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583489

产品描述63/37 MP200 SOLDER FLUX 25GM
产品类别工具与设备   
文件大小81KB,共2页
制造商Multicore
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583489概述

63/37 MP200 SOLDER FLUX 25GM

583489规格参数

参数名称属性值
类型焊膏
成分Sn63Pb37(63/37)
熔点361°F(183°C)
焊剂类型免清洁
工艺有引线
形式盒式,0.88 盎司(25g)
保质期6 个月
保质期起始日期制造日期
存储/冷藏温度35°F ~ 50°F(2°C ~ 10°C)
发货信息发货时随带冷包。 要确保客户满意和产品完好,建议采用空运发货方式。
重量0.055 磅(24.95g)

文档预览

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Technical Data Sheet
Multicore MP200 RWF
May 2007
REWORK AND DCA FLUX
MP200 RWF is a halide free tacky flux designed for use
in a wide range of electronics assembly and rework
processes.
Sufficient activity to deal with different component
solderability
Compatible with Multicore MP200 solder paste
Good tack force to assist flip chip attach
Supplied in syringes or cartridges for application by
dispensing.
APPLICATIONS
Recommended for rework processes on assemblies build
with Multicore MP200 solder paste.
RECOMMENDED OPERATING CONDITIONS
There are many applications for this product and users may
find that their own process requires particular conditions.
The following information can therefore be for guidance
only.
REWORK:
The main function of the flux is threefold. It
provides a thermal pathway from the heat source to the
workpiece, ensuring that it is evenly heated. The viscous
fluid protects metal surfaces from rapid oxidation at
soldering temperature. It breaks down surface contaminants
to allow solder spread. On tin/lead surfaces, this may be a
purely physical effect causing oxide skins to flow away
from the molten coating but chemical dissolution may also
be required.
Where a component is to be soldered into place for the first
time, the alloy for the fillet may be provided by the fusible
coating on the PCB and to some extent, on the component
termination. The PCB may be of conventional design or it
can be specially fabricated with a flat, thick solder coating
(Solid Solder Deposition, SSD). In either case, MP200 RWF
is a suitable product and it will provide a sufficiently tacky
surface to hold the component in place.
When a component is to be soldered to a board having little
or no fusible coating, MP200 RWF will clean the surface to
be joined. Solder for the joint is supplied by wire which may
be solid or flux cored. If flux cored wire is used, it is
recommended that Multicore X39 is selected since the
residues are minimal and totally compatible with MP200
RWF.
Where components have been removed from a PCB, it is
important to prepare the site for the replacement device in
order that the resoldering process can be carried out
efficiently. Excess solder should be removed from the PCB
with Multicore No Clean Desoldering Wick and areas
showing abnormally high levels of oxidation may benefit
from pretinning.
In all cases, a variety of heating methods may be used to
produce a solder joint with this product. These include
soldering irons, hot gas and hot bar devices, condensation
reflow and IR/convection reflow. Specialist tools and
workstations are available to assist operators but skill will
often be required to adapt these to particular situations.
MP200 RWF is tolerant of a wide range of temperature
profiles and any residues left after reflow will be hard, clear
and non-tacky.
DCA:
MP200 RWF is ideal for direct chip attach
applications, for example flip chip. In this case MP200 RWF
should be doctor bladed into a reservoir of appropriate depth
and the chip presented to coat the solder bumps prior to
placement. The tack associated with MP200 RWF will then
hold the chip in place ready for reflow, although care should
always be taken when handling fragile assemblies such as
these. The reservoir depth will be governed by many process
considerations, but especially the bump diameter: good
results have been obtained with100 µm bumps by using a
depth of 35 µm.
TECHNICAL SPECIFICATION
The following Table summarises typical product properties.
Full details of test methods are available on request.
TEST
Acid Value, mg KOH/g total
flux
Brookfield Viscosity (cP)
Tack Force (g mm-
1
)
Flash point (°C)
Flux Classification
J-STD-004
Copper Mirror Test
Corrosion Test *)
IPC-SF-818
Chromate Paper Test
SIR Test (without cleaning) *)
GR-78-Core
J-STD-004
Electromigration Test *)
(without cleaning)
Bellcore GR-78-CORE
FLUX PROPERTIES
MP200 RWF
115
400,000
2.0
124
ROLO
Pass
Pass (10 days)
Pass
Pass
Pass
Pass
*) tested with suitable alloy
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
PRODUCT.

583489相似产品对比

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描述 63/37 MP200 SOLDER FLUX 25GM MP200 RWF SOLDER FLUX NO CLEAN
类型 焊膏 焊剂 - 免洗,粘性焊料
形式 盒式,0.88 盎司(25g) 注射器,0.35 盎司 (10g),10cc
保质期 6 个月 6 个月
保质期起始日期 制造日期 制造日期
发货信息 发货时随带冷包。 要确保客户满意和产品完好,建议采用空运发货方式。 要确保客户满意和产品完好,建议采用空运发货方式。
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