SMD2055-25000
Datasheet revision 1.3
www.chipquik.com
Sn96.5/Ag3.0/Cu0.5 Solder Spheres for BGAs
Product Highlights
Chip Quik® BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or
repairing BGA packages. Chip Quik® BGA solder spheres also exceed both the IPC and MIL standards for purity levels and
size tolerances. Nominal sizes are available from 8 to 30 mil.
Product Specifications
Part Number
SMD2016
SMD2016‐25000
SMD2020
SMD2020‐25000
SMD2024
SMD2024‐25000
SMD2028
SMD2028‐25000
SMD2032
SMD2032‐25000
SMD2036
SMD2036‐25000
SMD2040
SMD2040‐25000
SMD2050
SMD2050‐25000
SMD2055
SMD2055‐25000
SMD2060
SMD2060‐25000
Alloy
Melting Point
Diameter
0.008" (0.2mm)
0.010" (0.25mm)
0.012" (0.3mm)
0.014" (0.35mm)
0.016" (0.4mm)
Sn96.5/Ag3.0/Cu0.5
217‐220°C (423‐428°F)
0.018" (0.45mm)
0.020" (0.5mm)
0.024" (0.6mm)
0.025" (0.63mm)
0.030" (0.76mm)
Quantity (by weight)
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
250,000
25,000
Shelf Life:
Test Results
Test J-STD-004 or other
requirements as stated
Conflict Minerals Compliance
REACH Compliance
>24 months
Test Requirement
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)
No 1907/2006
Result
Compliant
Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials
Conforms to the following Industry Standards:
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 2 Directive 2011/65/EU:
Yes
Yes
1
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