R-S Latch, 4-Func, 1-Bit, CMOS, CDIP16,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | RCA |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Is Samacsys | N |
JESD-30 代码 | R-XDIP-T16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | R-S LATCH |
位数 | 1 |
功能数量 | 4 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5/15 V |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
CD4043BF | CD4044BF | CD4043BE | CD4044BE | CD4044BH | CD4043BD | CD4043BK | CD4044BD | CD4043BH | |
---|---|---|---|---|---|---|---|---|---|
描述 | R-S Latch, 4-Func, 1-Bit, CMOS, CDIP16, | R-S Latch, 4-Func, 1-Bit, CMOS, CDIP16, | R-S Latch, 4-Func, 1-Bit, CMOS, PDIP16, | R-S Latch, 4-Func, 1-Bit, CMOS, PDIP16, | R-S Latch, 4-Func, 1-Bit, CMOS, | R-S Latch, 4-Func, 1-Bit, CMOS, CDIP16, | R-S Latch, 4-Func, 1-Bit, CMOS, CDFP16, | R-S Latch, 4-Func, 1-Bit, CMOS, CDIP16, | R-S Latch, 4-Func, 1-Bit, CMOS, |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | , DIE OR CHIP | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | , DIE OR CHIP |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
逻辑集成电路类型 | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH | R-S LATCH |
位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIE OR CHIP | DIP16,.3 | FL16,.3 | DIP16,.3 | DIE OR CHIP |
电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
厂商名称 | RCA | - | - | RCA | RCA | RCA | RCA | RCA | RCA |
JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | - | R-XDIP-T16 | R-XDFP-F16 | R-XDIP-T16 | - |
JESD-609代码 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | - |
端子数量 | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 | - |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC | CERAMIC | CERAMIC | - |
封装代码 | DIP | DIP | DIP | DIP | - | DIP | DFP | DIP | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE | FLATPACK | IN-LINE | - |
表面贴装 | NO | NO | NO | NO | - | NO | YES | NO | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | FLAT | THROUGH-HOLE | - |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | - |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved