IC ELECTRNC CIRCUIT BREAKER 8DIP
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| 制造商包装代码 | N |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 4.5/18 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.937 mm |
| 最大供电电流 (Isup) | 0.4 mA |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| LTC1153IN8#PBF | LTC1153CS8#TR | LTC1153IS8#TR | LTC1153IS8 | LTC1153IN8 | LTC1153CS8#PBF | LTC1153CN8#PBF | LTC1153IS8#TRPBF | LTC1153IS8#PBF | LTC1153CS8#TRPBF | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC ELECTRNC CIRCUIT BREAKER 8DIP | IC circuit brkr elec auto 8soic | IC circuit brkr elec auto 8soic | IC electr circuit breaker 8-soic | IC electrnc circuit breaker 8dip | IC ELECTR CIRCUIT BREAKER 8-SOIC | IC ELECTRNC CIRCUIT BREAKER 8DIP | IC ELECTR CIRCUIT BREAKER 8-SOIC | IC ELECTR CIRCUIT BREAKER 8-SOIC | IC ELECTR CIRCUIT BREAKER 8-SOIC |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | DIP | SOIC | DIP | SOIC | SOIC | SOIC |
| 包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 制造商包装代码 | N | S8 | S8 | S8 | N | S8 | N | S8 | S8 | S8 |
| Reach Compliance Code | compliant | _compli | _compli | _compli | _compli | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e0 | e0 | e0 | e0 | e3 | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - | - | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | DIP | SOP | DIP | SOP | SOP | SOP |
| 封装等效代码 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 235 | 235 | 235 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | 260 | 260 |
| 电源 | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.937 mm | 1.75 mm | 1.75 mm | 1.75 mm | 3.937 mm | 1.75 mm | 3.937 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电流 (Isup) | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA |
| 表面贴装 | NO | YES | YES | YES | NO | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | 20 | 20 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | 30 | 30 |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 长度 | - | 4.9 mm | 4.9 mm | 4.9 mm | - | 4.9 mm | - | 4.9 mm | 4.9 mm | 4.9 mm |
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