TSSA3U45
Taiwan Semiconductor
3A, 45V Trench Schottky Rectifier
FEATURES
●
●
●
●
Patented Trench Schottky technology
Low power loss, high efficiency
High surge current capability
Compliant to RoHS directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
KEY PARAMETERS
PARAMETER
I
F(AV)
V
RRM
I
FSM
T
J MAX
VALUE
3
45
50
150
UNIT
A
V
A
°C
APPLICATIONS
●
Package
Configuration
DO-214AC (SMA)
Single dice
Trench Schottky barrier rectifier are designed for
high frequency miniature switched mode power
supplies such as adapters, lighting
MECHANICAL DATA
●
●
●
●
●
●
●
●
●
Case: DO-214AC (SMA)
Molding compound meets UL 94V-0 flammability rating
Part no. with suffix “H” means AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 0.06 g (approximately)
DO-214AC (SMA)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Marking code on the device
Repetitive peak reverse voltage
Reverse voltage, total rms value
Forward current
Surge peak forward current, 8.3 ms single half sine-
wave superimposed on rated load per diode
Junction temperature
Storage temperature
V
RRM
V
RMS
I
F(AV)
I
FSM
T
J
T
STG
SYMBOL
TSSA3U45
3U45
45
31
3
50
- 55 to +150
- 55 to +150
V
V
A
A
°C
°C
UNIT
1
Version:N1707
TSSA3U45
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER
Junction to Lead Thermal Resistance
Note:
1. RthjL test according to JESD51-14
(1)
(1)
SYMBOL
R
ӨJL
R
ӨJA
LIMIT
10
70
UNIT
°C/W
°C/W
Junction to Ambient Thermal Resistance
ELECTRICAL SPECIFICATIONS
(TA = 25°C unless otherwise noted)
PARAMETER
Forward voltage per diode
(1)
CONDITIONS
I
F
= 3A,T
J
= 25°C
I
F
= 3A,T
J
= 125°C
(2)
SYMBOL
V
F
TYP
0.42
0.30
-
50
MAX
0.48
0.40
500
100
UNIT
V
V
µA
mA
Reverse current @ rated V
R
per diode
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
T
J
= 25°C
T
J
= 125°C
I
R
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
PACKING
CODE
E3
E2
F3
TSSA3U45
H
F2
F4
M2
R3
*: Optional available
G
PACKING CODE
SUFFIX(*)
PACKAGE
Clip SMA
Clip SMA
Folded SMA
Folded SMA
Folded SMA
SMA
SMA
PACKING
1,800 / 7" Plastic reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
EXAMPLE
EXAMPLE P/N
TSSA3U45HR3G
PART NO.
TSSA3U45
PART NO.
SUFFIX
H
PACKING
CODE
R3
PACKING CODE
SUFFIX
G
DESCRIPTION
Green compound
AEC-Q101 qualified
2
Version:N1707
TSSA3U45
Taiwan Semiconductor
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
4
AVERAGE FORWARD CURRENT (A)
10,000
Fig.2 Total Capacitance Characteristics
3
CAPACITANCE (pF)
1,000
2
100
1
0
0
WITH IDEA
HEATSINK
25
50
75
100
125
150
f=1.0MHz
Vsig=50mVp-p
10
0.1
1
10
100
LEAD TEMPERATURE (°C)
REVERS E VOLTAGE (V)
Fig.3 Typical Reverse Characteristics
100
INSTANTANEOUS REVERSE CURRENT (mA)
100
Fig.4 Typical Forward Characteristics
INSTANTANEOUS FORWARD CURRENT (A)
10
T
J
=125
o
C
10
10
1
T
J
=150
o
C
UF1DLW
T
J
=125°C
1
T
J
=100
o
C
1
T
J
=100
o
C
0.01
0.1
0.1
T
J
=25
o
C
0.3
0.4
0.2
0.5
0.3
Pulse width
0.8
0.6
0.9
0.7
1
0.8
1.1
0.9
1
1.2
0.001
0.01
T
J
0.01
10
20
30
40
50
=25
o
C
60
70
80
90
100
T
J
=125
o
C
0.6
0.7
0.4
0.5
0
0.1
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FORWARD VOLTAGE (V)
3
Version:N1707
(A)
0.1
T
J
=25°C
TSSA3U45
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
DIM
A
B
C
D
E
F
G
H
Unit (mm)
Min
1.27
4.06
2.29
1.99
0.90
4.95
0.10
0.15
Max
1.58
4.60
2.83
2.50
1.41
5.33
0.20
0.31
Unit (inch)
Min
0.050
0.160
0.090
0.078
0.035
0.195
0.004
0.006
Max
0.062
0.181
0.111
0.098
0.056
0.210
0.008
0.012
SUGGESTED PAD LAYOUT
Symbol
A
B
C
D
E
Unit (mm)
1.68
1.52
3.93
2.41
5.45
Unit (inch)
0.066
0.060
0.155
0.095
0.215
MARKING DIAGRAM
P/N
G
YW
F
= Marking Code
= Green Compound
= Date Code
= Factory Code
4
Version:N1707
TSSA3U45
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
5
Version:N1707
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
