电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

FW-15-03-G-D-250-140-P-TR

产品描述.050'' BOARD SPACERS
产品类别连接器    连接器   
文件大小852KB,共1页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

FW-15-03-G-D-250-140-P-TR概述

.050'' BOARD SPACERS

FW-15-03-G-D-250-140-P-TR规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
Factory Lead Time2 weeks
其他特性LOW PROFILE
连接器类型BOARD STACKING CONNECTOR
联系完成配合GOLD (10) OVER NICKEL (50)
联系完成终止GOLD FLASH OVER NICKEL (50)
触点性别MALE
触点材料PHOSPHOR BRONZE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e4
MIL 符合性NO
制造商序列号FW
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距1.27 mm
端接类型SURFACE MOUNT
触点总数30

文档预览

下载PDF文档
F-219
FW–20–05–F–D–610–065
FW–12–05–G–D–530–101
(1.27 mm) .050"
FW-SM SERIES
SMT MICRO BOARD STACKER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over 50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Yes
Board Mates:
CLP, FLE
Cable Mates:
FFSD
Low-profile or
skyscraper styles
APPLICATIONS
Variable
board spacing
MATED
HEIGHT
FW
CLP
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-30)
(0.15 mm) .006" max (31-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
MATED
CLP HEIGHT*
(8.13)
FW-XX-03-X-X-233-065
.320
–02
(9.91)
FW-XX-03-X-X-303-065
.390
*Processing conditions will affect mated height.
LEAD STYLE
FW
(1.27 mm x 1.27 mm)
.050" x .050" micro pitch
Surface
mount
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
D
STACKER
HEIGHT
POST
HEIGHT
OPTION
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Smaller stack heights
02 thru 50
= Gold flash on post,
Matte Tin on tail
–F
–L
–“XXX”
= Stacker
Height
(in inches)
= Post Height
(in inches)
(1.65 mm)
.065"
minimum
Example:
–065
= (1.65 mm)
.065"
–“XXX”
LEAD STACKER
STYLE HEIGHT
–03
–05
STACKER
HEIGHT
(5.46) (8.51) (7.11) (10.16)
.215 to .335
.280 to .400
(8.64) (15.49) (10.29) (17.15)
.340 to .610
.405 to .675
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
Example:
–250
= (6.35 mm)
.250"
= End Shroud
(–075 post height only.
Mate only with CLP)
(5.46 mm) .215" to
(15.49 mm) .610"
stacker height only
9 pins/row min.
= End Shroud
with Guide Post
(–075 post height only.
Mate only with CLP.)
(5.46 mm) .215"
to (15.49 mm) .610"
stacker height only)
9 pins/row min.
= Alignment Pin
(3 positions min.)
(5.46 mm) .215" to
(15.75 mm) .620"
stacker height only
= Pick & Place Pad
(5 positions min.)
= Tape & Reel
(Max overall height =
Post+Stacker Height+
Pad+Alignment Pin =
.700 (17.78))
–ES
02
No. of positions x
(1.27) .050
= 10 µ" (0.25 µm)
Gold on post,
Gold flash on tail
100
–G
–EP
(3.42)
.135
(1.27)
.050
01
(1.19)
.047
(1.27) .050
(0.41) .016 SQ
99
(4.76)
.188
POST HEIGHT
(1.65) .065
MIN
(4.27)
.168
(0.76)
.030
(3.45)
.136
x
(5.08)
.200
(4.06)
.160
–A
–ES
(3.05)
.120
(1.91)
.075
DIA
–P
(0.86)
.034
Notes:
For added mechanical stability,
Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–P
STACKER
HEIGHT
(2.51)
.099
(2.92)
.115
–TR
–EP
Due to technical progress, all designs, specifications and components are subject to change without notice.
(0.89)
.035
DIA
–A
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
usb host stack验收测试
usb host stack外包给了一家公司做,主要包括Audio class, Mass storage class, HID class driver。想请教如何进行验收,如何进行验收测试?...
280440616 嵌入式系统
请教关于lpIssueInterruptTransfer()函数的问题,高手来指导啊,谢谢!
readerExtension->hIntTransfer = (*(readerExtension->pUsbFuncs)->lpIssueInterruptTransfer) (readerExtension->hPipeInt, NULL, NULL, USB_IN_TRANSFER | USB_NO_WAIT, ......
bbs_cq 嵌入式系统
请问TMS570LC43开发板使用IAR环境进行调试如何设置?
已经下载好了IAR环境,新建了对应型号的项目,随便写了个小程序但是无法烧写进实验板,问题主要在于Options里面选择Debugger->Simluator是选择TI XDS吗?我选择TI XDS后仍然烧不进去,显示的是N ......
Yuanxin 微控制器 MCU
LED应用 - 用于LED驱动器过压保护的解决方案 & 驱动高电流LED
本帖最后由 dontium 于 2015-1-23 13:09 编辑 用于LED驱动器过压保护的解决方案 85394 驱动高电流LED 85395 TI实用资料,欢迎下载~~~:kiss: ...
德州仪器 模拟与混合信号
寻求KeiluVision2编译时错误时解决方法
我在使用KeiluVision2时,编译时出现Tool path not defined:bad or missing'C:\Documents and Settings\Administrator\桌面\新建文件佳\TOOLS.INT' ,(其中OOLS.INT文件和UV2文件夹在刚解压 ......
bbc664 嵌入式系统
高速PCB设计EMI规则探讨
46254...
静若幽兰 PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 285  2554  1276  783  1280  6  52  26  16  58 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved