®
Technical Data Sheet
NP505-HR Solder Paste
Product Description
High-Reliability, Zero-Halogen, Lead-Free, No-Clean
Kester NP505-HR is a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high-reliability ap-
plications. NP505-HR has been formulated to have reliable residues even in harsh damp cycling SIR testing. NP505-HR
can handle a wide variety of printer variables, including print speed and long idle times with a wide range of temperatures
and humidities. NP505-HR is fully capable of printing and reflowing 01005 components in air reflow with minimal graping
behavior. Post-soldering, the NP505-HR offers minimized defects, including head-in-pillow and QFN/BGA voiding. This
paste is zero-halogen, exceeding the IPC definition for halogen-free. NP505-HR is classified as ROL0 per IPC J-STD-
004B.
Performance Characteristics:
■
Zero-halogen (none intentionally
added)
■
Reliable residues in harsh modified
SIR testing with forced condensa-
tion points
■
Reflowable in air and nitrogen
■
Consistent print performance to
0.55AR
■
Low QFN/BGA voiding
■
Excellent solderability across wide
variety of profiles
■
Compatible with most conformal
coating materials
■
Stable paste properties, with
12 month shelf life
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863 for the
stated banned substances.
Physical Properties
Alloy:
Sn96.5Ag3Cu0.5 (SAC305)
Percent Metal:
88.5%
Powder:
Type 4
Viscosity (typical):
1750 poise
Malcom Viscometer @ 10 rpm and 25°C
Slump Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.35
Initial Tackiness (typical):
40 grams
Tested to J-STD-005, IPC-TM-650, Method
2.4.44
Solder Ball Test:
Preferred
Tested to J-STD-005, IPC-TM-650, Method
2.4.43
Reliability Properties
Copper Mirror Corrosion:
Low
Corrosion Test:
Low
Halogen Content:
None Detected
Tested to J-STD-004B, IPC-TM-650, Method
2.3.32
Tested to J-STD-004B, IPC-TM-650, Method
2.6.15
Tested to J-STD-004B, IPC-TM-650, Method
2.3.41 (ref. EN 14582)
Surface Insulation Resistivity (SIR):
Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
Test Conditions: 40°C, 90% RH, 7 days, 12.5V
Electrochemical Migration (ECM):
Pass
Bono Corrosion Test:
Pass;
Fc=1.1%
Tested to J-STD-004B, IPC-TM-650, Method
2.6.14.1
Test Conditions: 65°C, 85% RH, 25 days, 100V
Surface Insulation Resistivity (SIR):
Pass
Tested to J-STD-004A, IPC-TM-650, Method
2.6.3.3
Test Conditions: 85°C, 85% RH, 7 days, 100V
Test Conditions: 85°C, 85% RH, 15 days, 12V
Bellcore SIR, IPC:
Pass
All Readings >2.0x10
10
Ω
Tested to GR78 Core 13.1.3;
Test Conditions: 35°C, 85% RH, 4 days, 100V
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Standard Applications:
Stencil Printing: 88.5% Metal
®
Availability
NP505-HR is available in the SAC305 alloy with Type 3, 4 & 5 powder mesh. Type 4 mesh size is recommended for stan-
dard and fine pitch applications. NP505-HR is also compatible with other SAC alloys in similar melting range to the listed
alloys. For specific packaging information refer to Kester’s Solder Paste Packaging Chart for available sizes. The appro-
priate combination depends on process variables and the specific application.
Printing Parameters
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80-90 durometer stainless steel or polyurethane
Capable to a maximum speed of 25-150 mm/sec (1-6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated or Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Recommended Profile
Temperature
260
240
220
200
180
160
140
120
100
80
60
40
20
0
50
100
150
200
250
300
Time (sec.)
Pre-heat Zone
40-80 secs
Ramp Rate
<2.5C/sec
Soak Zone
60-120 secs typical
Reflow Zone
45-90 secs typical
Recommended Reflow Profile
The general recommended convection reflow profile for NP505-HR
formula made with SAC alloys is shown here as a starting point.
Your final profile will depend on your board mass and component
combination. NP505-HR has excellent solderability and wetting
capabilities in air or nitrogen reflow atmospheres reflow equipment.
Your optimal profile may be different from the basic graph. Please
contact Kester Technical Support if you need profiling advice.
(SAC Alloys)
Peak Temp (235-250°C)
Total Profile Length: 3-5 mins
Cleaning
NP505-HR is a no-clean formula. The residues do not need to be removed for typical applications. Although NP505-HR
is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or
batch) with a variety of readily available cleaning agents. If residue removal is required, call Kester Technical Support.
Storage, Handling and Shelf Life
Under refrigeration (0-10°C / 32-50°F), shelf life for NP505-HR T3 / T4 solder paste is 12 months from the date of manu-
facture, and T5 solder paste is 6 months from the date of manufacture. Refrigeration (0-10°C/ 32-50°F) is the recommend-
ed storage condition for optimal solder paste performance. NP505-HR can be stored up to 4 weeks at room temperature
conditions (< 25°C) and up to 7 days at elevated temperatures (<30°C) with minimal impact to overall product perfor-
mance. When refrigerated, NP505-HR should be stabilized at room temperature prior to use. Please contact Kester Tech-
nical Support if you require additional advice regarding storage and handling of this material.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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