Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 包装说明 | QSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| 系列 | FCT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 4.9 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.048 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 5.8 ns |
| 传播延迟（tpd） | 4.7 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9116 mm |
| Base Number Matches | 1 |
| IDT74FCT151CTQ | IDT74FCT151ATQ | IDT74FCT151ATQ8 | IDT74FCT151ATSO8 | IDT74FCT151CTSO8 | IDT74FCT151CTQ8 | IDT74FCT151TQ | |
|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, SOIC-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, SOIC-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | QSOP-16 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | SOP, SOP16,.4 | SOIC-16 | QSOP-16 | QSOP-16 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | 10.3632 mm | 10.3632 mm | 4.9 mm | 4.9 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | SSOP | SOP | SOP | SSOP | SSOP |
| 封装等效代码 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | SOP16,.4 | SOP16,.4 | SSOP16,.25 | SSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 5.8 ns | 6.8 ns | 6.8 ns | 6.8 ns | 5.8 ns | 5.8 ns | 10.5 ns |
| 传播延迟（tpd） | 4.7 ns | 5.5 ns | 5.5 ns | 5.5 ns | 4.7 ns | 4.7 ns | 7.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 2.649 mm | 2.649 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9116 mm | 3.9116 mm | 3.9116 mm | 7.5082 mm | 7.5082 mm | 3.9116 mm | 3.9116 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| Is Samacsys | N | - | - | - | N | N | N |
| 峰值回流温度（摄氏度） | 225 | 225 | NOT SPECIFIED | 225 | 225 | 225 | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | - |
| 包装方法 | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | - |
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