®
Technical Data Sheet
EM907 Solder Paste
Lead-Free, No-Clean
Product Description
EM907 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements
of lead-free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely
resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an
effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch
(0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s). This solder paste also exceeds the reliability
standards required by J-STD-004.
Performance Characteristics:
■
Lead-free joints that closely
resemble those achieved with SnPb
solder paste
■
Excellent solderability to a wide
variety of surface metalizations,
including NiAu, ImSn and ImAg
Standard Applications:
88.5% Metal – Stencil Printing
■
High print speeds up to 150 mm/s
■
Capable of 60 minute break times in
printing
■
Stencil life: 12+ hours (process
dependent)
■
Excellent printing characteristics to
16 and 20 mils pitch
■
Excellent print and reflow
characteristics for 0201 applications
■
Stable tack life
■
Classified as ROL0 per J-STD-004
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863 for the
stated banned substances.
Physical Properties
Data given for Sn96.5Ag3.0Cu0.5, 88% metal,
-325+500 mesh)
Initial Tackiness (typical):
44 grams
Tested to J-STD-005, IPC-TM-650, Method
2.4.44
Solder Ball Test:
Preferred
Wetting Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.43
Tested to J-STD-005, IPC-TM-650, Method
2.4.45
Viscosity (typical):
1800 poise
Malcom Viscometer @ 10rpm and 25°C
Slump Test:
Pass
Tested to J-STD-005, IPC-TM-650, Method
2.4.35
Reliability Properties
Copper Mirror Corrosion:
Low
Corrosion Test:
Low
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Chloride and Bromides:
None
Detected
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Tested to J-STD-004, IPC-TM-650, Method
2.3.35.1
Surface Insulation Resistivity (SIR),
(typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Blank
Day 1 1.1*10 Ω
10
EM907
7.7*10
8
Ω
1.2*10
9
Ω
1.4*10
9
Ω
Silver Chromate:
Pass
Day 4 1.5*10
10
Ω
Day 7 1.4*10
10
Ω
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
®
EM907 is available in the Sn96.5Ag3.0Cu0.5 and Sn96.5Ag3.5 alloys. Type 3 powder mesh is normally recommended,
but type 4 is available for fine pitch applications. EM907 is also compatible with other SnAgCu alloys in a similar melting
range to the listed alloys. For specific packaging information, see Kester’s Paste Packaging Chart for available sizes. The
appropriate combination depends on process variables and the specific application.
Printing Parameters
Squeegee Blade
Squeegee Speed
Stencil Material
Temperature/Humidity
80-90 durometer stainless steel or polyurethane
Capable to a maximum speed of 150 mm/sec (6 in/sec)
Stainless Steel, Molybdenum, Nickel Plated or Brass
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Recommended Profile
Temperature
260
240
220
200
180
160
140
120
100
80
60
40
20
0
50
100
150
200
250
300
Time (sec.)
Pre-heat Zone
40-80 secs
Ramp Rate
<2.5C/sec
Soak Zone
60-120 secs typical
Reflow Zone
45-90 secs typical
Recommended Reflow Profile
Full convection reflow method is most commonly used to reflow
the EM907 formula. The recommended convection reflow profile
for EM907 made with either the Sn96.5Ag3.5 or SnAgCu alloys is
shown here.
(SAC Alloys)
Peak Temp (235-250°C)
Total Profile Length: 3-5 mins
Cleaning
EM907 is a no-clean formula. The residues do not need to be removed for typical applications. Although EM907 is
designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or
batch) with a variety of readily available cleaning agents. Call Kester Technical Support for details.
Storage and Shelf Life
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow
characteristics, and overall performance. EM907 should be stabilized at room temperature prior to printing. EM907 should
be kept at standard refrigeration temperatures, 0-10°C (32-50°F). Please contact Kester Technical Support if you require
additional advice with regard to storage and handling of this material. Shelf life is 4 months from date of manufacture and
held at 0-10°C (32-50°F).
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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