CTLTVS12
SURFACE MOUNT SILICON
UNI-DIRECTIONAL
TRANSIENT VOLTAGE SUPPRESSOR
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DESCRIPTION:
The CENTRAL SEMICONDUCTOR CTLTVS12 is a
low leakage, fast response TVS packaged in an ultra
small, ultra low profile surface mount package. This
device is designed to protect sensitive equipment
against ESD damage.
MARKING CODE: O
TLM2D3D6 CASE
APPLICATIONS:
•
PDAs
•
Memory Card Ports
• Cellular Phones
• Instrumentation
FEATURES:
•
Ultra Small, Ultra Low Profile 0.3mm x 0.6mm x 0.3mm
Leadless Surface Mount package
•
Low Capacitance
•
Low Leakage Current
MAXIMUM RATINGS:
(TA=25°C)
Peak Power Dissipation (8x20μs)
Electrical Fast Transient (IEC 61000-4-4) (5x50ns)
ESD Voltage (IEC 61000-4-2, Air)
ESD Voltage (IEC 61000-4-2, Contact)
Operating and Storage Junction Temperature
SYMBOL
PPK
EFT
VESD
VESD
TJ, Tstg
35
40
30
30
-55 to +150
UNITS
W
A
kV
kV
°C
ELECTRICAL CHARACTERISTICS:
(TA=25°C) VF=1.0V MAX @ IF=10mA
Maximum
Reverse
Stand-off
Voltage
VRWM
V
9.0
Breakdown
Voltage
VBR @ IT
MIN NOM MAX
V
V
V
10
12
14
Test
Current
IT
mA
Maximum
Reverse
Leakage
Current
IR @ VRWM
Maximum
Clamping
Voltage
(8x20μs)
VC @ IPP
V
A
Typical
Typical
Typical
Typical
TLP Clamping Dynamic
Junction
Junction
Voltage
Resistance Capacitance Capacitance
(Note 1)
(Note 1)
@ 0V Bias @ 9V Bias
VCL @ IPP
RDYN
CJ
CJ
V
6.0
5.0
1.0
18
1.8
11
Note 1: Transmission Line Pulse (TLP) conditions: Z0=50Ω, tp=100ns
μA
A
6.0
Ω
pF
pF
0.71
13
14
5.0
R3 (23-October 2015)
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1.
2.
If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s
LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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