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MKL17Z128VFM4R: 产品描述RISC MICROCONTROLLER; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1010KB，共68页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

MKL17Z128VFM4R在线购买

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MKL17Z128VFM4R概述

RISC MICROCONTROLLER

MKL17Z128VFM4R规格参数

参数名称	属性值
是否Rohs认证	符合
Objectid	4000165383
包装说明	5 X 5 MM, 0.65 MM HEIGHT, 0.50 MM PITCH, QFN-32
Reach Compliance Code	compliant
Country Of Origin	Mainland China
ECCN代码	3A991.A.2
Factory Lead Time	16 weeks
Samacsys Manufacturer	NXP
Samacsys Modified On	2022-12-27 12:55:46
YTEOL	11.3
具有ADC	YES
地址总线宽度
位大小	32
最大时钟频率	48 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-XQCC-N32
JESD-609代码	e3
长度	5 mm
湿度敏感等级	3
I/O 线路数量	28
端子数量	32
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	UNSPECIFIED
封装代码	QCCN
封装形状	SQUARE
封装形式	CHIP CARRIER
峰值回流温度（摄氏度）	260
ROM可编程性	FLASH
速度	48 MHz
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin (Sn)
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	40
宽度	5 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

用户手册

【User Guide】Set of general Math and motor control functions for Arm? Cortex?-M0+ Core

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document Number: KL17P64M48SF6

Rev. 6, 02/2016

Kinetis KL17 Microcontroller

48 MHz ARM® Cortex®-M0+ and 128/256 KB Flash

MKL17Z128Vxx4

MKL17Z256Vxx4

MKL17Z256CAL4R

The KL17 series is optimized for cost-sensitive and battery-

powered applications requiring low-power general-purpose

connectivity. The product offers:

• Embedded ROM with boot loader for flexible program

upgrade

• High accuracy internal voltage and clock reference

• FlexIO to support any standard and customized serial

peripheral emulation

• Down to 54uA/MHz in very low power run mode and

1.96uA in deep sleep mode (RAM + RTC retained)

32 and 48 QFN

36 WLCSP

5x5 mm P 0.5 mm 7x7

2.8x2.7 mm P 0.4 mm

mm P 0.5 mm

64 LQFP

10x10 mm P 0.5 mm

64 BGA

5x5 mm P 0.5 mm

Core Processor

• ARM

Cortex

-M0+ core up to 48 MHz

Memories

• 128/256 KB program flash memory

• 32 KB SRAM

• 16 KB ROM with build-in bootloader

• 32-byte backup register

System

• 4-channel asynchronous DMA controller

• Watchdog

• Low-leakage wakeup unit

• Two-pin Serial Wire Debug (SWD) programming and

debug interface

• Micro Trace Buffer

• Bit manipulation engine

• Interrupt controller

Clocks

• 48MHz high accuracy (up to 0.5%) internal reference

clock

• 8MHz/2MHz high accuracy (up to 3%) internal

reference clock

• 1KHz reference clock active under all low-power

modes (except VLLS0)

• 32–40KHz and 3–32MHz crystal oscillator

Peripherals

• One UART module supporting ISO7816, operating

up to 1.5 Mbit/s

• Two low-power UART modules supporting

asynchronous operation in low-power modes

• Two I2C modules and I2C0 supporting up to 1

Mbit/s

• Two 16-bit SPI modules supporting up to 24 Mbit/s

• One FlexIO module supporting emulation of

additional UART, IrDA, SPI, I2C, I2S, PWM and

other serial modules, etc.

• One serial audio interface I2S

• One 16-bit 818 ksps ADC module with high

accuracy internal voltage reference (Vref) and up to

16 channels

• High-speed analog comparator containing a 6-bit

DAC for programmable reference input

• One 12-bit DAC

• 1.2 V internal voltage reference

Timers

• One 6-channel Timer/PWM module

• Two 2-channel Timer/PWM modules

• One low-power timer

• Periodic interrupt timer

• Real time clock

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1 Voltage and current operating requirements....... 7

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 20

2.2.7 Designing with radiated emissions in mind..........21

2.2.8 Capacitance attributes.........................................21

2.3 Switching specifications...................................................21

2.3.1 Device clock specifications..................................21

2.3.2 General switching specifications......................... 22

2.4 Thermal specifications..................................................... 22

2.4.1 Thermal operating requirements......................... 22

2.4.2 Thermal attributes................................................23

3 Peripheral operating requirements and behaviors.................. 24

3.1 Core modules.................................................................. 24

3.1.1 SWD electricals .................................................. 24

3.2 System modules.............................................................. 25

3.3 Clock modules................................................................. 25

3.3.1 MCG-Lite specifications.......................................25

3.3.2 Oscillator electrical specifications........................27

3.4 Memories and memory interfaces................................... 29

3.4.1 Flash electrical specifications.............................. 29

3.5 Security and integrity modules........................................ 31

3.6 Analog............................................................................. 31

3.6.1

3.6.2

3.6.3

ADC electrical specifications............................... 31

Voltage reference electrical specifications.......... 36

CMP and 6-bit DAC electrical specifications....... 37

3.6.4 12-bit DAC electrical characteristics....................39

3.7 Timers..............................................................................42

3.8 Communication interfaces............................................... 42

3.8.1 SPI switching specifications................................ 42

3.8.2 I2C....................................................................... 47

3.8.3 UART...................................................................48

3.8.4 I2S/SAI switching specifications.......................... 49

Dimensions............................................................................. 53

4.1 Obtaining package dimensions....................................... 53

Pinouts and Packaging........................................................... 54

5.1 KL17 signal multiplexing and pin assignments................ 54

5.2 KL17 Family Pinouts........................................................57

5.3 Recommended connection for unused analog and

digital pins........................................................................61

Ordering parts......................................................................... 62

6.1 Determining valid orderable parts....................................62

Part identification.....................................................................62

7.1 Description.......................................................................62

7.2 Format............................................................................. 63

7.3 Fields............................................................................... 63

7.4 Example...........................................................................63

8 Terminology and guidelines.................................................... 64

8.1 Definitions........................................................................ 64

8.2 Examples......................................................................... 64

8.3 Typical-value conditions.................................................. 65

8.4 Relationship between ratings and operating

requirements....................................................................65

8.5 Guidelines for ratings and operating requirements..........66

9 Revision History...................................................................... 66

Freescale Semiconductor, Inc.

Kinetis KL17 Microcontroller, Rev. 6, 02/2016

MKL17Z128VFM4R

MKL17Z128VFM4R在线购买

MKL17Z128VFM4R概述

MKL17Z128VFM4R规格参数

用户手册

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