IC TRANSCVR NON-INVERT 6V 24SO
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SOIC |
包装说明 | SOP, |
针数 | 24 |
Reach Compliance Code | unknown |
其他特性 | WITH DIRECTION CONTROL |
系列 | HC/UH |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e4 |
长度 | 15.4 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 66 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.65 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.5 mm |
74HC646D,653 | 74HC646DB,118 | MCA1206-250.1%ATP137K9 | 74HC646N,652 | 74HCT646DB,118 | 74HCT646DB,112 | 74HC646D,652 | P-1005D2701JGWP | 74HCT646D,653 | 74HCT646N,652 | |
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描述 | IC TRANSCVR NON-INVERT 6V 24SO | IC TRANSCVR NON-INVERT 6V 24SSOP | RES,SMT,THIN FILM,37.9K OHMS,200WV,.1% +/-TOL,-25,25PPM TC,1206 CASE | IC TRANSCVR NON-INVERT 6V 24DIP | IC TXRX NON-INVERT 5.5V 24SSOP | IC TXRX NON-INVERT 5.5V 24SSOP | IC TRANSCVR NON-INVERT 6V 24SO | Fixed Resistor, Thin Film, 0.25W, 2700ohm, 100V, 5% +/-Tol, 15ppm/Cel, Surface Mount, 1005, CHIP | IC TRANSCVR NON-INVERT 5.5V 24SO | IC TXRX NON-INVERT 5.5V 24DIP |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | SOP, | SSOP, | SMT, 1206 | DIP, DIP24,.6 | SSOP, | SSOP, SSOP24,.3 | SOP, SOP24,.4 | SMT, 1005 | SOP, | DIP, DIP24,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | compliant | unknown | unknown |
其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | ANTI-SULFUR | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | ANTI-SULFUR, FLAME PROOF, NON-INDUCTIVE | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL |
JESD-609代码 | e4 | e4 | e3 | e3 | e4 | e4 | e4 | e4 | e4 | e3 |
端子数量 | 24 | 24 | 2 | 24 | 24 | 24 | 24 | 2 | 24 | 24 |
最高工作温度 | 125 °C | 125 °C | 155 °C | 125 °C | 125 °C | 125 °C | 125 °C | 155 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMT | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMT | SMALL OUTLINE | IN-LINE |
技术 | CMOS | CMOS | THIN FILM | CMOS | CMOS | CMOS | CMOS | THIN FILM | CMOS | CMOS |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | Tin (Sn) - with Nickel (Ni) barrier | TIN | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | Gold (Au) - with Nickel (Ni) barrier | NICKEL PALLADIUM GOLD | TIN |
Brand Name | NXP Semiconductor | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SOIC | SSOP | - | DIP | SSOP | SSOP | SOIC | - | SOIC | DIP |
针数 | 24 | 24 | - | 24 | 24 | 24 | 24 | - | 24 | 24 |
系列 | HC/UH | HC/UH | - | HC/UH | HCT | HCT | HC/UH | - | HCT | HCT |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | - | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - | R-PDSO-G24 | R-PDIP-T24 |
长度 | 15.4 mm | 8.2 mm | - | 31.7 mm | 8.2 mm | 8.2 mm | 15.4 mm | - | 15.4 mm | 31.7 mm |
负载电容(CL) | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | - | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | - | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
湿度敏感等级 | 1 | 1 | - | - | 1 | 1 | 1 | - | 1 | - |
位数 | 8 | 8 | - | 8 | 8 | 8 | 8 | - | 8 | 8 |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | - | 1 | 1 |
端口数量 | 2 | 2 | - | 2 | 2 | 2 | 2 | - | 2 | 2 |
输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | - | TRUE | TRUE | TRUE | TRUE | - | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SSOP | - | DIP | SSOP | SSOP | SOP | - | SOP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
峰值回流温度(摄氏度) | 260 | 260 | - | 260 | 260 | 260 | 260 | - | 260 | 260 |
传播延迟(tpd) | 66 ns | 66 ns | - | 66 ns | 66 ns | 66 ns | 66 ns | - | 66 ns | 66 ns |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 2.65 mm | 2 mm | - | 5.1 mm | 2 mm | 2 mm | 2.65 mm | - | 2.65 mm | 5.1 mm |
最大供电电压 (Vsup) | 6 V | 6 V | - | 6 V | 5.5 V | 5.5 V | 6 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | - | 2 V | 4.5 V | 4.5 V | 2 V | - | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
表面贴装 | YES | YES | - | NO | YES | YES | YES | YES | YES | NO |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | GULL WING | GULL WING | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | - | GULL WING | THROUGH-HOLE |
端子节距 | 1.27 mm | 0.65 mm | - | 2.54 mm | 0.65 mm | 0.65 mm | 1.27 mm | - | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | 30 | 30 | - | 30 | 30 |
宽度 | 7.5 mm | 5.3 mm | - | 15.24 mm | 5.3 mm | 5.3 mm | 7.5 mm | - | 7.5 mm | 15.24 mm |
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