电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SMBG4753AE3/TR13

产品描述DIODE ZENER 36V 2W SMBG
产品类别分立半导体    二极管   
文件大小131KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

SMBG4753AE3/TR13概述

DIODE ZENER 36V 2W SMBG

SMBG4753AE3/TR13规格参数

参数名称属性值
是否Rohs认证符合
包装说明R-PDSO-G2
Reach Compliance Codecompliant
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-215AA
JESD-30 代码R-PDSO-G2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
标称参考电压36 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差5%
工作测试电流7 mA
Base Number Matches1

文档预览

下载PDF文档
SMBG4728 thru SMBG4764A, e3
SMBJ4728 thru SMBJ4764A, e3
SILICON 2.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
The SMBJ4728A-4764A and SMBG4728A-4764A series of surface mount
2.0 watt Zeners provides voltage regulation in a selection from 3.3 to 100
volts with different tolerances as identified by suffix letter on the part
number as well as RoHS Compliant with an e3 suffix. This surface mount
product series with lower thermal resistance features is equivalent to the
JEDEC registered 1N4728 thru 1N4764A with identical electrical
characteristics except it is rated at 2.0 W instead of 1.0 W. It is available
in J-bend design (SMBJ) with the DO-214AA package for greater PC
board mounting density or in Gull-wing design (SMBG) in the DO-215AA
for visible solder connections. Microsemi also offers numerous other
Zener products to meet higher and lower power applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are equivalent
to prior SMS package identifications.
FEATURES
Surface mount equivalent to 1N4728 to 1N4764A
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5% with
A suffix and 10 % with no suffix identification
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, and JANTXV are available
by adding MQ, MX, or MV prefixes respectively to
part numbers.
RoHS compliant devices available by adding an e3
suffix.
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 100 V
Popular DO-214AA or DO-215AA packages and
footprints for either high density J-bend or Gull-wing
designs for visible solder joints
Nonsensitive to ESD per MIL-STD-750 Method
1020
Moisture classification: Level 1 per IPC/JEDEC J-
STD-020B with no dry pack required
MAXIMUM RATINGS
Power dissipation at 25
º
C: 2.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 35
º
C/W junction to lead, or
100
º
C/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint
(see last page)
Steady-State Power: 2 watts at T
L
< 80
o
C, or 1.25
watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-
bend) leads, tin-lead plated or RoHS compliant
annealed matte-tin plating solderable per MIL-STD-
750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to opposite end for Zener regulation
MARKING: Includes part number without prefix
(e.g. 4728A, 4728Ae3, 4734C, 4764D, etc.)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape, 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
SMBG(J)4728–4764A, e3
Copyright
©
2007
6-20-2007 REV E
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
SI4432调试问题总结
工作过程: 我们用si4432的芯片做无线传输,将接收端的si4432工作在LDC模式,MCU工作在睡眠模式,然后由发送端发送多个连续唤醒包(短包),后面跟一个数据包,唤醒包的长度可以保证在一个WUT ......
edwardpeng 无线连接
功率器件的散热计算及散热器选择
目前的电子产品主要采用贴片式封装器件,但大功率器件及一些功率模块仍然有不少用穿孔式封 装,这主要是可方便地安装在散热器上,便于散热。进行大功率器件及功率模块的散热计算,其目的是在确 ......
lixiaohai8211 模拟电子
重要!WIFI-CC3200电源管理功耗测试笔记
本帖最后由 hanskying666 于 2016-1-26 10:07 编辑 在deyisupport上看到CC3200电源测试笔记,附件中的笔记有详细的测试图片,有问题大家一起讨论 模式 条件 电流消耗 测试图 Datashee ......
hanskying666 无线连接
【NXP Rapid IoT评测】W4 蓝牙评测
本帖最后由 johnrey 于 2019-1-21 16:07 编辑 虽然上一轮的传感器评测并不是很顺利,还有很多问题遗留没有解决,不过最终还是发现了一个可用的结构,可以用来进一步测试开发板上的蓝牙功能了 ......
johnrey 无线连接
EEWORLD大学堂----Microsemi Fusion系列FPGA入门指南
Microsemi Fusion系列FPGA入门指南:https://training.eeworld.com.cn/course/565...
FPGAfans2015 FPGA/CPLD
基于WT588D宿舍智能防盗防火报警系统
基于WT588D宿舍智能防盗防火报警系统 摘要: 本设计以超低功耗单片机MSP430F149为控制核心实现了宿舍智能防盗防火报警功能。其中含人体红外检测,烟雾检测及声光报警,安防数据存储等模块 ......
iushiyuan 能源基础设施

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 219  561  465  7  2689  20  8  19  51  32 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved