It is recommeded that the temperature of the component does not exceed +125°C under worst
case conditions
Operating Temperature
-40 °C up to +125 °C
-10 °C up to +40 °C
1,1 ±0,2
Storage Temperature (in original
packaging)
Test conditions of Electrical Properties: +20°C, 33% RH if not specified differently
Scale - 20:1
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
HBH
DIN ISO 2768-1m
WE-KI HC SMD High Current Wire
Wound Ceramic Inductor
SIZE
REVISION
STATUS
ORDER CODE
744917060
DATE
BUSINESS UNIT
PAGE
0603
001.000
Valid
2015-11-10
eiSos
1/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Typical Inductance vs. Frequency Characteristics:
1000
Q-Factor vs. Frequency:
120
100
100
Inductance [nH]
80
Q-factor
10
1
10
100
1000
10000
60
40
20
0
10
100
1000
Frequency [MHz]
10000
Frequency [MHz]
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
HBH
DIN ISO 2768-1m
WE-KI HC SMD High Current Wire
Wound Ceramic Inductor
SIZE
REVISION
STATUS
ORDER CODE
744917060
DATE
BUSINESS UNIT
PAGE
0603
001.000
Valid
2015-11-10
eiSos
2/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
P0
D0
P2
T3
T
W3
E1
B
W1
close to center
D
F
E2
W
B0
A0
top cover
tape
P1
T1
K0
Carrier tape
Cover tape
C
C
W2
End
Feeding direction
Start
No Component
min. 160 mm
Components
Packaging is referred to the international standard
IEC 60286-3; 2013
tolerance
size
A0
typ.
1.2
B0
typ.
1.85
W
±0,1
8
P1
±0,1
4
T
typ.
1.02
T1
max.
0.1
D0
+0,1
1.5
E1
±0,1
1.75
E2
min.
6.25
No Component
min. 100 mm
Cover Tape
min. 400 mm
F
±0,05
3.5
G
min.
1.8
P0
±0,1
4
P2
±0,05
2
Tape
Paper
VPE / packaging unit
pcs.
3000
tolerance
Tape width
A
±2,0
178
B
min.
1.5
C
±0,8
13
D
min.
20.2
N
min.
50
W1
+1.5
8.4
W2
max.
14.4
W3
min.
7.9
W3
max.
10.9
0603
8 mm
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
CREATED
CHECKED
GENERAL TOLERANCE
KaS
DESCRIPTION
HBH
DIN ISO 2768-1m
165° - 180°
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
WE-KI HC SMD High Current Wire
Wound Ceramic Inductor
SIZE
REVISION
STATUS
ORDER CODE
744917060
DATE
BUSINESS UNIT
PAGE
Pull-of force
Tape width
8 mm
0,1 N - 1,0 N
0603
001.000
Valid
2015-11-10
N
PROJECTION
METHOD
A
eiSos
3/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Classification Reflow Profile for SMT components:
Classification Reflow Soldering Profile:
Profile Feature
Preheat Temperature Min
Preheat Temperature Max
Value
T
s min
150 °C
T
s max
200 °C
t
s
T
L
t
L
T
p
t
p
60 - 120 seconds
3 °C/ second max.
217 °C
60 - 150 seconds
see table below
20 - 30 seconds
6 °C/ second max.
8 minutes max.
T
p
Max. Ramp Up Rate
Max. Ramp Down Rate
T
L
T
s max
t
L
t
p
T
C
–5°C
Preheat Time t
s
from T
s min
to T
s max
Ramp-up Rate (T
L
to T
P
)
Liquidous Temperature
Time t
L
maintained above T
L
Peak package body temperature
Time within 5°C of actual peak temperaure
Ramp-down Rate (T
L
to T
P
)
Time 25°C to peak temperature
refer to IPC/ JEDEC J-STD-020E
Temperature
Preheat Area
T
s min
t
S
Package Classification Reflow Temperature:
Properties
Volume mm³
<350
260 °C
250 °C
Volume mm³
350-2000
260 °C
250 °C
245 °C
Volume mm³
>2000
260 °C
245 °C
245 °C
25
Time 25°C to Peak
PB-Free Assembly | Package Thickness < 1.6 mm
PB-Free Assembly | Package Thickness ≥ 2.5 mm
refer to IPC/ JEDEC J-STD-020E
PB-Free Assembly | Package Thickness 1.6 mm - 2.5 mm
260 °C
Time
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
HBH
DIN ISO 2768-1m
WE-KI HC SMD High Current Wire
Wound Ceramic Inductor
SIZE
REVISION
STATUS
ORDER CODE
744917060
DATE
BUSINESS UNIT
PAGE
0603
001.000
Valid
2015-11-10
eiSos
4/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
Cautions and Warnings:
The following conditions apply to all goods within the product series of WE-KIHC of
Würth Elektronik eiSos GmbH & Co. KG:
General:
All recommendations according to the general technical specifications of the data sheet have to be complied with.
The usage and operation of the product within ambient conditions, which probably alloy or harm the wire isolation, has to be avoided.
If the product is potted in customer applications, the potting material might shrink during and after hardening. The product is exposed to the
pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the
electrical as well as the mechanical characteristics are endangered to be affected. After the potting material is cured, the core, wire and
termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.
The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of
the customer. All technical specifications for standard products do also apply to customer specific products.
Cleaning agents that are used to clean the customer application might damage or change the characteristics of the component, body, pins
or termination.
Direct mechanical impact to the product shall be prevented as the core material could flake or in the worst case it could break.
Product specific:
Follow all instructions mentioned in the data sheet, especially:
• The soldering profile has to be complied with according to the technical reflow soldering specification, otherwise this will void the
warranty.
• All products shall be used before the end of the period of 12 months based on the product date code, if not a 100% solderability can´t
be ensured.
• Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.
• Strong forces might have the effect to damage the coplanarity of the electrical connection (pins), will restrain the soldering and void the
warranty.
• Please notice that the recommended thickness of the soldering paste is 120 µm.
The general and product specific cautions comply with the state of the scientific and technical knowledge and are believed to be accurate
and reliable; however, no responsibility is assumed for inaccuracies or incompleteness.
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
eiSos@we-online.com
CREATED
CHECKED
GENERAL TOLERANCE
PROJECTION
METHOD
KaS
DESCRIPTION
HBH
DIN ISO 2768-1m
WE-KI HC SMD High Current Wire
Wound Ceramic Inductor
SIZE
REVISION
STATUS
ORDER CODE
744917060
DATE
BUSINESS UNIT
PAGE
0603
001.000
Valid
2015-11-10
eiSos
5/6
This electronic component has been designed and developed for usage in general electronic equipment only. This product is not authorized for use in equipment where a higher safety standard and reliability standard is especially required or where a failure of the product is reasonably expected to cause severe personal injury or death, unless the parties have executed an agreement specifically governing such use. Moreover Würth Elektronik eiSos GmbH
& Co KG products are neither designed nor intended for use in areas such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc.. Würth Elektronik eiSos GmbH & Co KG must be informed about the intent of such usage before the design-in stage. In addition, sufficient reliability evaluation checks for safety
must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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