LDO 700 MA ULTRA-LOW NOI
NCP167AMX180TBG | NCP167AMX280TBG | NCP167AMX285TBG | NCP167AMX300TBG | NCP167AMX330TBG | NCP167AMX350TBG | NCP167BMX330TBG | |
---|---|---|---|---|---|---|---|
描述 | LDO 700 MA ULTRA-LOW NOI | LDO 700 MA ULTRA-LOW NOI | LDO 700 MA ULTRA-LOW NOI | LDO 700 MA ULTRA-LOW NOI | LDO 700 MA ULTRA-LOW NOI | LDO 700 MA ULTRA-LOW NOI | LDO 700 MA ULTRA-LOW NOI |
Brand Name | - | - | ON Semiconductor | ON Semiconductor | ON Semiconductor | - | ON Semiconductor |
是否无铅 | - | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 |
包装说明 | - | - | XDFN-4 | HVSON, SOLCC4,.04,25 | XDFN-4 | - | XDFN-4 |
制造商包装代码 | - | - | 711AJ | 711AJ | 711AJ | - | 711AJ |
Reach Compliance Code | - | - | compliant | compliant | compliant | - | compliant |
Factory Lead Time | - | - | 4 weeks | 4 weeks | 4 weeks | - | 5 weeks |
可调性 | - | - | FIXED | FIXED | FIXED | - | FIXED |
最大绝对输入电压 | - | - | 6 V | 6 V | 6 V | - | 6 V |
最大输入电压 | - | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
最小输入电压 | - | - | 3.85 V | 4 V | 4.3 V | - | 4.3 V |
JESD-30 代码 | - | - | S-XDSO-N4 | S-XDSO-N4 | S-XDSO-N4 | - | S-XDSO-N4 |
长度 | - | - | 1 mm | 1 mm | 1 mm | - | 1 mm |
湿度敏感等级 | - | - | 1 | 1 | 1 | - | 1 |
功能数量 | - | - | 1 | 1 | 1 | - | 1 |
输出次数 | - | - | 1 | 1 | 1 | - | 1 |
端子数量 | - | - | 4 | 4 | 4 | - | 4 |
工作温度TJ-Max | - | - | 125 °C | 125 °C | 125 °C | - | 125 °C |
工作温度TJ-Min | - | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
最大输出电流 1 | - | - | 0.7 A | 0.7 A | 0.7 A | - | 0.7 A |
最大输出电压 1 | - | - | 2.907 V | 3.06 V | 3.366 V | - | 3.366 V |
最小输出电压 1 | - | - | 2.793 V | 2.94 V | 3.234 V | - | 3.234 V |
标称输出电压 1 | - | - | 2.85 V | 3 V | 3.3 V | - | 3.3 V |
封装主体材料 | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | UNSPECIFIED |
封装代码 | - | - | HVSON | HVSON | HVSON | - | HVSON |
封装等效代码 | - | - | SOLCC4,.04,25 | SOLCC4,.04,25 | SOLCC4,.04,25 | - | SOLCC4,.04,25 |
封装形状 | - | - | SQUARE | SQUARE | SQUARE | - | SQUARE |
封装形式 | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
包装方法 | - | - | TR | TR | TR | - | TR |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
调节器类型 | - | - | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR | - | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR |
座面最大高度 | - | - | 0.43 mm | 0.43 mm | 0.43 mm | - | 0.43 mm |
表面贴装 | - | - | YES | YES | YES | - | YES |
端子面层 | - | - | Nickel/Gold/Palladium (Ni/Au/Pd) | Nickel/Gold/Palladium (Ni/Au/Pd) | Nickel/Gold/Palladium (Ni/Au/Pd) | - | Nickel/Gold/Palladium (Ni/Au/Pd) |
端子形式 | - | - | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD |
端子节距 | - | - | 0.65 mm | 0.65 mm | 0.65 mm | - | 0.65 mm |
端子位置 | - | - | DUAL | DUAL | DUAL | - | DUAL |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
最大电压容差 | - | - | 2% | 2% | 2% | - | 2% |
宽度 | - | - | 1 mm | 1 mm | 1 mm | - | 1 mm |
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