SiT9156
LVPECL, LVDS Oscillator (XO) with 0.3 ps Jitter for 10Gb Ethernet
The Smart Timing Choice
The Smart Timing Choice
Features
Applications
0.3 ps RMS phase jitter (random) for 10GbE applications
Frequency stability as low as ±10 ppm
100% drop-in replacement for quartz and SAW oscillators
Configurable positive frequency shift, +25, +50, or +75 ppm
Industry-standard packages: 3.2 x 2.5, 5.0 x 3.2, 7.0 x 5.0 mmxmm
Industrial and extended commercial temperature ranges
Best in class 1-year and 10-year aging
Best resilience, up to 40x better than quartz
For other frequencies, refer to SiT9121 or 9122 datasheet
10GB Ethernet, SONET, SATA, SAS, Fibre Channel,
PCI-Express
Telecom, networking, instrumentation, storage, servers
Electrical Characteristics
Parameter and Conditions
Supply Voltage
Symbol
Vdd
Min.
2.97
2.25
2.25
Output Frequency Range
f
Typ.
3.3
2.5
–
Max.
3.63
2.75
3.63
Unit
V
V
V
MHz
Termination schemes in Figures 1 and 2 - XX ordering code
156.253906 MHz, +25 PPM from 156.250000
156.257812 MHz, +50 PPM from 156.250000
156.261718 MHz, +75 PPM from 156.250000
Condition
LVPECL and LVDS, Common Electrical Characteristics
156.25000, 156.253906,
156.257812, 156.261718,
161.132800
-10
-20
-25
-50
–
–
–
–
–
–
–
–
–
–
100
–
6
6
–
61
–
–
–
–
–
–
1.6
300
–
0.25
+10
+20
+25
+50
+2
+5
+85
+70
–
30%
250
–
10
10
55
69
35
1
100
30
Vdd-0.7
Vdd-1.5
2.0
500
120
0.3
Frequency Stability
F_stab
ppm
ppm
ppm
ppm
ppm
ppm
°C
°C
Vdd
Vdd
kΩ
MΩ
ms
ms
%
mA
mA
A
A
mA
V
V
V
ps
ns
ps
25°C
25°C
Industrial
Extended Commercial
Pin 1, OE or ST
Pin 1, OE or ST
Pin 1, OE logic high or logic low, or ST logic high
Pin 1, ST logic low
Measured from the time Vdd reaches its rated minimum value.
In Standby mode, measured from the time ST pin crosses
50% threshold.
Contact SiTime for tighter duty cycle
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
OE = Low
ST = Low, for all Vdds
Maximum average current drawn from OUT+ or OUT-
See Figure 1(a)
See Figure 1(a)
See Figure 1(b)
20% to 80%, see Figure 1(a)
f = 156.25 MHz - For other frequencies, T_oe = 100ns + 3 period
IEEE802.3-2005 10GbE jitter measurement specifications
Inclusive of initial tolerance, operating temperature, rated power
supply voltage, and load variations
First Year Aging
10-year Aging
Operating Temperature Range
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
Start-up Time
Resume Time
Duty Cycle
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Standby Current
Maximum Output Current
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
OE Enable/Disable Time
RMS Phase Jitter (random)
F_aging1
F_aging10
T_use
VIH
VIL
Z_in
T_start
T_resume
DC
Idd
I_OE
I_leak
I_std
I_driver
VOH
VOL
V_Swing
Tr, Tf
T_oe
T_phj
-2
-5
-40
-20
70%
–
–
2
–
–
45
–
–
–
–
–
Vdd-1.1
Vdd-1.9
1.2
–
–
–
LVPECL, DC and AC Characteristics
LVDS, DC and AC Characteristics
Current Consumption
OE Disable Supply Current
Differential Output Voltage
Idd
I_OE
VOD
–
–
250
47
–
350
55
35
450
mA
mA
mV
Excluding Load Termination Current, Vdd = 3.3V or 2.5V
OE = Low
See Figure 2
SiTime Corporation
Rev. 1.06
990 Almanor Avenue, Sunnyvale, CA 94085
(408) 328-4400
www.sitime.com
Revised October 6, 2014
SiT9156
LVPECL, LVDS Oscillator (XO) with 0.3 ps Jitter for 10Gb Ethernet
The Smart Timing Choice
The Smart Timing Choice
Electrical Characteristics
(continued)
Parameter and Conditions
Output Disable Leakage Current
Standby Current
VOD Magnitude Change
Offset Voltage
VOS Magnitude Change
Rise/Fall Time
OE Enable/Disable Time
RMS Phase Jitter (random)
Symbol
I_leak
I_std
VOD
VOS
VOS
Tr, Tf
T_oe
T_phj
Min.
–
–
–
1.125
–
–
–
–
Typ.
–
–
–
1.2
–
495
–
0.25
Max.
1
100
50
1.375
50
600
115
0.3
Unit
A
A
mV
V
mV
ps
ns
ps
OE = Low
ST = Low, for all Vdds
See Figure 2
See Figure 2
See Figure 2
20% to 80%, see Figure 2
f = 156.25 MHz - For other frequencies, T_oe = 100ns + 3 period
IEEE802.3-2005 10GbE jitter measurement specifications
Condition
LVDS, DC and AC Characteristics (continued)
Pin Description
Pin
Map
OE
1
ST
2
3
4
5
6
NC
GND
OUT+
OUT-
VDD
Input
NA
Power
Output
Output
Power
Input
Functionality
H or Open: specified frequency output
L: output is high impedance
H or Open: specified frequency output
L: Device goes to sleep mode. Supply current reduces to
I_std.
No Connect; Leave it floating or connect to GND for better
heat dissipation
VDD Power Supply Ground
Oscillator output
Complementary oscillator output
Power supply voltage
Top View
OE/ST
1
NC
2
GND
3
6
VDD
OUT-
OUT+
5
4
Absolute Maximum
Attempted operation outside the absolute maximum ratings of the part may cause permanent damage to the part. Actual perfor-
mance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.
Parameter
Storage Temperature
VDD
Electrostatic Discharge (HBM)
Soldering Temperature (follow standard Pb free soldering guidelines)
Min.
-65
-0.5
–
–
Max.
150
4
2000
260
Unit
°C
V
V
°C
Thermal Consideration
Package
7050, 6-pin
5032, 6-pin
3225, 6-pin
JA, 4 Layer Board
(°C/W)
142
97
109
JC, Bottom
(°C/W)
27
20
20
Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Moisture Sensitivity Level
Condition/Test Method
MIL-STD-883F, Method 2002
MIL-STD-883F, Method 2007
JESD22, Method A104
MIL-STD-883F, Method 2003
MSL1 @ 260°C
Rev. 1.06
Page 2 of 8
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