IC GATE AND 2CH 2-INP 8XSON
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 厂商名称 | Nexperia |
| 零件包装代码 | SON |
| 包装说明 | VSON, |
| 针数 | 8 |
| 制造商包装代码 | SOT833-1 |
| Reach Compliance Code | compliant |
| Samacsys Description | 74AUP2G08 - Low-power dual 2-input AND gate@en-us |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 1.95 mm |
| 逻辑集成电路类型 | AND GATE |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 输入次数 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 24 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 1 mm |
| 74AUP2G08GT,115 | 74AUP2G08GD,125 | 74AUP2G08GN,115 | 74AUP2G08GXX | 74AUP2G08GM,125 | 74AUP2G08DC,125 | |
|---|---|---|---|---|---|---|
| 描述 | IC GATE AND 2CH 2-INP 8XSON | IC GATE AND 2CH 2-INP 8XSON | IC GATE AND 2CH 2-INP 8XSON | 74AUP2G08GX/SOT1233/X2SON8 | IC GATE AND 2CH 2-INP 8XQFN | |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 包装说明 | VSON, | VSON, SOLCC8,.11,20 | SON, | HVBCC, | VQCCN, | VSSOP, |
| 制造商包装代码 | SOT833-1 | SOT996-2 | SOT1116 | SOT1233 | SOT902-2 | SOT765-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PBCC-B8 | S-PQCC-N8 | R-PDSO-G8 |
| 长度 | 1.95 mm | 3 mm | 1.2 mm | 1.35 mm | 1.6 mm | 2.3 mm |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSON | VSON | SON | HVBCC | VQCCN | VSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns |
| 座面最大高度 | 0.5 mm | 0.5 mm | 0.35 mm | 0.35 mm | 0.5 mm | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.2 V | 1.1 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | BUTT | NO LEAD | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | BOTTOM | QUAD | DUAL |
| 宽度 | 1 mm | 2 mm | 1 mm | 0.8 mm | 1.6 mm | 2 mm |
| 零件包装代码 | SON | SON | SON | - | QFN | SSOP |
| 针数 | 8 | 8 | 8 | - | 8 | 8 |
| Samacsys Description | 74AUP2G08 - Low-power dual 2-input AND gate@en-us | - | 74AUP2G08 - Low-power dual 2-input AND gate@en-us | - | 74AUP2G08 - Low-power dual 2-input AND gate@en-us | 74AUP2G08 - Low-power dual 2-input AND gate@en-us |
| JESD-609代码 | e3 | e4 | e3 | - | e4 | e4 |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 260 | 260 |
| 端子面层 | Tin (Sn) | NICKEL PALLADIUM GOLD | Tin (Sn) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子节距 | 0.5 mm | 0.5 mm | 0.3 mm | - | 0.5 mm | 0.5 mm |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | 30 |
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