®
Technical Data Sheet
Lead-Free Solid Solder Wire
for High Reliability Soldering
Product Description
For soldering applications that require maximum reliability of solder joints, especially for surface mounted components,
through hole and final assembly, only solder of the highest purity is acceptable. Kester does not make any vague claims
of understanding solder purity. Only the highest quality metals are used to make Kester Solder Wire. Complete analysis of
Kester Solder Wire prove that every batch conforms to the strictest quality controls in the solder industry.
Maximum Allowed Impurities
Kester Solder Wire meets IPC Specifications J-STD-006C.
Element
Tin
Silver
Copper
Antimony
Gold
Aluminum
Cadmium
Zinc
Bismuth
Arsenic
Iron
Nickel
Indium
Lead
Sn
Ag
Cu
Sb
Au
Al
Zn
Bi
Bi
As
Fe
Ni
In
Pb
Symbol
0.250
0.100
0.080
0.200
0.050
0.005
0.002
0.003
0.100
0.030
0.020
0.010
0.100
0.050
ANSI/IPC J-STD-006C
For alloy composition, Copper (Cu) and Silver (Ag) content of the solder shall be maintained within + 0.20% of the nominal
alloy composition being used, when alloy component < 5.0%. Otherwise the allowable tolerance range is + 0.50%. The
balance of the solder shall be Tin and/or the items listed above.
Kester solder purchased directly or through stocking distributors will conform to these requirements. Only highest purity
virgin metals are used to make Kester Lead-Free Solder Wire. There is no requirement that antimony must be included
in solder. DOD-STD-2000-1A (Soldering Technology High Quality/High Reliability) states that it is the responsibility of the
manufacturer to select those materials and processes that will produce acceptable high quality/high reliability products.
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive. Additional RoHS information is
located at
https://www.kester.com/downloads/environmental.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
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Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
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Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
Application Notes
Availability
Alloy
Sn96.5Ag3.5
Sn96.5Ag3.0Cu0.5
Sn99.3Cu0.7
Sn100
K100LD
Sn97Ag3
Sn95Ag5
Sn96Ag4
221°C (430°F)
217-220°C (423-428°F)
227° (441°F)
232° (450°F)
226-230°C (438-446°F)
221-224°C (430-435°F)
221-245°C (430-473°F)
221-226°C (430-438°F)
Melting Point
®
Other lead-free alloy compositions may be available. Consult your local Kester Sales Representative.
Storage and Shelf Life
Solid solder wire has an indefinite working life when stored in a dry, non-corrosive environment between 10°C-40°C
(50-104°F). The DOE and storage conditions will represent the manufacturer’s warranty period or the time frame wherein
Kester will replace defective product.
Over time, the surface of wires may lose its shine and appear a dull shade of gray. This is a surface phenomenon and is
not detrimental to product functionality.
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143
■
Phone: +1 800.2.KESTER
■
Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941
■
Phone: +65 6.449.1133
■
Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany
■
Phone: +49 (0) 8142 4785 0
■
Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone
■
Suzhou, Jiangsu Province, China 215200
■
Phone: +86 512.82060807
■
Fax: +86 512.8206 0808
■
Website: www.kester.com
■
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