PD - 9.1697
PRELIMINARY
l
l
l
l
IRL3402
HEXFET
®
Power MOSFET
D
Advanced Process Technology
Optimized for 4.5V-7.0V Gate Drive
Ideal for CPU Core DC-DC Converters
Fast Switching
G
V
DSS
= 20V
R
DS(on)
= 0.01Ω
S
Description
These HEXFET Power MOSFETs were designed
specifically to meet the demands of CPU core DC-DC
converters. Advanced processing techniques
combined with an optimized gate oxide design results
in a die sized specifically to offer maximum efficiency
at minimum cost.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal
resistance and low package cost of the TO-220
contribute to its wide acceptance throughout the
industry.
I
D
= 85A
TO-220AB
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
V
GS
V
GSM
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 5.0V
Continuous Drain Current, V
GS
@ 5.0V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Gate-to-Source Voltage
(Start Up Transient, tp = 100µs)
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Max.
85
54
340
110
0.91
± 10
14
290
51
11
5.0
-55 to + 150
300 (1.6mm from case )
10 lbf•in (1.1N•m)
Units
A
W
W/°C
V
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Parameter
R
θJC
R
θCS
R
θJA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Typ.
–––
0.50
–––
Max.
1.1
–––
62
Units
°C/W
10/31/97
IRL3402
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
V
(BR)DSS
∆V
(BR)DSS
/∆T
J
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
C
iss
C
oss
C
rss
Min.
20
–––
–––
–––
0.70
65
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Max. Units
Conditions
–––
V
V
GS
= 0V, I
D
= 250µA
––– V/°C Reference to 25°C, I
D
= 1mA
0.010
V
GS
= 4.5V, I
D
= 51A
Ω
0.008
V
GS
= 7.0V, I
D
= 51A
–––
V
V
DS
= V
GS
, I
D
= 250µA
–––
S
V
DS
= 10V, I
D
= 51A
25
V
DS
= 20V, V
GS
= 0V
µA
250
V
DS
= 16V, V
GS
= 0V, T
J
= 150°C
100
V
GS
= 10V
nA
-100
V
GS
= -10V
78
I
D
= 51A
18
nC V
DS
= 10V
30
V
GS
= 4.5V, See Fig. 6
–––
V
DD
= 10V
–––
I
D
= 51A
ns
–––
R
G
= 5.0Ω, V
GS
= 4.5V
–––
R
D
= 0.19Ω,
Between lead,
4.5 –––
6mm (0.25in.)
nH
G
from package
7.5 –––
and center of die contact
3300 –––
V
GS
= 0V
1400 –––
pF
V
DS
= 15V
510 –––
ƒ = 1.0MHz, See Fig. 5
Typ.
–––
0.02
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
10
140
80
120
D
S
Source-Drain Ratings and Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
––– ––– 85
showing the
A
G
integral reverse
––– ––– 340
S
p-n junction diode.
––– ––– 1.3
V
T
J
= 25°C, I
S
= 51A, V
GS
= 0V
––– 72 110
ns
T
J
= 25°C, I
F
= 51A
––– 160 240
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
Starting T
J
= 25°C, L = 220µH
R
G
= 25Ω, I
AS
= 51A.
Pulse width
≤
300µs; duty cycle
≤
2%.
Calculated continuous current based on maximum allowable
junction temperature; for recommended current-handling of the
package refer to Design Tip # 93-4
I
SD
≤
51A, di/dt
≤
82A/µs, V
DD
≤
V
(BR)DSS
,
T
J
≤
150°C
IRL3402
1000
VGS
7.00V
5.00V
4.50V
3.50V
3.00V
2.70V
2.50V
BOTTOM 2.25V
TOP
1000
I
D
, Drain-to-Source Current (A)
100
I
D
, Drain-to-Source Current (A)
VGS
7.00V
5.00V
4.50V
3.50V
3.00V
2.70V
2.50V
BOTTOM 2.25V
TOP
100
2.25V
20µs PULSE WIDTH
T
J
= 25
°
C
1
10
100
2.25V
20µs PULSE WIDTH
T
J
= 150
°
C
1
10
100
10
0.1
10
0.1
V
DS
, Drain-to-Source Voltage (V)
V
DS
, Drain-to-Source Voltage (V)
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
1000
2.0
I
D
= 85A
R DS(on) , Drain-to-Source On Resistance
(Normalized)
I
D
, Drain-to-Source Current (A)
T
J
= 25
°
C
1.5
100
T
J
= 150
°
C
1.0
0.5
10
2
3
4
1
V DS = 50V
20µs PULSE WIDTH
5
6
0.0
-60 -40 -20
V
GS
= 4.5V
10V
0
20
40
60
80 100 120 140 160
V
GS
, Gate-to-Source Voltage (V)
T J, Junction Temperature ( ° C)
Fig 3.
Typical Transfer Characteristics
Fig 4.
Normalized On-Resistance
Vs. Temperature
IRL3402
6000
5000
4000
V
GS
, Gate-to-Source Voltage (V)
V
GS
= 0V,
f = 1MHz
C
iss
= C
gs
+ C
gd ,
C
ds
SHORTED
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
15
I
D
= 85 A
V
DS
= 16V
C, Capacitance (pF)
10
Ciss
3000
2000
Coss
5
1000
Crss
0
1
10
100
0
0
20
40
60
FOR TEST CIRCUIT
SEE FIGURE 13
80
100
120
VDS , Drain-to-Source Voltage (V)
Q
G
, Total Gate Charge (nC)
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
10000
ISD , Reverse Drain Current (A)
T
J
= 150
°
C
T
J
= 25
°
C
I
D
, Drain Current (A)
100
1000
OPERATION IN THIS AREA LIMITED
BY R
DS(on)
10us
10
100
100us
1ms
1
10
10ms
0.1
0.2
V
GS
= 0 V
0.6
1.0
1.4
1.8
2.2
1
1
T
C
= 25 °C
T
J
= 150 °C
Single Pulse
10
100
V SD,Source-to-Drain Voltage (V)
V
DS
, Drain-to-Source Voltage (V)
Fig 7.
Typical Source-Drain Diode
Forward Voltage
Fig 8.
Maximum Safe Operating Area
IRL3402
100
600
E
AS
, Single Pulse Avalanche Energy (mJ)
LIMITED BY PACKAGE
80
TOP
500
BOTTOM
ID
23A
32A
51A
I D , Drain Current (A)
400
60
300
40
200
20
100
0
25
50
75
100
125
150
0
25
50
75
100
125
150
TC , Case Temperature
( ° C)
Starting T
J
, Junction Temperature (
°
C)
Fig 9.
Maximum Drain Current Vs.
Case Temperature
Fig 10.
Maximum Avalanche Energy
Vs. Drain Current
10
(Z
thJC
)
Thermal Response
1
D = 0.50
0.20
0.10
0.1
0.05
0.02
0.01
SINGLE PULSE
(THERMAL RESPONSE)
P
DM
t
1
t
2
Notes:
1. Duty factor D = t
1
/ t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
0.001
0.01
0.1
1
0.01
0.00001
0.0001
t
1
, Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
