电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1.5KE300C

产品描述1500 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-201AE
产品类别分立半导体    二极管   
文件大小992KB,共6页
制造商Littelfuse
官网地址http://www.littelfuse.com
标准
下载文档 详细参数 全文预览

1.5KE300C概述

1500 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-201AE

1.5KE300C规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Littelfuse
包装说明HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-2
针数2
制造商包装代码CASE 8
Reach Compliance Code_compli
ECCN代码EAR99
其他特性EXCELLENT CLAMPING CAPABILITY
最大击穿电压315 V
最小击穿电压285 V
击穿电压标称值300 V
外壳连接ISOLATED
最大钳位电压430 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码DO-201
JESD-30 代码O-PALF-W2
JESD-609代码e3
湿度敏感等级2
最大非重复峰值反向功率耗散1500 W
元件数量1
端子数量2
最高工作温度175 °C
最低工作温度-55 °C
封装主体材料PLASTIC/EPOXY
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)260
极性BIDIRECTIONAL
最大功率耗散6.5 W
认证状态Not Qualified
最大重复峰值反向电压256 V
表面贴装NO
技术AVALANCHE
端子面层Matte Tin (Sn)
端子形式WIRE
端子位置AXIAL
处于峰值回流温度下的最长时间30

文档预览

下载PDF文档
Transient Voltage Suppression Diodes
Axial Leaded – 1500W > 1.5KE series
1.5KE Series
Description
Uni-directional
RoHS
Pb
e3
The 1.5KE Series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
Bi-directional
• 1500W peak pulse
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Glass passivated chip
junction in DO-201
Package
• Fast response time:
typically less than 1.0ps
from 0 Volts to BV min
• Excellent clamping
capability
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• Low incremental surge
resistance
• Typical I
R
less than 1μA
when V
BR
min>12V
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
/ 0.375”
,(9.5mm) lead
length, 5 lbs., (2.3kg)
tension
• V
BR
@ T
J
= V
BR
@25°C
x (1+
α
T x (T
J
- 25))
(
α
T:Temperature
Coefficient, typical value
is 0.1%)
• Plastic package is
flammability rated V-0 per
Underwriters Laboratories
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
609A.01)
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter
Peak Pulse Power Dissipation by
10/1000μs Test Waveform (Fig.2)
(Note 1), (Note 4)
Steady State Power Dissipation on
Infinite Heat Sink at T
L
=75ºC
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave Unidirectional
Only (Note 2)
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only (Note 3)
Operating Junction and Storage
Temperature Range
Typical Thermal Resistance
Junction to Lead
Typical Thermal Resistance
Junction to Ambient
Symbol
P
PPM
P
D
I
FSM
V
F
T
J
, T
STG
R
θJL
R
θJA
Value
1500
6.5
200
3.5/5.0
-55 to 175
15
75
Unit
W
W
A
V
°C
°C/W
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above T
J
(initial) =25
O
C per Fig. 3.
2. Measured on 8.3ms single half sine wave or equivalent square wave, duty cycle=4 per
minute maximum.
3. V
F
< 3.5V for single die parts and V
F
< 5.0V for stacked-die parts.
4. The P
PPM
of stacked-die parts is 2kW and please contact littelfuse for the detail
stacked-die parts.
Applications
TVS devices are ideal for the protection of I/O interfaces,
V
CC
bus and other vulnerable circuits used in telecom,
computer, industrial and consumer electronic applications.
Additional Infomarion
Functional Diagram
Bi-directional
Datasheet
Resources
Samples
Cathode
Uni-directional
Anode
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
电池充电管理设计参考技术资料!
350151350152代表:TP4054,TP4056 ...
kairu1i3 电源技术
电机控制的单片机库
急需可以做电机控制的单片机库???????...
wxj199999 NXP MCU
flow跟reflow是一个东西吗?
flow跟reflow是一个东西吗? 怎么标准不一样呢?另外PCB设计的时候元器件两个焊盘中间可以走线吗,走线的话有哪些不利的影响?还要电源线的走线宽度同一条线宽度能不同吗? ...
小太阳yy PCB设计
[转]常见射频同轴连接器大全
常见同轴连接器通用常识http://mmbiz.qpic.cn/mmbiz/rnZ1Zc6paJd9zXezJEzCcKaCntkawmdwcq5eibbB3yX2XZsJhjqaDRySkpvYIWtyGhwQN8HCIiaJcqy1NtiaOpoJA/0 同轴连接器用于传输射频信号,其传输频率 ......
dontium 无线连接
简单的C语言问题,看看谁的回答既简洁又准确
---------------------------------------------------- 程序中有一条语句如下: ch=0; 其中ch; 为一个unsigned char 数组, ths: 为一个unsigned char 格式数据. 如果ths等于1, 则ths-2 ......
polluxzy 微控制器 MCU
基于定点DSP的软件锁相环的设计和实现
低轨小卫星通信是近年来卫星通信应用中一个方兴未艾的重要领域,“创新一号”小卫星是我国研制的具有完全自主知识产权的存储与转发通信小卫星,cascom手持终端是专门为这颗小卫星研制的低功耗地面 ......
maker DSP 与 ARM 处理器

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2004  776  749  538  1775  41  16  11  36  47 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved