FUSES
/ SICHERUNGEN
Resettable fuses
Surface Mount
PTC-Fuses
Type PFMT
5,4 x 8,5 mm
High voltage surge
capabilities
Compliance to ITU
K.20/K.21 specifications
Packaged per EIA 486-B
Agency recognition:
UL, CSA, TÜV
Typical Time to Trip at 23 ˚C
20
10
PFMT.013.250.B.2
PFMT
PFMT.013.250.C.2
PFMT.013.250.2
PFMT.013.250.A.2
Time to trip
(s)
1
0.1
0.01
0.1
1
5
Fault current
(A)
50
75
100
Solder pad layouts
1.8
(.071)
1.8
(.071)
Dimensions
Side View
C
B
C
4.6
(.181)
9.7
(.382)
4.6
(.181)
End View /
Endansicht
D
A
E
End View /
Endansicht
Applications
Used as a secondary overcurent
protection device in:
• Customer Premise Equipment
(CPE)
• Central Office (CO)
• Subscriber Line Interface
Cards (SLIC)
Typical Part Marking
Layout may vary
Part identification
Manufacturer’s
Trademark
Resistance Bin
Date code week 1 of 2000 = 0A (year and week)
week 27 of 2000 = A0 (week and year)
Environmental Characteristics
Operating/Storage Temperature
/ Einsatz/Lagertemp.
Maximum Device Surface Temperature in Tripped State
/
Passive Aging
/ passive Alterung
Humidity Aging
/ Feuchtigkeitsalterung
Thermal Shock
/ Thermischer Schock
Solvent Resistance
/ Lösungsmittel-Beständigkeit
Lead Solerability
/ Lötbarkeit
Flammability
/ Entflammbarkeit
Vibration
-45 °C
to
+85 °C
125 °C
+85 °C, 1000
hours
/ Std.
+60 °C, 1000
hours
/ Std.
+85 °C, 85% R.H. 500
hours
/ Std.
MIL-STD-202F, Method 107G
+125 °C/–55 °C 10
times
/ Zyklen
MIL-STD-202, Method 215B
ANSI/J-STD-002
IEC 695-2-2
MIL-STD-883C, Method 2007.1,
Condition A
± 2%
typ. resist. change
± 3%
typ. resist. change
± 3%
typ. resist. change
±10%
typ. resist. change
±15%
typ. resist. change
No change
No Flame for 60 sec.
No change
Test Procedures And Requirements For Model PFMT Series
Test
/ Test
Test Conditions
/ Bedingungen
Visual/Mech.
/ visuell/mech.
Verify dimensions and materials
/ Kontrolle Abmess./Mat.
Resistance
/ Widerstand
In still air @ 23°C
/ bei ruhiger Luft 23 °C
Time to Trip
/ Trip-Zeit
At specified current, V
max
23 °C
/ Bei entspr. Strom
Hold Current
/ Haltestrom
30 min. at I
hold
/ bei Haltestrom
Trip Cycle Life
/ Trip-Zyklen
V
max
, I
max
, 100 cycles
/ Zyklen
Trip Endurance
/ Zeit im Tripzustand
V
max
, 48 hours
/ Stunden
Solderability
/ Lötbarkeit
MIL-STD-202F, Method 208F
/ Methode 208F
Accept/Reject Criteria
Per MF physical description
R
min
≤
R
≤
R
max
T
≤
max.
time to trip
(sec.)
No trip
/ Keine Auslösung
No arcing or burning
No arcing or burning
95% min. coverage
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19
FUSES
/ SICHERUNGEN
Resettable fuses
Electrical Characteristics
Type
/ Typ
Max. Oper.
Voltage
/
Max. Interrupt
Ratings
/
Hold Current
/
Initial Resistance
/
One Hour
Post-Trip
Restistance
/
PFMT
Nom. Power
Dissipation
Volts
Volts
max.
250
250
250
250
Amps
max.
