PD - 91318B
IRFR/U1205
HEXFET
®
Power MOSFET
l
l
l
l
l
Ultra Low On-Resistance
Surface Mount (IRFR1205)
Straight Lead (IRFU1205)
Fast Switching
Fully Avalanche Rated
D
V
DSS
= 55V
G
S
R
DS(on)
= 0.027Ω
I
D
= 44A
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
The D-PAK is designed for surface mounting using
vapor phase, infrared, or wave soldering techniques.
The straight lead version (IRFU series) is for through-
hole mounting applications. Power dissipation levels
up to 1.5 watts are possible in typical surface mount
applications.
D -P A K
T O -252 A A
I-P A K
T O -25 1A A
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
44
31
160
107
0.71
± 20
210
25
11
5.0
-55 to + 175
300 (1.6mm from case )
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Parameter
R
θJC
R
θJA
R
θJA
Junction-to-Case
Junction-to-Ambient (PCB mount) **
Junction-to-Ambient
Typ.
–––
–––
–––
Max.
1.4
50
110
Units
°C/W
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1
5/11/98
IRFR/U1205
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
V
(BR)DSS
∆V
(BR)DSS
/∆T
J
R
DS(on)
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
C
iss
C
oss
C
rss
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
55
––– –––
V
V
GS
= 0V, I
D
= 250µA
––– 0.055 ––– V/°C Reference to 25°C, I
D
= 1mA
––– ––– 0.027
V
GS
= 10V, I
D
= 26A
2.0
––– 4.0
V
V
DS
= V
GS
, I
D
= 250µA
17
––– –––
S
V
DS
= 25V, I
D
= 25A
––– ––– 25
V
DS
= 55V, V
GS
= 0V
µA
––– ––– 250
V
DS
= 44V, V
GS
= 0V, T
J
= 150°C
––– ––– 100
V
GS
= 20V
nA
––– ––– -100
V
GS
= -20V
––– ––– 65
I
D
= 25A
––– ––– 12
nC
V
DS
= 44V
––– ––– 27
V
GS
= 10V, See Fig. 6 and 13
–––
7.3 –––
V
DD
= 28V
–––
69 –––
I
D
= 25A
ns
–––
47 –––
R
G
= 12Ω
–––
60 –––
R
D
= 1.1Ω, See Fig. 10
Between lead,
–––
4.5
–––
nH
6mm (0.25in.)
G
from package
––– 7.5 –––
and center of die contact
––– 1300 –––
V
GS
= 0V
––– 410 –––
pF
V
DS
= 25V
––– 150 –––
ƒ = 1.0MHz, See Fig. 5
D
S
Source-Drain Ratings and Characteristics
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
––– ––– 44
showing the
A
G
integral reverse
––– ––– 160
p-n junction diode.
S
––– ––– 1.3
V
T
J
= 25°C, I
S
= 22A, V
GS
= 0V
––– 65
98
ns
T
J
= 25°C, I
F
=25A
––– 160 240
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
V
DD
= 25V, starting T
J
= 25°C, L = 470µH
R
G
= 25Ω, I
AS
= 25A. (See Figure 12)
Pulse width
≤
300µs; duty cycle
≤
2%.
Calculated continuous current based on maximum allowable junction
temperature; Package limitation current = 20A
This is applied for I-PAK, Ls of D-PAK is measured between lead and
I
SD
≤
25A, di/dt
≤
320A/µs, V
DD
≤
V
(BR)DSS
,
center of die contact
T
J
≤
175°C
Uses IRFZ44N data and test conditions
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
2
www.irf.com
IRFR/U1205
1000
I , D rain-to-Source Current (A )
D
100
I , Drain-to-S ource C urrent (A )
D
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
TOP
1000
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
TOP
100
4 .5 V
10
10
4.5V
1
0.1
1
20 µ s P U LS E W ID TH
T
C
= 2 5°C
10
100
A
1
0.1
1
2 0µ s P U L S E W ID TH
T
C
= 17 5°C
10
100
A
V D S , D rain-to-S ourc e V oltage (V )
V D S , D rain-to-S ourc e V oltage (V )
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
R
D S (o n)
, D rain-to-S ourc e O n R esis tanc e
(N orm alize d)
1000
2.5
I
D
= 41A
I
D
, D rain -to-S ourc e C urre nt (A)
2.0
100
T
J
= 2 5 °C
T
J
= 1 7 5 °C
1.5
1.0
10
0.5
tion
1
4
5
6
7
V
DS
= 25V
2 0 µ s P U L S E W ID T H
8
9
10
A
0.0
-60
-40
-20
0
20
40
60
80
V
G S
= 10V
100 120 140 160 180
A
V
G S
, G a te -to-S o u rce V o lta g e (V )
T
J
, J unc tion T em pe rature (°C )
Fig 3.
Typical Transfer Characteristics
Fig 4.
Normalized On-Resistance
Vs. Temperature
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3
IRFR/U1205
2500
2000
C
iss
1500
C
oss
1000
V
G S
, G ate-to-S ource V oltage (V )
V
GS
C
is s
C
rs s
C
o ss
=
=
=
=
0V ,
f = 1M H z
C
g s
+ C
g d
, C
d s
S H O R T E D
C
gd
C
d s
+ C
gd
20
I
D
= 25 A
V
D S
= 44 V
V
D S
= 28 V
16
C , Capacitance (pF)
12
8
C
rss
500
4
0
1
10
100
A
0
0
10
20
30
FO R TE S T C IR C U IT
S E E FIG U R E 1 3
40
50
60
70
A
V
D S
, D rain-to-S ourc e V oltage (V )
Q
G
, T otal G ate C harge (nC )
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
1000
1000
I
S D
, Reverse D rain Current (A )
O P E R A TIO N IN TH IS A R E A L IM ITE D
B Y R
D S (o n)
I
D
, Drain C urrent (A )
100
100
10µ s
T
J
= 1 75 °C
100µ s
10
T
J
= 25 °C
10
1m s
1
0.5
1.0
1.5
2.0
V
G S
= 0 V
2.5
A
1
1
T
C
= 25 °C
T
J
= 17 5°C
S ing le P u lse
10
10m s
3.0
100
A
V
S D
, S ource-to-D rain V oltage (V )
V
D S
, D rain-to-S ource V oltage (V )
Fig 7.
Typical Source-Drain Diode
Forward Voltage
Fig 8.
Maximum Safe Operating Area
4
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IRFR/U1205
50
LIMITED BY PACKAGE
40
V
DS
V
GS
R
G
R
D
D.U.T.
+
I
D
, Drain Current (A)
-
V
DD
30
5.0V
Pulse Width
≤ 1
µs
Duty Factor
≤ 0.1 %
20
Fig 10a.
Switching Time Test Circuit
10
V
DS
90%
0
25
50
75
100
125
150
175
T
C
, Case Temperature ( ° C)
Fig 9.
Maximum Drain Current Vs.
Case Temperature
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Fig 10b.
Switching Time Waveforms
10
Thermal Response (Z
thJC
)
1
D = 0.50
0.20
0.10
P
DM
t
1
SINGLE PULSE
(THERMAL RESPONSE)
Notes:
1. Duty factor D = t
1
/ t
2
2. Peak T
J
= P
DM
x Z
thJC
+ T
C
0.0001
0.001
0.01
0.1
t
2
0.1
0.05
0.02
0.01
0.01
0.00001
t
1
, Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
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