IC MULTIPLEXER I2C HOTSWAP 20QFN
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 20 |
| 制造商包装代码 | UDC |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N20 |
| 长度 | 4 mm |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.9 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| LTC4314IUDC#TRPBF | LTC4314CGN#TRPBF | LTC4314CUDC#TRPBF | LTC4314IGN#TRPBF | LTC4314CGN#PBF | LTC4314IUDC#PBF | LTC4314IGN#PBF | LTC4314CUDC#PBF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC MULTIPLEXER I2C HOTSWAP 20QFN | IC MULTIPLEXR I2C HOTSWAP 20SSOP | IC MULTIPLEXER I2C HOTSWAP 20QFN | IC MULTIPLEXR I2C HOTSWAP 20SSOP | IC MULTIPLEXR I2C HOTSWAP 20SSOP | IC MULTIPLEXER I2C HOTSWAP 20QFN | IC MULTIPLEXR I2C HOTSWAP 20SSOP | IC MULTIPLEXER I2C HOTSWAP 20QFN |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFN | SSOP | QFN | SSOP | SSOP | QFN | SSOP | QFN |
| 包装说明 | HVQCCN, | SSOP, | HVQCCN, | SSOP, | SSOP, | HVQCCN, | SSOP, | 3 MM X 4 MM, LEAD FREE, PLASTIC, QFN-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 制造商包装代码 | UDC | GN | UDC | GN | GN | UDC | GN | UDC |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N20 | R-PDSO-G20 | S-XQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | S-XQCC-N20 | R-PDSO-G20 | S-XQCC-N20 |
| 长度 | 4 mm | 8.64 mm | 4 mm | 8.64 mm | 8.64 mm | 4 mm | 8.64 mm | 4 mm |
| 信道数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | HVQCCN | SSOP | HVQCCN | SSOP | SSOP | HVQCCN | SSOP | HVQCCN |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.75 mm | 0.8 mm | 1.75 mm | 1.75 mm | 0.8 mm | 1.75 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.9 V | 2.9 V | 2.9 V | 2.9 V | 2.9 V | 2.9 V | 2.9 V | 2.9 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.5 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3.899 mm | 3 mm | 3.899 mm | 3.899 mm | 3 mm | 3.899 mm | 3 mm |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| JESD-609代码 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
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