IC GATE NAND 1CH 2-INP 4SON
| 参数名称 | 属性值 |
| 逻辑类型 | 与非门 |
| 电路数 | 1 |
| 输入数 | 2 |
| 电压 - 电源 | 0.8 V ~ 3.6 V |
| 电流 - 静态（最大值） | 500nA |
| 电流 - 输出高，低 | 4mA，4mA |
| 逻辑电平 - 低 | 0.7 V ~ 0.9 V |
| 逻辑电平 - 高 | 1.6 V ~ 2 V |
| 不同 V，最大 CL 时的最大传播延迟 | 6.5ns @ 3.3V，30pF |
| 工作温度 | -40°C ~ 125°C |
| 安装类型 | 表面贴装 |
| 供应商器件封装 | 4-SON |
| 封装/外壳 | 4-XFDFN 裸露焊盘 |
| 74AUP1G00GX,125 | 74AUP1G00GM,115 | 74AUP1G00GF,132 | 74AUP1G00GS,132 | 74AUP1G00GW,125 | |
|---|---|---|---|---|---|
| 描述 | IC GATE NAND 1CH 2-INP 4SON | IC GATE NAND 1CH 2-INP 6XSON | IC GATE NAND 1CH 2-INP 6XSON | IC GATE NAND 1CH 2-INP 6XSON | IC GATE NAND 1CH 2-INP 5TSSOP |
| Brand Name | - | Nexperia | Nexperia | Nexperia | Nexperia |
| 是否Rohs认证 | - | 符合 | - | 符合 | 符合 |
| 厂商名称 | - | Nexperia | Nexperia | Nexperia | Nexperia |
| 零件包装代码 | - | SON | SON | - | TSSOP |
| 包装说明 | - | 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 | VSON, | 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 |
| 针数 | - | 6 | 6 | - | 5 |
| 制造商包装代码 | - | SOT886 | SOT891 | SOT1202 | SOT353-1 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| Samacsys Description | - | 74AUP1G00 - Low-power 2-input NAND gate@en-us | 74AUP1G00 - Low-power 2-input NAND gate@en-us | 74AUP1G00 - Low-power 2-input NAND gate@en-us | 74AUP1G00 - Low-power 2-input NAND gate@en-us |
| 系列 | - | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | - | R-PDSO-N6 | R-PDSO-N6 | S-PDSO-N6 | R-PDSO-G5 |
| JESD-609代码 | - | e3 | e3 | e3 | e3 |
| 长度 | - | 1.45 mm | 1 mm | 1 mm | 2.05 mm |
| 逻辑集成电路类型 | - | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 输入次数 | - | 2 | 2 | 2 | 2 |
| 端子数量 | - | 6 | 6 | 6 | 5 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | VSON | VSON | VSON | TSSOP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 260 | 260 | - | 260 |
| 传播延迟（tpd） | - | 24.9 ns | 24.9 ns | 24.9 ns | 24.9 ns |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 0.5 mm | 0.5 mm | 0.35 mm | 1.1 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | - | 1.8 V | - | 1.1 V | 1.8 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | - | 0.5 mm | 0.35 mm | 0.35 mm | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | - | 30 |
| 宽度 | - | 1 mm | 1 mm | 1 mm | 1.25 mm |
| Base Number Matches | - | 1 | - | 1 | 1 |
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