®
R560
Water-Soluble Solder Paste
Product Description
Kester R560 is an organic acid, water-soluble
solder paste formula specifically designed to
reduce voiding in Ball Grid Array (BGA) solder
connections. The voiding in BGA's has been
shown to be reduced from 25% to less than 5%.
Kester R560 is also resistant to extremes in
temperature and relative humidity. Kester R560 is
designed to be slump resistant in high humidity
conditions. The solder paste exhibits long stencil
life and tack time, while still delivering exceptional
solderability to a wide variety of metallic substrates.
The activator package in this formula is very
aggressive, providing superior wetting to OSP
coated boards and Ag/Pd leaded components.
R560 is an extremely stable water soluble formula.
• Reduces BGA voiding to under 5%
• 8 hour stencil life
• Consistent printing over a range of tempera-
tures and humidities
• Wets excellently to Ag/Pd leaded components
• Reduces scrap due to less paste dry out
• Residues easily removed with hot DI water
• Classified as ORH0 per J-STD-004
• Compatible with enclosed printing systems
Physical Properties
(Data given for Sn63Pb37, 90% metal, -325+500 mesh)
Viscosity (typical):
1900 poise
Malcom viscometer @ 10rpm and 25°C
Initial Tackiness (typical):
45 grams
Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test:
Preferred
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45
Reliability Properties
Copper Mirror Corrosion:
High
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate:
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Standard Applications
90% Metal -- Stencil Printing
90% Metal -- Enclosed Head Printing
Chloride and Bromides:
None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank
Day 1
Day 4
Day 7
R560
2.76
×10
9
Ω
1.32
×10
9
Ω
1.22
×10
9
Ω
4.60
×
10
8
Ω
1.97
×
10
9
Ω
3.04
×
10
9
Ω
Application Notes
Availability:
R560
R560 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh is
recommended, but different powder particle size distributions are available for standard and fine pitch
applications. Kester R560 is compatible with enclosed print head systems. For specific packaging information
see Kester's Solder Paste Packaging Chart for available sizes. The appropriate combination depends on
process variables and the specific application.
Printing Parameters:
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80 to 90 durometer polyurethane or stainless steel
Capable to a maximum speed of 50 mm/sec (2 in/sec)
Stainless Steel, Molybdenum, Nickel Plated, Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Kester R560 Reflow Profile
Alloy: Sn63Pb37 or Sn62Pb36Ag02
240
220
200
180
Recommended Reflow Profile:
The recommended reflow profile for R560 made
with either the Sn63Pb37 or Sn62Pb36Ag02 is
shown here
.
This profile is simply a guideline.
Since R560 is a highly active, water-soluble solder
paste, it can solder effectively over a wide range of
profiles. Your optimal profile may be different from
the one shown based on your oven, board and mix
of defects. Please contact Kester if you need
additional profiling advice.
Peak Temp.
210 - 225 C
Temperature (C)
160
140
120
100
80
60
40
20
0
0
30
60
90
120
150
180
210
240
270
300
330
<2.5 C/Sec
Soaking Zone
(2.0 min.max.)
60-90 sec. typical
Reflow Zone
60-90 sec. typical
Time to Peak Temperature
3.5-5.0 min. typical
5.5 min max
Cleaning:
Time (sec.)
R560 residues are best removed using automated cleaning equipment (in-line or batch) within 24 hours of
soldering. De-ionized water is recommended for the final rinse. Water temperatures should be 49-60°C
(120-140°F). Kester's 5768 Bio-Kleen
®
saponifier can also be used in a 1-2% ratio for aqueous cleaning
systems.
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. R560 should be stabilized at room temperature prior to
printing. R560 should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact Kester
if you require additional advice with regard storage and handling of this material. Shelf life is 6 months from
date of manufacture when handled properly and held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment.
Read the Material Safety Data Sheet and warning label before using this product.
World Headquarters:
515 E. Touhy Avenue, Des Plaines, Illinois, 60018 USA
Phone:
(+1) 847-297-1600 •
Email:
customerservice@kester.com •
Website:
www.kester.com
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
customerservice@kester.com.sg
European Headquarters
Ganghoferstrasse 45
D-82216 Gernlinden
Germany
(+49) 8142-47850
customerservice@kester-eu.com
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
jpsales@kester.com.sg
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten-
tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
Rev: 10Sep04
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