3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE
| 参数名称 | 属性值 |
| 厂商名称 | UNISONIC TECHNOLOGIES CO.,LTD |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-XDIP-T8 |
| 长度 | 9.2 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.31 mm |
| 最大供电电压 (Vsup) | 15 V |
| 最小供电电压 (Vsup) | 4 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 3510L-D08-T | 3510 | 3510-S08-T | 3510-D08-T | 3510-S08-R | 3510L-S08-T | 3510L-S08-R | |
|---|---|---|---|---|---|---|---|
| 描述 | 3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE | 3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE | 3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE | 3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE | 3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE | 3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE | 3 PHASE, 60 A, SILICON, BRIDGE RECTIFIER DIODE |
| 零件包装代码 | DIP | - | SOIC | DIP | SOIC | SOIC | SOIC |
| 包装说明 | DIP, | - | LSOP, | DIP, | LSOP, | LSOP, | LSOP, |
| 针数 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | - | compli | compliant | compli | compli | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | - | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-XDIP-T8 | - | R-PDSO-G8 | R-XDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 9.2 mm | - | 4.92 mm | 9.2 mm | 4.92 mm | 4.92 mm | 4.92 mm |
| 信道数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | LSOP | DIP | LSOP | LSOP | LSOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | SMALL OUTLINE, LOW PROFILE | IN-LINE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE, LOW PROFILE |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.31 mm | - | 1.7 mm | 4.31 mm | 1.7 mm | 1.7 mm | 1.7 mm |
| 最大供电电压 (Vsup) | 15 V | - | 15 V | 15 V | 15 V | 15 V | 15 V |
| 最小供电电压 (Vsup) | 4 V | - | 4 V | 4 V | 4 V | 4 V | 4 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | YES | NO | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | - | 3.95 mm | 7.62 mm | 3.95 mm | 3.95 mm | 3.95 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
