IC MULTIVIBRATOR MONO 16SOIC
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 零件包装代码 | SOP |
| 包装说明 | 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16 |
| 针数 | 16 |
| 制造商包装代码 | SOT109-1 |
| 74HCT123D-Q100,115 | 74HCT123PW-Q100,11 | 74HC123PW-Q100,118 | 74HC123D-Q100,118 | 74HCT123D-Q100J | 74HC123BQ-Q100,115 | 935299045118 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC MULTIVIBRATOR MONO 16SOIC | IC MULTIVIBRATOR MONO 16TSSOP | IC MULTIVIBRATOR MONO 16TSSOP | IC MULTIVIBRATOR MONO 16SOIC | 74HCT123D-Q100/SOT109/SO16 | IC MULTIVIBRATOR MONO 16DHVQFN | Monostable Multivibrator, HCT Series, 2-Func, CMOS, PDSO16 |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | - | Nexperia | - |
| 零件包装代码 | SOP | TSSOP | TSSOP | SOP | - | QFN | - |
| 包装说明 | 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16 | 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 | 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 | 3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16 | - | 2.50 X 3.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT763-1, DHVQFN-16 | SO-16 |
| 针数 | 16 | 16 | 16 | 16 | - | 16 | - |
| 制造商包装代码 | SOT109-1 | SOT403-1 | SOT403-1 | SOT109-1 | - | SOT763-1 | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | - | - | 符合 |
| 厂商名称 | - | Nexperia | Nexperia | Nexperia | - | Nexperia | - |
| Reach Compliance Code | - | compliant | compliant | compliant | - | compliant | compliant |
| 系列 | - | HCT | HC/UH | HC/UH | - | HC/UH | HCT |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - | R-PQCC-N16 | R-PDSO-G16 |
| JESD-609代码 | - | e4 | e4 | e4 | - | e4 | e4 |
| 长度 | - | 5 mm | 5 mm | 9.9 mm | - | 3.5 mm | 9.9 mm |
| 逻辑集成电路类型 | - | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | - | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR |
| 湿度敏感等级 | - | 1 | 1 | 1 | - | 1 | 1 |
| 数据/时钟输入次数 | - | 2 | 2 | 2 | - | 2 | 2 |
| 功能数量 | - | 2 | 2 | 2 | - | 2 | 2 |
| 端子数量 | - | 16 | 16 | 16 | - | 16 | 16 |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出极性 | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP | SOP | - | HVQCCN | SOP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
| 传播延迟（tpd） | - | 77 ns | 385 ns | 385 ns | - | 385 ns | 77 ns |
| 筛选级别 | - | AEC-Q100 | AEC-Q100 | AEC-Q100 | - | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | - | 1.1 mm | 1.1 mm | 1.75 mm | - | 1 mm | 1.75 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 6 V | 6 V | - | 6 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 2 V | 2 V | - | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | - | YES | YES | YES | - | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | - | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | - | NO LEAD | GULL WING |
| 端子节距 | - | 0.65 mm | 0.65 mm | 1.27 mm | - | 0.5 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | - | QUAD | DUAL |
| 宽度 | - | 4.4 mm | 4.4 mm | 3.9 mm | - | 2.5 mm | 3.9 mm |
| Base Number Matches | - | 1 | 1 | 1 | - | 1 | - |
MEMS传感器
嵌入式系统
单片机
电源技术
嵌入式系统
PCB设计
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
