Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> MKM34Z256VLL7R

MKM34Z256VLL7R: 产品描述KINETIS KM34: 75MHZ CORTEX-M0+ M; 产品类别半导体嵌入式处理器和控制器; 文件大小1MB，共57页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

MKM34Z256VLL7R在线购买

供应商	器件名称	价格	最低购买	库存
	MKM34Z256VLL7R	-	-	点击查看	点击购买

MKM34Z256VLL7R概述

KINETIS KM34: 75MHZ CORTEX-M0+ M

MKM34Z256VLL7R规格参数

参数名称	属性值
核心处理器	ARM® Cortex®-M0+
核心尺寸	32-位
速度	75MHz
连接性	I²C，SPI，UART/USART
外设	DMA，LCD，WDT
I/O 数	72
程序存储容量	256KB（256K x 8）
程序存储器类型	闪存
RAM 容量	32K x 8
电压 - 电源（Vcc/Vdd）	1.71 V ~ 3.6 V
数据转换器	A/D 12x16b，4x24b
振荡器类型	内部
工作温度	-40°C ~ 105°C（TA）
封装/外壳	100-LQFP
供应商器件封装	100-LQFP（14x14）

用户手册

文档预览

下载PDF文档

全文
预览

Freescale Semiconductor, Inc.

Data Sheet: Technical Data

KM34P144M75SF0

Rev. 2, May 2015

Kinetis KM34 Sub-Family Data

Sheet

Enabling high accuracy, secure 1-, 2- & 3-phase electricity

metering solutions through a powerful analog front end (AFE),

auto-compensated iRTC with hardware tamper detection,

segment LCD controller, rich security protection and multiple low

power features in a 32-bit ARM

Cortex

-M0+ MCU. This

product offers:

• Enabling single-chip 1-, 2- & 3-phase metering designs

• AFE, Security & HMI. Single crystal implementation

• Single point of calibration during manufacture

• Highest accuracy metrology with regional feature support

• Multiple

ƩΔ

ADCs with PGA

• Supports neutral disconnect use case

• Compliance with WELMEC/OIML recommendations

• Memory & peripheral protection

• Hardware tamper detect with time stamping

• Low-power RTC, battery backup with tamper memory

Core

• ARM

Cortex

-M0+ core up to 75 MHz

• Metering specific Memory Mapped Arithmetic Unit

(MMAU)

Clocks

• 75 MHz high-accuracy internal reference clock

• 32 kHz, and 4 MHz internal reference clock

• 1 kHz LPO clock

• 32.768 kHz crystal oscillator in iRTC power domain

• 1 MHz to 32 MHz crystal oscillator

• FLL and PLL

System peripherals

• Memory Protection Unit (MPU)

• 4-channel DMA controller

• Watchdog and EWM

• Low-leakage Wakeup Unit (LLWU)

• SWD debug interface and Micro Trace Buffer (MTB)

• Bit Manipulation Engine (BME)

• Inter-peripheral Crossbar Switch (XBAR)

MKM34Z256VLL7

MKM34Z256VLQ7

100 LQFP

144 LQFP

14 mm × 14 mm Pitch 20 mm × 20 mm Pitch

0.5 mm

Memories

• 256 KB program flash memory

• 32 KB SRAM

Operating Characteristics

• Voltage range: 1.71 to 3.6 V (without AFE)

• Voltage range: 2.7 to 3.6 V (with AFE)

• Temperature range (ambient): –40 to 105 °C

Low power features

• 13 power modes to provide power optimization

based on application requirements

• 7.69 mA @ 75 MHz run current

• Less than 171 μA/MHz very low power run current

• 6.05 μA very low power stop current

• Down to 220 nA deep sleep current

• V

BAT

domain current < 1 μA with iRTC operational

• Low-power boot with less than 2.33 mA peak

current

Communication interfaces

• 16-bit SPI modules

Analog Modules

• Low-power UART module

• 4 AFE channels (4× 24-bit

ƩΔ

ADCs with PGA)

• UART module complying with ISO7816-3

• 16-channel 16-bit SAR ADC with 4 result registers

• Basic UART module

• High-speed analog comparator containing a 6-bit DAC

• I

C with SMBus

and programmable reference input

• Internal 1.2 V reference voltage 10–15 ppm/℃

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 6

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 6

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 12

2.2.7 Designing with radiated emissions in mind..........12

2.2.8 Capacitance attributes.........................................13

2.3 Switching specifications...................................................13

2.3.1 Device clock specifications..................................13

2.3.2 General switching specifications......................... 13

2.4 Thermal specifications..................................................... 14

2.4.1 Thermal operating requirements......................... 14

2.4.2 Thermal attributes................................................14

3 Peripheral operating requirements and behaviors.................. 15

3.1 Core modules.................................................................. 15

3.1.1 Single Wire Debug (SWD)...................................16

3.1.2 Analog Front End (AFE)...................................... 16

3.2 Clock modules................................................................. 17

3.2.1 MCG specifications..............................................17

3.2.2 Oscillator electrical specifications........................19

3.2.3 32 kHz oscillator electrical characteristics........... 22

3.3 Memories and memory interfaces................................... 24

3.3.1 Flash electrical specifications.............................. 24

3.4 Analog............................................................................. 25

3.4.1 ADC electrical specifications............................... 25

3.4.2

3.4.3

CMP and 6-bit DAC electrical specifications....... 29

Voltage reference electrical specifications.......... 31

3.4.4 AFE electrical specifications................................32

3.5 Timers..............................................................................36

3.6 Communication interfaces............................................... 36

3.6.1 I2C switching specifications.................................36

3.6.2 UART switching specifications............................ 37

3.6.3 SPI switching specifications................................ 37

3.7 Human-Machine Interfaces (HMI)....................................41

3.7.1 LCD electrical characteristics.............................. 41

Dimensions............................................................................. 43

4.1 Obtaining package dimensions....................................... 43

Pinout...................................................................................... 43

5.1 KM3x_256 Signal multiplexing and pin assignments ......43

5.2 KM3x_256 Family Pinouts............................................... 48

Ordering parts......................................................................... 50

6.1 Determining valid orderable parts....................................50

Part identification.....................................................................51

7.1 Description.......................................................................51

7.2 Format............................................................................. 51

7.3 Fields............................................................................... 51

7.4 Example...........................................................................52

Terminology and guidelines.................................................... 52

8.1 Definition: Operating requirement....................................52

8.2 Definition: Operating behavior......................................... 52

8.3 Definition: Attribute.......................................................... 53

8.4 Definition: Rating............................................................. 53

8.5 Result of exceeding a rating............................................ 54

8.6 Relationship between ratings and operating

requirements....................................................................54

8.7 Guidelines for ratings and operating requirements..........54

8.8 Definition: Typical value...................................................55

8.9 Typical value conditions.................................................. 56

9 Revision History...................................................................... 56

Freescale Semiconductor, Inc.

Kinetis KM34 Sub-Family Data Sheet, Rev. 2, May 2015

MKM34Z256VLL7R相似产品对比

	MKM34Z256VLL7R	MKM34Z256VLL7
描述	KINETIS KM34: 75MHZ CORTEX-M0+ M

MKM34Z256VLL7R