IC BUFFER NON-INVERT 5.5V 8XSON
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 厂商名称 | Nexperia |
| 零件包装代码 | SON |
| 包装说明 | VSON, |
| 针数 | 8 |
| 制造商包装代码 | SOT833-1 |
| Reach Compliance Code | compliant |
| Samacsys Description | 74LVC3G07 - Triple buffer with open-drain output@en-us |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e3 |
| 长度 | 1.95 mm |
| 逻辑集成电路类型 | BUFFER |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 输入次数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | OPEN-DRAIN |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 8.4 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 1 mm |
| Base Number Matches | 1 |

| 74LVC3G07GT,115 | 74LVC3G07GN,115 | 74LVC3G07GD,125 | 74LVC3G07GS,115 | 74LVC3G07DC,125 | 74LVC3G07GM,125 | 74LVC3G07GM,115 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC BUFFER NON-INVERT 5.5V 8XSON | IC BUFFER NON-INVERT 5.5V 8XSON | IC BUFFER NON-INVERT 5.5V 8XSON | IC BUFFER NON-INVERT 5.5V 8XSON | IC BUF NON-INVERT 5.5V 8VSSOP | 74LVC3G07 - Triple buffer with open-drain output QFN 8-Pin | 74LVC3G07 - Triple buffer with open-drain output QFN 8-Pin |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 零件包装代码 | SON | SON | SON | SON | SSOP | QFN | QFN |
| 包装说明 | VSON, | SON, | VSON, SOLCC8,.11,20 | VSON, | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | VBCC, | 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | SOT833-1 | SOT1116 | SOT996-2 | SOT1203 | SOT765-1 | SOT902-2 | SOT902-2 |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | - | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | - |
| Samacsys Description | 74LVC3G07 - Triple buffer with open-drain output@en-us | 74LVC3G07 - Triple buffer with open-drain output@en-us | - | 74LVC3G07 - Triple buffer with open-drain output@en-us | 74LVC3G07 - Triple buffer with open-drain output@en-us | - | - |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | S-PBCC-B8 | - |
| JESD-609代码 | e3 | e3 | e4 | e3 | e4 | e4 | - |
| 长度 | 1.95 mm | 1.2 mm | 3 mm | 1.35 mm | 2.3 mm | 1.6 mm | - |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | 3 | 3 | 3 | 3 | 3 | 3 | - |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | VSON | SON | VSON | VSON | VSSOP | VBCC | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | - |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE | - |
| 峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | - | 260 | 260 | - |
| 传播延迟(tpd) | 8.4 ns | 8.4 ns | 8.4 ns | 8.4 ns | 8.4 ns | 8.4 ns | - |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | 0.5 mm | 0.35 mm | 0.5 mm | 0.35 mm | 1 mm | 0.5 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - |
| 标称供电电压 (Vsup) | 1.8 V | 3.3 V | 1.8 V | 3.3 V | 1.8 V | 1.8 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | Tin (Sn) | Tin (Sn) | NICKEL PALLADIUM GOLD | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING | BUTT | - |
| 端子节距 | 0.5 mm | 0.3 mm | 0.5 mm | 0.35 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | - | 30 | 30 | - |
| 宽度 | 1 mm | 1 mm | 2 mm | 1 mm | 2 mm | 1.6 mm | - |
| Base Number Matches | 1 | - | - | 1 | 1 | 1 | - |
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