®
Technical Data Sheet
R562 Solder Paste
Water-Soluble
Product Description
Kester R562 is an organic acid, water-soluble solder paste specifically designed for resistance to environmental extremes.
Water-soluble pastes tend to dry out in low relative humidity and slump at high relative humidity. R562 will maintain its
print characteristics, tack and activity even after exposure to environmental extremes.
Performance Characteristics:
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■
■
■
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Reduces BGA voiding to <3%
Bright, shiny joints
12 hour stencil life
Print speeds up to 6 in/sec
Compatible with enclosed print head
systems
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Consistent printing over a range of
temperatures and humidity
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Capable of multiple reflow profiles
before a cleaning operation is
required
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Excellent solder-ability to a wide
variety of metallizations, including
Palladium
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Residues easily removed with hot DI
water within 8 hours as best practice
after processing
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Classified as ORH0 per J-STD-004
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Capable of off-pad printing with no
solderballs after reflow
dry out
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead
containing products at the user level.
Physical Properties
(Data given for Sn63Pb37, 90% metal,
-325+500 mesh)
Slump Test:
Pass
Viscosity (typical):
1750 poise
Malcom viscometer @ 10rpm and 25°C
Tested to J-STD-005, IPC-TM-650, Method
2.4.35
Wetting Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.452.4.45
Solder Ball Test:
Preferred
Initial Tackiness (typical):
48 grams
Tested to J-STD-005, IPC-TM-650, Method
2.4.44
Tested to J-STD-005, IPC-TM-650, Method
2.4.43
Reliability Properties
Copper Mirror Corrosion:
High
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Chloride and Bromides:
None
Detected
SIR, IPC (typical):
Pass
Blank
Day 1
Day 4
Day 7
3.2*10
10
Ω
1.2*10
10
Ω
1.3*10
10
Ω
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Corrosion Test:
Low
R562
3.4*10
8
Ω
1.9*10
9
Ω
4.1*10
9
Ω
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35.1
Silver Chromate:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.33
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
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Phone: +1 800.2.KESTER
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Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
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Phone: +65 6.449.1133
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Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
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Phone: +49 (0) 8142 4785 0
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Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
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Suzhou, Jiangsu Province, China 215200
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Phone: +86 512.82060807
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Fax: +86 512.8206 0808
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Website: www.kester.com
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Application Notes
Standard Applications:
Stencil Printing: 90% Metal
Enclosed Head Printing: 90% Metal
®
Availability
R562 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is recommended, but
different powder particle size distributions are available for standard and fine pitch applications. For specific packaging
information see Kester’s Solder Paste Packaging Chart for available sizes. The appropriate combination depends on pro-
cess variables and the specific application.
Printing Parameters
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
Stainless Steel or 80-90 Durometer Polyurethane or Stainless Steel
Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated or Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Kester Reflow Profile
Alloy: Sn63Pb37 or Sn62Pb36Ag02
240
220
200
180
Recommended Reflow Profile
The recommended reflow profile for R562 made with either the
Sn63Pb37 or Sn62Pb36Ag02 is shown here. This profile is simply
a guideline. Since R562 is a highly active solder paste, it can solder
effectively over a wide range of profiles. Your optimal profile may
be different from the one shown based on your oven, board and
mix of defects. Please contact Kester Technical Support if you need
additional profiling advice.
Peak Temp.
210-230 C
Temperature (C)
160
140
120
100
80
60
40
20
0
0
30
60
90
120
150
180
210
240
270
300
330
<1.8 C/Sec
(120 sec. max.)
30-60 sec. typical
Soaking Zone
(90 sec. max)
45-75 sec. typical
Reflow Zone
Time to Peak Temperature
3.5-5.0 min. typical
5.5 min max
Time (sec.)
Cleaning
R562 residues are best removed using automated cleaning equipment (in-line or batch) within 8 hours of solder reflow
as a best process practice. De-ionized water is recommended for the final rinse. Water temperatures should be 49-60°C
(120-140°F). If you have any questions, please contact Kester Technical Support.
Storage, Handling and Shelf Life
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow char-
acteristics and overall performance. R562 should be stabilized at room temperature prior to printing. R562 should be kept
at standard refrigeration conditions, 0-10°C (32-50°F). Please contact Kester Technical Support if you require additional
advice with regard storage and handling of this material. Shelf life is 6 months from date of manufacture when handled
properly and held at 0-10°C (32-50°F).
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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