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IRG4BC30W-S

产品描述IGBT 600V 23A 100W D2PAK
产品类别分立半导体    晶体管   
文件大小197KB,共9页
制造商Infineon(英飞凌)
官网地址http://www.infineon.com/
下载文档 详细参数 选型对比 全文预览

IRG4BC30W-S概述

IGBT 600V 23A 100W D2PAK

IRG4BC30W-S规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Infineon(英飞凌)
包装说明PLASTIC, D2PAK-3
Reach Compliance Codeunknown
其他特性LOW CONDUCTION LOSS
外壳连接COLLECTOR
最大集电极电流 (IC)23 A
集电极-发射极最大电压600 V
配置SINGLE
JESD-30 代码R-PSSO-G2
JESD-609代码e0
湿度敏感等级1
元件数量1
端子数量2
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)225
极性/信道类型N-CHANNEL
认证状态Not Qualified
表面贴装YES
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间30
晶体管应用POWER CONTROL
晶体管元件材料SILICON
标称断开时间 (toff)300 ns
标称接通时间 (ton)41 ns

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PD - 91790
IRG4BC30W-S
INSULATED GATE BIPOLAR TRANSISTOR
Features
• Designed expressly for Switch-Mode Power
Supply and PFC (power factor correction)
applications
• Industry-benchmark switching losses improve
efficiency of all power supply topologies
• 50% reduction of Eoff parameter
• Low IGBT conduction losses
• Latest-generation IGBT design and construction offers
tighter parameters distribution, exceptional reliability
C
V
CES
= 600V
G
E
V
CE(on) typ.
= 2.10V
@V
GE
= 15V, I
C
= 12A
n-channel
Benefits
• Lower switching losses allow more cost-effective
operation than power MOSFETs up to 150 kHz
("hard switched" mode)
• Of particular benefit to single-ended converters and
boost PFC topologies 150W and higher
• Low conduction losses and minimal minority-carrier
recombination make these an excellent option for
resonant mode switching as well (up to >>300 kHz)
D
2
Pak
Absolute Maximum Ratings
Parameter
V
CES
I
C
@ T
C
= 25°C
I
C
@ T
C
= 100°C
I
CM
I
LM
V
GE
E
ARV
P
D
@ T
C
= 25°C
P
D
@ T
C
= 100°C
T
J
T
STG
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current

Clamped Inductive Load Current
‚
Gate-to-Emitter Voltage
Reverse Voltage Avalanche Energy
ƒ
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
600
23
12
92
92
± 20
180
100
42
-55 to + 150
300 (0.063 in. (1.6mm from case )
Units
V
A
V
mJ
W
°C
Thermal Resistance
Parameter
R
θJC
R
θJA
Junction-to-Case
Junction-to-Ambient, ( PCB Mounted,steady-state)*
Typ.
–––
–––
Max.
1.2
40
Units
°C/W
*
When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering
techniques refer to application note #AN-994.
www.irf.com
1
8/13/98

IRG4BC30W-S相似产品对比

IRG4BC30W-S IRG4BC30W-STRLP IRG4BC30W-STRL
描述 IGBT 600V 23A 100W D2PAK IGBT Modules 600V 23AD2PAK IGBT 600V 23A 100W D2PAK

 
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