3.0
3.0
3.0
3.0
PFMT.013.250.2
PFMT.013.250.A.2
PFMT.013.250.B.2
PFMT.013.250.C.2
60
60
60
60
Amps
at
/ bei
23 °C
I
h
0.13
0.13
0.13
0.13
Ohms
at
/ bei
23 °C
min.
6.5
6.5
9.0
7.0
Ohms
Ohms
at
/ bei
23 °C
at
/ bei
23 °C
max.
max.
12.0
20.0
9.0
20.0
12.0
20.0
10.0
20.0
Watts
at
650 V / 23 °C
3.3
3.3
3.3
3.3
Dimensions
Type
/ Typ
PFMT.013.250.2
PFMT.013.250.A.2
PFMT.013.250.B.2
PFMT.013.250.C.2
Packaged: Tape and reel: 2000 pcs. per reel
min.
8.5
(0.335)
8.5
(0.335)
8.5
(0.335)
8.5
(0.335)
A
max.
9.4
(0.370)
9.4
(0.370)
9.4
(0.370)
9.4
(0.370)
B
max.
3.4
(0.134)
3.4
(0.134)
3.4
(0.134)
3.4
(0.134)
C
max.
7.4
(0.291)
7.4
(0.291)
7.4
(0.291)
7.4
(0.291)
D
nom.
0.3
(0.011)
0.3
(0.011)
0.3
(0.011)
0.3
(0.011)
E
nom.
3.75
(0.148)
3.75
(0.148)
3.75
(0.148)
3.75
(0.148)
Dimensions in mm/inches
How To Order
PF
PTC-Fuse
Soldering Profile
/ Lötprofil
300
250
Temperature (° C) /
T
Maximum Package Body Temperature (220 °C)
MT .xxx .xxx .x .x
200
150
Melting Temperature of Solder (183 °C)
Style
MT = Surface Mount/
Telecom Component
10° to 20 C
per Second
Less than
120 °C per
Second
2 Minutes or More
100
50
Preheat
Hold Current, I
hold
013 (0.13 Amps)
Max. Interrupt Voltage, V
0
0
30
60
Flux Activation
Reflow
Cool
100
150
Time (Seconde)
(s)
200
250
Solder reflow
• Recommended reflow methods: I
R
,
vapor phase oven, hot air oven.
• Devices are not designed to be
wave soldered to the bottom side
of the board.
• Gluing the devices is not recom-
mended.
• Recommended maximum paste
thickness is 0,25 mm (.010 inch).
• Devices can be cleaned using
standard industry methods and
solvents.
Note:
• If reflow temperatures exceed the
recommended profile, devices
may not meet the performance
requirements.
Rework
• A device should not be reworked.
250 (250 V)
Resistance Sorted
Ω
A = 6.5-9Ω
B = 9-12Ω
C = 7-12Ω
Packaging Options
Packaged per EIA 486-B
2 =
Tape and reel
Thermal Derating Chart-I
hold
/I
trip
(Amps)
Type
/ Typ
PFMT.013.250.2
PFMT.013.250.A.2
PFMT.013.250.B.2
PFMT.013.250.C.2
Ambient Operating Temperature
–40 ˚C
–20 ˚C
0 ˚C
0.21/0.42
0.18/0.37
0.16/0.31
0.21/0.42
0.18/0.37
0.16/0.31
0.21/0.42
0.18/0.37
0.16/0.31
0.21/0.42
0.18/0.37
0.16/0.31
23 ˚C
0.13/0.26
0.13/0.26
0.13/0.26
0.13/0.26
40 ˚C
0.10/0.23
0.10/0.23
0.10/0.23
0.10/0.23
50 ˚C
0.09/0.18
0.09/0.18
0.09/0.18
0.09/0.18
60 ˚C
0.08/0.15
0.08/0.15
0.08/0.15
0.08/0.15
70 ˚C
0.07/0.12
0.07/0.12
0.07/0.12
0.07/0.12
85 ˚C
0.05/0.10
0.05/0.10
0.05/0.10
0.05/0.10
20
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