INVERTER BASED IGBT DRIVER
JESD-30 代码	R-PDSO-G8
长度	5 mm
标称负供电电压	-8 V
功能数量	1
端子数量	8
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.24
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
峰值回流温度（摄氏度）	NOT SPECIFIED
座面最大高度	1.75 mm
最大供电电压	30 V
最小供电电压	13.2 V
标称供电电压	15 V
表面贴装	YES
温度等级	AUTOMOTIVE
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
断开时间	0.075 µs
接通时间	0.075 µs
宽度	4 mm

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NCD5703A, NCD5703B,

NCD5703C

High Current IGBT Gate

Drivers

The NCD5703A, NCD5703B and NCD5703C are high−current,

high−performance stand−alone IGBT drivers for high power

applications that include solar inverters, motor control and

uninterruptible power supplies. The devices offer a cost−effective

solution by eliminating external output buffer. Devices protection

features include accurate Under−voltage−lockout (UVLO),

desaturation protection (DESAT) and Active open−drain FAULT

output. The drivers also feature an accurate 5.0 V output. The drivers

are designed to accommodate a wide voltage range of bias supplies

including unipolar and NCD5703B even bipolar voltages.

Depending on the pin configuration the devices also include Active

Miller Clamp (NCD5703A) and separate high and low (V

and V

)

driver outputs for system design convenience (NCD5703C).

All three available pin configuration variants have 8−pin SOIC

package.

Features

www.onsemi.com

SOIC−8

D SUFFIX

CASE 751

MARKING

DIAGRAM

NCD5703X

ALYW

NCD5703 = Specific Device Code

= A, B or C

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

•

High Current Output (+4/−6 A) at IGBT Miller Plateau voltages

Low Output Impedance for Enhanced IGBT Driving

Short Propagation Delay with Accurate Matching

Direct Interface to Digital Isolator/Opto−coupler/Pulse Transformer

for Isolated Drive, Logic Compatibility for Non−isolated Drive

DESAT Protection with Programmable Delay

Tight UVLO Thresholds for Bias Flexibility

Wide Bias Voltage Range

This Device is Pb−Free, Halogen−Free and RoHS Compliant

PIN CONNECTIONS

VIN

VREF

FLT

DESAT

CLAMP

GND

VCC

NCD5703A

VIN

VREF

FLT

DESAT

VEE

GND

VCC

NCD5703A Features

•

Active Miller Clamp to Prevent Spurious Gate Turn−on

NCD5703B Features

•

Negative Output Voltage for Enhanced IGBT Driving

NCD5703B

NCD5703C Features

VIN

VREF

FLT

DESAT

GND

VOL

VOH

VCC

•

Separate Outputs for V

and V

Typical Applications

•

Solar Inverters

Motor Control

Uninterruptible Power Supplies (UPS)

Rapid Shutdown for Photovoltaic Systems

NCD5703C

ORDERING INFORMATION

See detailed ordering and shipping information on page 9 of

this data sheet.

Semiconductor Components Industries, LLC, 2018

January, 2018 − Rev. 0

Publication Order Number:

NCD5703/D

NCD5703BDR2G相似产品对比

	NCD5703BDR2G	NCD5703ADR2G	NCD5703CDR2G
描述	METAL SPIN OF NCD5703B. H	METAL SPIN OF NCD5703A. H	METAL SPIN OF NCD5703C. H
Brand Name	ON Semiconductor	ON Semiconductor	ON Semiconductor
是否无铅	不含铅	不含铅	不含铅
厂商名称	ON Semiconductor(安森美)	ON Semiconductor(安森美)	ON Semiconductor(安森美)
包装说明	SOIC-8	SOIC-8	SOIC-8
制造商包装代码	751-07	751-07	751-07
Reach Compliance Code	compliant	compliant	compliant
Factory Lead Time	5 weeks	4 weeks	4 weeks
Samacsys Description	METAL SPIN OF NCD5703B. H	METAL SPIN OF NCD5703A. H	METAL SPIN OF NCD5703C. H
接口集成电路类型	BUFFER OR INVERTER BASED IGBT DRIVER	BUFFER OR INVERTER BASED IGBT DRIVER	BUFFER OR INVERTER BASED IGBT DRIVER
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
长度	5 mm	5 mm	5 mm
标称负供电电压	-8 V	-8 V	-8 V
功能数量	1	1	1
端子数量	8	8	8
最高工作温度	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	SOP
封装等效代码	SOP8,.24	SOP8,.24	SOP8,.24
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
座面最大高度	1.75 mm	1.75 mm	1.75 mm
最大供电电压	30 V	30 V	30 V
最小供电电压	13.2 V	13.2 V	13.2 V
标称供电电压	15 V	15 V	15 V
表面贴装	YES	YES	YES
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
断开时间	0.075 µs	0.075 µs	0.075 µs
接通时间	0.075 µs	0.075 µs	0.075 µs
宽度	4 mm	4 mm	4 mm
Base Number Matches	-	1	1

NCD5703BDR2G

NCD5703BDR2G在线购买

NCD5703BDR2G概述

NCD5703BDR2G规格参数

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