Laboratory Data Sheet
De-soldering Wick
March 2003
No-Clean Desoldering Wick
PRODUCT DESCRIPTION
LOCTITE
®
Product Multicore De-soldering Wick is designed
for static-free desoldering and repair of PC boards without the
need for subsequent cleaning.
We use a special halide-free vacuumised no-clean, flux-coated
copper braid designed to improve wicking. It will not lose its
efficiency even after prolonged storage in humid conditions.
The wick remains flexible and will not flake. PCBs meet MIL-P-
28809A Cleanliness Test without cleaning.
Note
The data contained herein are furnished for information only and are
believed to be reliable. We cannot assume responsibility for the
results obtained by others over whose methods we have no control. It
is the user's responsibility to determine suitability for the user's
purpose of any production methods mentioned herein and to adopt
such precautions as may be advisable for the protection of property
and of persons against any hazards that may be involved in the
handling and use thereof. In light of the foregoing,
Loctite
Corporation specifically disclaims all warranties expressed or
implied, including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Loctite
Corporation’s products.
Loctite Corporation specifically
disclaims any liability for consequential or incidental damages of
any kind, including lost profits.
The discussion herein of various
processes or compositions is not to be interpreted as representation
that they are free from domination of patents owned by others or as a
license under any Loctite Corporation patents that may cover such
processes or compositions. We recommend that each prospective
user test his proposed application before repetitive use, using this data
as a guide. This product may be covered by one or more United
States or foreign patents or patent applications
.
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Faster and increased solder absorption
Negligible residues which are non-corrosive, clear and
non-hydroscopic
Heat stable coating
Contains small amount of halide-free synthetic resin flux
that does not need to be removed.
Directions for Use
Lay de-soldering wick over the solder requiring removal and
place the soldering iron tip on top of the copper braid. The
braid and solder beneath will gradual heat until the solder
melts and is absorbed into the braid by capillary action.
Remove the braid, cut off the solder-filled length and dispose
properly.
Packaging:
Multicore De-soldering Wick is supplied in static dissipative
plastic spools of 1.5m (5ft) or 3m (10ft) spools.
Packaged ten spools per sleeve and five sleeves per box.
Also available in 100ft econo-spools.
DESOLDERING WICKS
Size
Reference
NC-OO
NC-AA
NC-AB
NC-BB
Approximate
Width
0.8mm (0.03in)
1.5mm (0.06in)
2.2mm (0.08in)
2.7mm (0.1in)
Data Ranges
The data contained herein may be reported as a typical value
and/or range. Values are based on actual test data and are
verified on a periodic basis.
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREINARE INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE
CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
NXP MCU
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