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CY7C1351G-117BGC

产品描述ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
产品类别存储    存储   
文件大小281KB,共14页
制造商Cypress(赛普拉斯)
下载文档 详细参数 选型对比 全文预览

CY7C1351G-117BGC概述

ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119

CY7C1351G-117BGC规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
包装说明14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
Reach Compliance Codecompli
最长访问时间7.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)117 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B119
长度22 mm
内存密度4718592 bi
内存集成电路类型ZBT SRAM
内存宽度36
湿度敏感等级1
功能数量1
端子数量119
字数131072 words
字数代码128000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织128KX36
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码HBGA
封装等效代码BGA119,7X17,50
封装形状RECTANGULAR
封装形式GRID ARRAY, HEAT SINK/SLUG
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源2.5/3.3,3.3 V
认证状态Not Qualified
座面最大高度2.4 mm
最大待机电流0.04 A
最小待机电流3.14 V
最大压摆率0.22 mA
最大供电电压 (Vsup)3.63 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
PRELIMINARY
CY7C1351G
4-Mbit (128K x 36) Flow-through SRAM
with NoBL™ Architecture
Features
• Can support up to 133-MHz bus operations with zero
wait states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 128K x 36 common I/O architecture
• 2.5V / 3.3V I/O power supply
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
— 7.5 ns (for 117-MHz device)
— 8.0 ns (for 100-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Lead-Free 100 TQFP and 119 BGA packages
• Burst Capability—linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1351G is a 3.3V, 128K x 36 Synchronous
Flow-through Burst SRAM designed specifically to support
unlimited true back-to-back Read/Write operations without the
insertion of wait states. The CY7C1351G is equipped with the
advanced No Bus Latency™ (NoBL™) logic required to
enable consecutive Read/Write operations with data being
transferred on every clock cycle. This feature dramatically
improves the throughput of data through the SRAM, especially
in systems that require frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the four Byte Write Select
(BW
[A:D]
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
Logic Block Diagram
A0, A1, A
MODE
CLK
CEN
C
CE
ADV/LD
C
WRITE ADDRESS
REGISTER
ADDRESS
REGISTER
A1
D1
A0
D0
Q1 A1'
A0'
Q0
BURST
LOGIC
ADV/LD
BW
A
BW
B
BW
C
BW
D
WE
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
WRITE
DRIVERS
MEMORY
ARRAY
S
E
N
S
E
A
M
P
S
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
E
DQs
DQP
A
DQP
B
DQP
C
DQP
D
OE
CE1
CE2
CE3
ZZ
INPUT
REGISTER
READ LOGIC
E
SLEEP
Control
Note:
1. For best–practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05513 Rev. *A
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised October 14, 2004

CY7C1351G-117BGC相似产品对比

CY7C1351G-117BGC CY7C1351G-117BGI MTB1-74SAL57-01-4-FR022
描述 ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 74 CONTACT(S), FEMALE, D MICROMINIATURE CONNECTOR, SOLDER, RECEPTACLE
Reach Compliance Code compli compli compliant
其他特性 FLOW-THROUGH ARCHITECTURE FLOW-THROUGH ARCHITECTURE MICROPIN
是否无铅 含铅 含铅 -
是否Rohs认证 不符合 不符合 -
包装说明 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 -
最长访问时间 7.5 ns 7.5 ns -
最大时钟频率 (fCLK) 117 MHz 117 MHz -
I/O 类型 COMMON COMMON -
JESD-30 代码 R-PBGA-B119 R-PBGA-B119 -
长度 22 mm 22 mm -
内存密度 4718592 bi 4718592 bi -
内存集成电路类型 ZBT SRAM ZBT SRAM -
内存宽度 36 36 -
湿度敏感等级 1 1 -
功能数量 1 1 -
端子数量 119 119 -
字数 131072 words 131072 words -
字数代码 128000 128000 -
工作模式 SYNCHRONOUS SYNCHRONOUS -
最高工作温度 70 °C 85 °C -
组织 128KX36 128KX36 -
输出特性 3-STATE 3-STATE -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 HBGA HBGA -
封装等效代码 BGA119,7X17,50 BGA119,7X17,50 -
封装形状 RECTANGULAR RECTANGULAR -
封装形式 GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG -
并行/串行 PARALLEL PARALLEL -
峰值回流温度(摄氏度) 225 225 -
电源 2.5/3.3,3.3 V 2.5/3.3,3.3 V -
认证状态 Not Qualified Not Qualified -
座面最大高度 2.4 mm 2.4 mm -
最大待机电流 0.04 A 0.04 A -
最小待机电流 3.14 V 3.14 V -
最大压摆率 0.22 mA 0.22 mA -
最大供电电压 (Vsup) 3.63 V 3.63 V -
最小供电电压 (Vsup) 3.135 V 3.135 V -
标称供电电压 (Vsup) 3.3 V 3.3 V -
表面贴装 YES YES -
技术 CMOS CMOS -
温度等级 COMMERCIAL INDUSTRIAL -
端子形式 BALL BALL -
端子节距 1.27 mm 1.27 mm -
端子位置 BOTTOM BOTTOM -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED -
宽度 14 mm 14 mm -
Base Number Matches 1 1 -

 
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