MX29F040C
4M-BIT [512K x 8] SINGLE VOLTAGE
5V ONLY FLASH MEMORY
FEATURES
GENERAL FEATURES
• Single Power Supply Operation
- 4.5 to 5.5 volt for read, erase, and program operations
• 524288 x 8 only
• Sector Structure
- 64K-Byte x 8
• Latch-up protected to 100mA from -1V to Vcc + 1V
• Compatible with JEDEC standard
- Pinout and software compatible to single power supply Flash
PERFORMANCE
• High Performance
- Access time: 70/90ns
- Program time: 9us (typical)
- Erase time: 0.7s/sector, 4s/chip (typical)
• Low Power Consumption
- Low active read current: 30mA (maximum) at 5MHz
- Low standby current: 1uA (typical)
• Minimum 100,000 erase/program cycle
• 20 years data retention
SOFTWARE FEATURES
• Erase Suspend/ Erase Resume
- Suspends sector erase operation to read data from or program data to another sector which is not being
erased
• Status Reply
- Data# Polling & Toggle bits provide detection of program and erase operation completion
PACKAGE
• 32-Pin PLCC
• 32-Pin TSOP
•
All devices are RoHS Compliant
P/N:PM1201
REV. 2.2, DEC. 04, 2012
1
MX29F040C
Contents
FEATURES .................................................................................................................................................................. 1
GENERAL FEATURES
...............................................................................................................................1
SOFTWARE FEATURES
............................................................................................................................1
PACKAGE
..................................................................................................................................................1
PIN CONFIGURATIONS .............................................................................................................................................. 4
PIN DESCRIPTION ...................................................................................................................................................... 5
LOGIC SYMBOL
.........................................................................................................................................5
BLOCK DIAGRAM....................................................................................................................................................... 6
Table 1. SECTOR STRUCTURE ................................................................................................................................. 7
MX29F040C SECTOR ADDRESS TABLE
..................................................................................................7
Table 2. BUS OPERATION .......................................................................................................................................... 7
REQUIREMENTS FOR READING ARRAY DATA
......................................................................................8
WRITE COMMANDS/COMMAND SEQUENCES
.......................................................................................8
AUTOMATIC SELECT OPERATION
..........................................................................................................8
DATA PROTECTION
...................................................................................................................................9
WRITE PULSE "GLITCH" PROTECTION
..................................................................................................9
LOGICAL INHIBIT
.......................................................................................................................................9
POWER-UP SEQUENCE
...........................................................................................................................9
POWER-UP WRITE INHIBIT
......................................................................................................................9
POWER SUPPLY DECOUPLING
...............................................................................................................9
TABLE 3. MX29F040C COMMAND DEFINITIONS................................................................................................... 10
RESET
..................................................................................................................................................... 11
AUTOMATIC SELECT COMMAND SEQUENCE
..................................................................................... 11
AUTOMATIC PROGRAMMING
................................................................................................................12
CHIP ERASE
...........................................................................................................................................13
SECTOR ERASE
......................................................................................................................................13
SECTOR ERASE SUSPEND
....................................................................................................................14
SECTOR ERASE RESUME
......................................................................................................................14
ABSOLUTE MAXIMUM STRESS RATINGS ............................................................................................................. 15
OPERATING TEMPERATURE AND VOLTAGE ........................................................................................................ 15
DC CHARACTERISTICS
........................................................................................................................................ 16
SWITCHING TEST CIRCUITS ................................................................................................................................... 17
AC CHARACTERISTICS ......................................................................................................................................... 18
Figure 1. COMMAND WRITE OPERATION
.............................................................................................19
READ/RESET OPERATION ...................................................................................................................................... 20
Figure 2. READ TIMING WAVEFORMS
...................................................................................................20
ERASE/PROGRAM OPERATION ............................................................................................................................. 21
Figure 3. AUTOMATIC CHIP ERASE TIMING WAVEFORM
....................................................................21
Figure 4. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART
..........................................................22
Figure 5. AUTOMATIC SECTOR ERASE TIMING WAVEFORM
..............................................................23
P/N:PM1201
REV. 2.2, DEC. 04, 2012
2
MX29F040C
Figure 6. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART
..................................................24
Figure 7. ERASE SUSPEND/RESUME FLOWCHART
............................................................................25
Figure 8. AUTOMATIC PROGRAM TIMING WAVEFORMS
.....................................................................26
Figure 9. CE# CONTROLLED WRITE TIMING WAVEFORM
..................................................................27
Figure 10. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART
.................................................28
Figure 11. SILICON ID READ TIMING WAVEFORM
................................................................................29
WRITE OPERATION STATUS ................................................................................................................................... 30
Figure 12. DATA# POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)
................30
Figure 13. DATA# POLLING ALGORITHM
...............................................................................................31
Figure 14. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS)
.....................32
Figure 15. TOGGLE BIT ALGORITHM
...................................................................................................33
RECOMMENDED OPERATING CONDITIONS ......................................................................................................... 34
Figure A. AC Timing at Device Power-Up
.................................................................................................34
ERASE AND PROGRAMMING PERFORMANCE .................................................................................................... 35
DATA RETENTION .................................................................................................................................................... 35
LATCH-UP CHARACTERISTICS .............................................................................................................................. 35
ORDERING INFORMATION ...................................................................................................................................... 36
PACKAGE INFORMATION ........................................................................................................................................ 38
REVISION HISTORY ................................................................................................................................................. 40
P/N:PM1201
REV. 2.2, DEC. 04, 2012
3
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