IC HOT SWAP CONTRLR -48V 16-SSOP
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | SOIC |
| 包装说明 | SSOP, SSOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 4.8895 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 250 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电流 (Isup) | 2 mA |
| 最大供电电压 (Vsup) | 14.5 V |
| 最小供电电压 (Vsup) | 11.5 V |
| 标称供电电压 (Vsup) | 13 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3.899 mm |
| LTC4253ACGN#PBF | LTC4253IGN#TR | LTC4253CGN#TR | LTC4253IGN#TRPBF | LTC4253CGN#TRPBF | LTC4253IGN#PBF | LTC4253AIGN#PBF | LTC4253AIGN#TRPBF | LTC4253ACGN#TRPBF | LTC4253CGN#PBF | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC HOT SWAP CONTRLR -48V 16-SSOP | IC hot swap contrlr -48v 16-ssop | IC hot swap contrlr -48v 16-ssop | IC HOT SWAP CONTRLR -48V 16-SSOP | IC HOT SWAP CONTRLR -48V 16-SSOP | IC HOT SWAP CONTRLR -48V 16-SSOP | IC HOT SWAP CONTRLR -48V 16-SSOP | IC HOT SWAP CONTRLR -48V 16-SSOP | IC HOT SWAP CONTRLR -48V 16-SSOP | IC HOT SWAP CONTRLR -48V 16-SSOP |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | SOIC | SSOP | SSOP | SSOP | SSOP | SSOP | SOIC | SOIC | SOIC | SSOP |
| 包装说明 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | _compli | _compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e0 | e0 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.8895 mm | 4.8895 mm | 4.8895 mm | 4.8895 mm | 4.8895 mm | 4.8895 mm | 4.8895 mm | 4.8895 mm | 4.8895 mm | 4.8895 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | SSOP | SSOP | SSOP | SSOP | SSOP | SSOP | SSOP | SSOP |
| 封装等效代码 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 250 | 235 | 235 | 260 | 260 | 260 | 250 | 250 | 250 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电流 (Isup) | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| 最大供电电压 (Vsup) | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V |
| 最小供电电压 (Vsup) | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V |
| 标称供电电压 (Vsup) | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 20 | 20 | 30 | 30 | 30 | 40 | 40 | 40 | 30 |
| 宽度 | 3.899 mm | 3.899 mm | 3.899 mm | 3.899 mm | 3.899 mm | 3.899 mm | 3.899 mm | 3.899 mm | 3.899 mm | 3.899 mm |
| Brand Name | - | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | - | - | - | Linear Technology |
| 制造商包装代码 | - | GN | GN | GN | GN | GN | - | - | - | GN |
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