PRODUCT SPECIFICATION
NANO-FIT
Receptacle
TM
WIRE-TO BOARD
CONNECTOR SYSTEM
Dual row
Housing
105308
Single row
105307
Terminal
105300
REVISION:
ECR/ECN INFORMATION:
EC No:
DATE:
TITLE:
C
117887
2017/06/08
PRODUCT SPECIFICATION FOR
NANO-FIT
TM
& WIRE TO BOARD
POWER CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
1
of
13
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-105300-100
Dixon Li
Anson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1). DOC
PRODUCT SPECIFICATION
TPA
105325
Header
Vertical
Solder clip
Kinked pins
Right angle
Dual row
105312
105310
105314
Single row
105311
105309
105313
REVISION:
ECR/ECN INFORMATION:
EC No:
DATE:
TITLE:
C
117887
2017/06/08
PRODUCT SPECIFICATION FOR
NANO-FIT
TM
& WIRE TO BOARD
POWER CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
2
of
13
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-105300-100
Dixon Li
Anson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1). DOC
PRODUCT SPECIFICATION
Table of Contents
1.0 SCOPE
---------------------------------------------------------------------------------------------------
4
2.0 PRODUCT DESCRIPTION ----------------------------------------------------------------------------
4
2.1 Product Name and Series Numbers
2.2 Dimensions, Materials, Platings and Markings
2.3 Safety Agency Approvals
2.4 TPA function
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS ---------------------------------------
5
3.1 Molex Documents
3.2 Industry Documents
4.0 ELECTRICAL PERFORMANCE RATINGS -----------------------------------------------------
5
4.1 Voltage
4.2 Applicable Wires
4.3 Maximum Current Rate
4.4 Temperature
4.5 Durability
5.0 QUALIFICATION --------------------------------------------------------------------------------------
7
6.0 PERFORMANCE ---------------------------------------------------------------------------------------
7
6.1 Electrical Performance
6.2 Mechanical Performance
6.3 Environment Performance
7.0 TEST SEQUENCE GROUPS -----------------------------------------------------------------------
1
1
8.0 SOLDER INFORMATION ----------------------------------------------------------------------------
1
2
8.1 Solder Process Temperature
8.2 Reflow Solder Profile
REVISION:
ECR/ECN INFORMATION:
EC No:
DATE:
TITLE:
C
117887
2017/06/08
PRODUCT SPECIFICATION FOR
NANO-FIT
TM
& WIRE TO BOARD
POWER CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
3
of
13
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-105300-100
Dixon Li
Anson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1). DOC
PRODUCT SPECIFICATION
1.0 SCOPE
This Product Specification covers the mechanical, electrical and environmental performances
requirements and test methods of Nano-fit 2.50 mm pitch wire to board power connector series
products, through hole type, terminated with 20, 22, 24 and 26 AWG stranded wire using crimp
technology with tin or gold plating.
2.0 PRODUCT DESCRIPTION
2.1 product name and series number
Product name & Series number
Description
Receptacle
Housing of receptacle single row
Housing of receptacle dual row
Crimp terminal of receptacle
TPA of receptacle
Header
Vertical single row, kinked pin
Vertical single row with solder clip
Vertical dual row, kinked pin
Vertical dual row with solder clip
Right angle single row
Right angle dual row
2.2 Dimensions, materials, platings and markings
Dimensions & Platings: See individual sales drawings.
Material: RoHS compliant materials.
2.3 Safety agency approvals
a) UL-1977 recognition file number: E29179.
b) CSA approval file number: LR 19980
c) VDE Glow Wire approval file number: 569200-9020-0023/236653
WIRE TO BOARD:
Series Number
105307
105308
105300
105325
105309
105311
105310
105312
105313
105314
CSA
4 Amps @ 250V ( 20-26 AWG WIRE)
REVISION:
ECR/ECN INFORMATION:
EC No:
DATE:
TITLE:
Per UL
4 Amps at 250V (20-26 AWG WIRE)
C
117887
2017/06/08
PRODUCT SPECIFICATION FOR
NANO-FIT
TM
& WIRE TO BOARD
POWER CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
4
of
13
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-105300-100
Dixon Li
Anson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1). DOC
PRODUCT SPECIFICATION
2.4 TPA function
a) Make sure crimp terminal is properly seated.
b) Increase crimp terminal retention force to receptacle, the spec is defined in section 6.2.2 and
6.2.3.
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
3.1 Molex documents
See series specific sales drawings and the other sections of this specifications for the necessary
referenced documents
and specifications.
Nano-fit test summary.
Molex solderability specification SMES-152.
Molex heat resistance specification ES-40000-5013.
3.2 Industrial documents
EIA-364-1000.01
UL-60950-1
CAS STD: C22.2 No. 182.3-M1987.
IEC 60695-2-11, IEC 60335-1.
4.0 ELECTRICAL PERFORMANCE RATINGS
4.1
VOLTAGE *
250 Volts AC (RMS).
* This connector voltage rating meets the connector level provided by the safety agency.
REVISION:
ECR/ECN INFORMATION:
EC No:
DATE:
TITLE:
C
117887
2017/06/08
PRODUCT SPECIFICATION FOR
NANO-FIT
TM
& WIRE TO BOARD
POWER CONNECTOR SYSTEM
CHECKED BY:
SHEET No.
5
of
13
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-105300-100
Dixon Li
Anson Yin
Anson Yin
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1). DOC
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