TRANS PREBIAS NPN 250MW SMT3
参数名称 | 属性值 |
Brand Name | NXP Semiconductor |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | SMT |
包装说明 | SMALL OUTLINE, R-PDSO-G3 |
针数 | 3 |
制造商包装代码 | SOT346 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
其他特性 | BUILT-IN BIAS RESISTOR RATIO IS 1 |
最大集电极电流 (IC) | 0.1 A |
集电极-发射极最大电压 | 50 V |
配置 | SINGLE WITH BUILT-IN RESISTOR |
最小直流电流增益 (hFE) | 30 |
JEDEC-95代码 | TO-236 |
JESD-30 代码 | R-PDSO-G3 |
JESD-609代码 | e3 |
元件数量 | 1 |
端子数量 | 3 |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
极性/信道类型 | NPN |
认证状态 | Not Qualified |
表面贴装 | YES |
端子面层 | TIN |
端子形式 | GULL WING |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
PDTC143EK,115 | PDTC143ES,126 | PDTC143EEF,115 | PDTC143EK/T4 | PDTC143EK-T | |
---|---|---|---|---|---|
描述 | TRANS PREBIAS NPN 250MW SMT3 | TRANS PREBIAS NPN 500MW TO92-3 | TRANS PREBIAS NPN 250MW SC89 | TRANSISTOR 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236, PLASTIC, SC-59A, 3 PIN, BIP General Purpose Small Signal | TRANSISTOR 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236, PLASTIC, SC-59A, 3 PIN, BIP General Purpose Small Signal |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | SMT | TO-92 | SC-89 | SOT-23 | SOT-23 |
包装说明 | SMALL OUTLINE, R-PDSO-G3 | CHIP CARRIER, R-PBCC-N3 | SMALL OUTLINE, R-PDSO-F3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 |
针数 | 3 | 3 | 3 | 3 | 3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | BUILT-IN BIAS RESISTOR RATIO IS 1 | BUILT-IN BIAS RESISTOR RATIO IS 1 | BUILT-IN BIAS RESISTOR RATIO IS 1 | BUILT IN BIAS RESISTANCE RATIO IS 1 | BUILT IN BIAS RESISTANCE RATIO IS 1 |
最大集电极电流 (IC) | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
集电极-发射极最大电压 | 50 V | 50 V | 50 V | 50 V | 50 V |
配置 | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR |
最小直流电流增益 (hFE) | 30 | 30 | 30 | 30 | 30 |
JESD-30 代码 | R-PDSO-G3 | R-PBCC-N3 | R-PDSO-F3 | R-PDSO-G3 | R-PDSO-G3 |
元件数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 3 | 3 | 3 | 3 | 3 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
极性/信道类型 | NPN | NPN | NPN | NPN | NPN |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES |
端子形式 | GULL WING | NO LEAD | FLAT | GULL WING | GULL WING |
端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
JEDEC-95代码 | TO-236 | TO-92 | - | TO-236 | TO-236 |
JESD-609代码 | e3 | e3 | e3 | - | - |
端子面层 | TIN | TIN | TIN | - | - |
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