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SMBG5933C/TR13

产品描述DIODE ZENER 22V 2W SMBG
产品类别半导体    分立半导体   
文件大小387KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

SMBG5933C/TR13概述

DIODE ZENER 22V 2W SMBG

SMBG5933C/TR13规格参数

参数名称属性值
电压 - 齐纳(标称值)(Vz)22V
容差±2%
功率 - 最大值2W
阻抗(最大值)(Zzt)17.5 Ohms
不同 Vr 时的电流 - 反向漏电流1µA @ 16.7V
不同 If 时的电压 - 正向(Vf1.2V @ 200mA
工作温度-65°C ~ 150°C
安装类型表面贴装
封装/外壳DO-215AA,SMB 鸥翼
供应商器件封装SMBG(DO-215AA)

文档预览

下载PDF文档
SMBG5913 – SMBG5956e3,
SMBJ5913 – SMBJ5956e3
Available
Silicon 2.0 Watt Zener Diodes
DESCRIPTION
The SMB(G/J)5913B – SMB(G/J)5956B series of surface mount 2.0 watt Zener diodes
provides a selection from 3.3 to 200 volts with tolerance options of 10%, 5% and 2%. This
series has the same electrical characteristics as the axial, JEDEC registered 1N5913 -
1N5956 series with the exception of its higher, 2.0 W power rating (versus 1.5 W for the
JEDEC series). This is permitted by the lower thermal resistance of the surface mount
packaging. The SMBG Gull-wing design in the DO-215AA package provides for visible solder
connections. The SMBJ J-bend design in the DO-214AA package permits greater PC board
mounting density. The series is available with SnPb plated leaded or RoHS compliant matte-
tin plating.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-215AA
Gull-wing Package
FEATURES
Surface mount equivalent to JEDEC registered 1N5913 thru 1N5956 number series but with a 30%
higher power rating.
Ideal for high-density and low-profile mounting.
Zener voltage available 3.3 V to 200 V.
Standard voltage tolerances are plus/minus 10%, 5% and 2%.
RoHS compliant versions available.
DO-214AA
J-bend Package
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Withstands high surge stresses (see
figure 2).
Minimal changes of voltage versus current.
High specified maximum current (I
ZM
) when adequately heat sunk.
Moisture classification is Level 1 per IPC/JEDEC J-STD-020B with no dry pack required.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
Thermal Resistance Junction-to-Ambient
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
(1)
o
(2)
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +150
35
100
2.0
1.2
260
Unit
o
o
o
C
C/W
C/W
W
V
o
Steady-State Power Dissipation @ TL < 80 C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
C
Notes:
1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see
last page).
2. Or 1.25 watts at T
A
= 25
º
C when mounted on FR4 PC board with recommended footprint (also see
figure 1.)
RF01101, Rev. A (1/10/13)
©2013 Microsemi Corporation
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