电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

NC7SV74L8X

产品描述IC FF D-TYPE SNGL 1BIT 8MICROPAK
产品类别逻辑    逻辑   
文件大小540KB,共13页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 选型对比 全文预览

NC7SV74L8X在线购买

供应商 器件名称 价格 最低购买 库存  
NC7SV74L8X - - 点击查看 点击购买

NC7SV74L8X概述

IC FF D-TYPE SNGL 1BIT 8MICROPAK

NC7SV74L8X规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
厂商名称ON Semiconductor(安森美)
包装说明VQCCN, LCC8,.06SQ,20
制造商包装代码523AY
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time1 week
系列AUP/ULP/V
JESD-30 代码S-XQCC-N8
JESD-609代码e4
长度1.6 mm
负载电容(CL)30 pF
逻辑集成电路类型D FLIP-FLOP
最大频率@ Nom-Sup150000000 Hz
最大I(ol)0.002 A
湿度敏感等级1
位数1
功能数量1
端子数量8
最高工作温度85 °C
最低工作温度-40 °C
输出极性COMPLEMENTARY
封装主体材料UNSPECIFIED
封装代码VQCCN
封装等效代码LCC8,.06SQ,20
封装形状SQUARE
封装形式CHIP CARRIER, VERY THIN PROFILE
包装方法TAPE AND REEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源1.2/3.3 V
传播延迟(tpd)9.9 ns
认证状态Not Qualified
座面最大高度0.55 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)0.9 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式NO LEAD
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
触发器类型POSITIVE EDGE
宽度1.6 mm
最小 fmax250 MHz

文档预览

下载PDF文档
Is Now Part of
To learn more about ON Semiconductor, please visit our website at
www.onsemi.com
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor
product management systems do not have the ability to manage part nomenclature that utilizes an underscore
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated
device numbers. The most current and up-to-date ordering information can be found at
www.onsemi.com.
Please
email any questions regarding the system integration to
Fairchild_questions@onsemi.com.
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

NC7SV74L8X相似产品对比

NC7SV74L8X NC7SV74K8X
描述 IC FF D-TYPE SNGL 1BIT 8MICROPAK Flip Flops D-Type Flip-Flop
Brand Name ON Semiconductor ON Semiconductor
是否无铅 不含铅 不含铅
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美)
包装说明 VQCCN, LCC8,.06SQ,20 VSSOP, TSSOP8,.12,20
制造商包装代码 523AY 846AN
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
Factory Lead Time 1 week 22 weeks
系列 AUP/ULP/V AUP/ULP/V
JESD-30 代码 S-XQCC-N8 R-PDSO-G8
JESD-609代码 e4 e3
长度 1.6 mm 2.3 mm
负载电容(CL) 30 pF 30 pF
逻辑集成电路类型 D FLIP-FLOP D FLIP-FLOP
最大频率@ Nom-Sup 150000000 Hz 150000000 Hz
最大I(ol) 0.002 A 0.002 A
湿度敏感等级 1 1
位数 1 1
功能数量 1 1
端子数量 8 8
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
输出极性 COMPLEMENTARY COMPLEMENTARY
封装主体材料 UNSPECIFIED PLASTIC/EPOXY
封装代码 VQCCN VSSOP
封装等效代码 LCC8,.06SQ,20 TSSOP8,.12,20
封装形状 SQUARE RECTANGULAR
封装形式 CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法 TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 1.2/3.3 V 1.2/3.3 V
传播延迟(tpd) 9.9 ns 9.9 ns
认证状态 Not Qualified Not Qualified
座面最大高度 0.55 mm 0.9 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 0.9 V 0.9 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn)
端子形式 NO LEAD GULL WING
端子节距 0.5 mm 0.5 mm
端子位置 QUAD DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
触发器类型 POSITIVE EDGE POSITIVE EDGE
宽度 1.6 mm 2 mm
最小 fmax 250 MHz 250 MHz
測試零點切換
想請問各位高手 如何使用示波器量測AC Source 及 relay的零點切換點 可以講詳細一點嗎謝謝 ...
apl500 测试/测量
单片机之间都有哪些方式进行通讯呢?
我现在用的是51系列单片机和PIC系列单片机之间的通讯。希望大侠们都说说呀。非常感谢!...
jgj 嵌入式系统
【EEworld DIY】制作书写机器人【已完成】
本帖最后由 cardin6 于 2017-12-18 16:00 编辑 快要年底了 总要做点什么出来给自己的2017写个结尾 想到过年又是要写一大堆的信件 心里就会有一万只羊驼奔腾。。。 直接打印未尝不可 ......
cardin6 机器人开发
融周刊2009年12期
以前有人发过,后来断了,现在开始接着发 《融周刊》2009年第12期人物 ·“贫民窟”里的亿万富翁 业界 ·创业板的基因 ·“中国化创业板”十大焦点话题 投 ......
sunxin2118 聊聊、笑笑、闹闹
一路寻找 - 从工程师到风险投资人
一路寻找 - 从工程师到风险投资人 正文(18)一万五千元的MBA课程 (联发科 外一篇) 我相信做半导体的行业的工程师,50%以上的人都有以后去开一家小餐馆的理想,我也有,我和大多数人的不同之 ......
qinkaiabc 工作这点儿事
高速嵌入式硬件设计讲义
250794250795250796 高速嵌入式硬件设计讲义 ...
qwqwqw2088 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2855  1327  2179  2608  1793  33  8  25  14  34 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved