®
Technical Data Sheet
NXG1 Solder Paste
Lead-Free, No-Clean
Product Description
Kester NXG1 a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres, and handle the
thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that
achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print
down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with
smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at
8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.
Performance Characteristics:
■
Excellent wetting to a variety of
metals
■
Capable of print speeds up to 25-
200 mm/sec (1-8 in/sec)
■
Low voiding behavior
■
Resistant to slump
■
Shelf life is 8 months
■
Excellent printing characteristics on
0.4mm (16 mil) pitch QFPs
■
Long stencil and tack life (process
dependent)
■
Excellent release from stencil
■
Capable of 120-minute break
times in printing
■
Clean cosmetic aesthetics after
reflow
■
Reflowable in air or nitrogen
Standard Applications:
For stencil printing: 88.5% metal for -3.05+500 mesh
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the
stated banned substances.
Physical Properties
Data given for SnAgCu, 88.5% metal, -325+500
mesh) Data representative for most SnAgCu
compositions
Initial Tackiness (typical):
46 grams
Tested to J-STD-005, IPC-TM-650, Method
2.4.44
Solder Ball Test:
Preferred
Wetting Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.43
Tested to J-STD-005, IPC-TM-650, Method
2.4.45
Viscosity (typical):
1850 poise
Malcom Viscometer @ 10rpm and 25°C
Slump Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.35
Reliability Properties
Copper Mirror Corrosion:
Low
Corrosion Test:
Low
Tested to J-STD-004A, IPC-TM-650, Method
2.3.32
Tested to J-STD-004B, IPC-TM-650, Method
2.6.15
Surface Insulation Resistivity (SIR):
Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.3
Chloride and Bromides:
None
Detected
Fluorides by Spot Test:
Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.3.28.1
Tested to J-STD-004B, IPC-TM-650, Method
2.3.35.1
Blank
Day 1
Day 4
Day 7
6.3*10 Ω
11
NXG1
2.0*10
9
Ω
3.5*10
9
Ω
3.5*10
9
Ω
3.1*10
11
Ω
3.3*10
11
Ω
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
NXG1 is available in SAC305 alloys with type 3 powder mesh size for standard and fine pitch applications. For specific
packaging information, see Kester’s Paste Packaging Chart for available sizes. The appropriate combination depends on
process variables and the specific application.
®
Printing Parameters
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
Stainless Steel or 80-90 Durometer Polyurethane
Capable to a maximum speed of 25-200 mm/sec (1-8 in/sec)
Stainless Steel, Molybdenum, Nickel Plated or Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Recommended Profile for NXG1
Temperature (C)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
50
100
150
200
250
Soak Zone = 150-227C for SAC0307, 150-217C for SAC305
Reflow Zone = >227C for SAC0307, >221C for SAC305
300
Time (sec.)
Pre-heat Zone
40 - 80 secs typical
Ramp Rate
<2.5C/sec
Soak Zone
60 - 120 secs typical
Reflow Zone
45 - 90 secs typical
Peak Temp (235-250°C)
Recommended Reflow Profile
The recommended reflow profile for NXG1 made with SnAgCu alloy
is shown here. This profile is simply a guideline. Since NXG1 is a
highly active solder paste, it can solder effectively over a wide range
of profiles. Your optimal profile may be different from the one shown
based on your oven, board and mix of defects. Please contact
Kester Technical Support if you need additional profiling advice.
Lead-Free Alloy (SnAgCu Alloys)
Total Profile Length: 3 - 5 mins
Cleaning
NXG1 is a no-clean formula. The residues do not need to be removed for typical applications. Although NXG1 is designed
for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a
variety of readily available cleaning agents. If residue removal is required, call Kester Technical Support.
Storage, Handling and Shelf Life
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow
characteristics and overall performance. NXG1 should be stabilized at room temperature prior to printing. NXG1 should be
kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact Kester if you require additional advice regard-
ing storage and handling of this material. Shelf life is 8 months from the date of manufacture when handled properly when
held at 0-10°C (32-50°F).
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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