IC USB POWER MANAGER 20-QFN
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 20 |
| 制造商包装代码 | UD |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | BATTERY CHARGE CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 5.5 V |
| 最小输入电压 | 2.7 V |
| 标称输入电压 | 3.8 V |
| JESD-30 代码 | S-PQCC-N20 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 0.6 A |
| 标称输出电压 | 4.2 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 表面贴装 | YES |
| 切换器配置 | BUCK |
| 最大切换频率 | 2590 kHz |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.4 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| LTC3554EUD-2#TRPBF | LTC3554EUD-3#PBF | LTC3554EUD-2#PBF | LTC3554EUD#PBF | LTC3554EUD-1#PBF | LTC3554EUD#TRPBF | LTC3554EUD-1#TRPBF | LTC3554EUD-3#TRPBF | LTC3554EPD#PBF | LTC3554EPD#TRPBF | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC USB POWER MANAGER 20-QFN | IC USB POWER MANAGER 20-QFN | IC USB POWER MANAGER 20-QFN | IC USB POWER MANAGER 20UTQFN | IC USB POWER MANAGER 20QFN | IC USB POWER MANAGER 20UTQFN | IC USB POWER MANAGER 20QFN | IC USB POWER MANAGER 20-QFN | IC USB POWER MANAGER 20-UTQFN | IC USB POWER MANAGER 20-UTQFN |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | - | 符合 | - | - | 符合 | 符合 |
| 零件包装代码 | QFN | - | QFN | QFN | - | QFN | - | - | QFN | QFN |
| 包装说明 | HVQCCN, | - | HVQCCN, | HVQCCN, | - | HVQCCN, | - | - | 3 X 3 MM, LEAD FREE, PLASTIC, UTQFN-20 | 3 X 3 MM, LEAD FREE, PLASTIC, UTQFN-20 |
| 针数 | 20 | - | 20 | 20 | - | 20 | - | - | 20 | 20 |
| Reach Compliance Code | compliant | - | compliant | compliant | - | compliant | - | - | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | - | EAR99 | - | - | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | BATTERY CHARGE CONTROLLER | - | BATTERY CHARGE CONTROLLER | BATTERY CHARGE CONTROLLER | - | BATTERY CHARGE CONTROLLER | - | - | BATTERY CHARGE CONTROLLER | BATTERY CHARGE CONTROLLER |
| 控制模式 | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE | - | CURRENT-MODE | - | - | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | - | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | 5.5 V | - | 5.5 V | 5.5 V | - | 5.5 V | - | - | 5.5 V | 5.5 V |
| 最小输入电压 | 2.7 V | - | 2.7 V | 2.7 V | - | 2.7 V | - | - | 2.7 V | 2.7 V |
| 标称输入电压 | 3.8 V | - | 3.8 V | 3.8 V | - | 3.8 V | - | - | 3.8 V | 3.8 V |
| JESD-30 代码 | S-PQCC-N20 | - | S-PQCC-N20 | S-PQCC-N20 | - | S-PQCC-N20 | - | - | S-PQCC-N20 | S-PQCC-N20 |
| JESD-609代码 | e3 | - | e3 | e3 | - | e3 | - | - | e3 | e3 |
| 长度 | 3 mm | - | 3 mm | 3 mm | - | 3 mm | - | - | 3 mm | 3 mm |
| 功能数量 | 1 | - | 1 | 1 | - | 1 | - | - | 1 | 1 |
| 端子数量 | 20 | - | 20 | 20 | - | 20 | - | - | 20 | 20 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | - | 85 °C | - | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C |
| 最大输出电流 | 0.6 A | - | 0.6 A | 0.6 A | - | 0.6 A | - | - | 0.6 A | 0.6 A |
| 标称输出电压 | 4.2 V | - | 4.2 V | 4.2 V | - | 4.2 V | - | - | 4.2 V | 4.2 V |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | HVQCCN | HVQCCN | - | HVQCCN | - | - | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | - | SQUARE | - | - | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | - | 250 | 250 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | - | - | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | - | 0.8 mm | 0.8 mm | - | 0.8 mm | - | - | 0.6 mm | 0.6 mm |
| 表面贴装 | YES | - | YES | YES | - | YES | - | - | YES | YES |
| 切换器配置 | BUCK | - | BUCK | BUCK | - | BUCK | - | - | BUCK | BUCK |
| 最大切换频率 | 2590 kHz | - | 2590 kHz | 2590 kHz | - | 2590 kHz | - | - | 2590 kHz | 2590 kHz |
| 技术 | CMOS | - | CMOS | CMOS | - | CMOS | - | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | - | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | NO LEAD | - | NO LEAD | NO LEAD | - | NO LEAD | - | - | NO LEAD | NO LEAD |
| 端子节距 | 0.4 mm | - | 0.4 mm | 0.4 mm | - | 0.4 mm | - | - | 0.4 mm | 0.4 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | - | QUAD | - | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | - | 3 mm | 3 mm | - | 3 mm | - | - | 3 mm | 3 mm |
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