RN52
RN52 Bluetooth
®
Audio Module
Features:
• Fully qualified Bluetooth® version 3.0 module,
• Fully compatible with Bluetooth version 2.1+EDR,
1.2, and 1.1
• Embedded Bluetooth profiles: A2DP, AVRCP,
HFP/HSP and SPP
• Audio decoders: SBC, AAC, aptX
• Enhanced hands free voice capability narrowband
and wideband codecs with cVc DSP
• Software configurable through commands over
UART console interface
• Stereo analog differential audio output and input
for highest quality audio
• External Audio CODECs Supported via S/PDIF
and I2S Interface
• Integrated Amplifier for Driving 16Ω Speakers
• Dedicated GPIO pins enable MCUs to access
control and status functions efficiently
• SPP data connection interface over UART
• Supports wireless iAP profile advertising which is
discoverable by iOS devices (iAP protocol imple-
mentation on an external host microcontroller
required)
• Certifications: FCC, IC, CE, Bluetooth SIG
• Postage Stamp sized form factor: 13.5 x 26.0 x
2.7 mm
• Castellated SMT pads for easy and reliable PCB
mounting
• Environmentally Friendly, RoHS Compliant
• Bluetooth SIG QDID 58578
RN52 Block Diagram:
RN52
2 LEDs
PCB Antenna
Bluetooth 3.0
RF Baseband
Speaker
MIC
Speaker
MIC
Applications:
•
•
•
•
•
•
•
High-quality wireless stereo headsets
Automotive hands free audio kits
Wireless audio docking station for smartphones
High-quality wireless speakers
VoIP handsets
Remote control for media player
Medical data devices
Audio DSP
16-Bit Stereo
CODEC
UART
USB
I
2
S
S/PDIF
16-Bit RISC MCU
11 GPIO
Pins
1 AIO
16-MBit Flash
2015 Microchip Technology Inc.
DS70005120A-page 1
RN52
1.0
DEVICE OVERVIEW
Microchip’s RN52 Bluetooth audio module provides a
highly integrated solution for delivering high-quality ste-
reo audio in a small form factor. It combines a class 2
Bluetooth radio with an embedded DSP processor. The
module is programmed and controlled with a simple
ASCII command set.
The RN52 module complies with Bluetooth specifica-
tion version 3.0. It integrates an RF radio and a base-
band controller making it a complete Bluetooth
subsystem. The RN52 supports a variety of profiles
including A2DP, AVRCP, HSP/HFP, SPP and iAP. It
provides a UART interface, several user programmable
I/O pins, stereo speaker outputs, microphone inputs,
digital audio interface and a USB port. Standard RN52
and its variants support A2DP, AVRCP, HFP, SPP and
iAP in the capacity of Bluetooth Slave role. RN52SRC
supports A2DP, AVRCP, HFP in the capacity of
Bluetooth Master role.
RN52 supports wireless iAP profile advertising which is
discoverable by iOS devices. An external host micro-
controller is required to implement the iAP protocol and
communicate with the authentication coprocessor
while using the RN52 as a data pipe only to transfer the
iAP protocol data over Bluetooth back and forth with
the Apple device. A PIC
®
microcontroller can be used
to implement the iAP protocol using the Microchip MFi
Library.
Table 1-1
provides the general specifications for the
module.
Table 1-2
and
Table 1-3
provide the module’s
weight, dimensions and electrical characteristics.
TABLE 1-1:
Standard
Frequency Band
GENERAL SPECIFICATIONS
Specification
Bluetooth
®
3.0, class 2
2.4 ~ 2.48 GHz
GFSK, PI/4-DQPSK, 8 DPSK
3 Mbps
50 ohms
UART, GPIO, AIO, USB, I2S, S/PDIF, speaker, microphone
10 meters (33 feet)
-85 dBm at 0.1 % BER
4 dBm
Description
Modulation Method
Maximum Data Rate
RF Input Impedance
Interface
Operation Range
Sensitivity
RF TX Power
TABLE 1-2:
Dimensions
Weight
WEIGHT AND DIMENSIONS
Specification
1.2 g
Description
26.0 mm x 13.5 mm x 2.7 mm
TABLE 1-3:
Supply Voltage
Working current
ELECTRICAL CHARACTERISTICS
Specification
3.0-3.6V DC
Depends on profiles, 30 mA typical
< 0.5 mA
-40ºC to +85ºC
JESD22-A224 class 0 product
10% ~ 90% non-condensing
Description
Standby current (disconnected)
Temperature
ESD
Humidity
Figure 1-1
shows the module’s dimensions and
Figure 1-2
shows recommended landing pattern and
layout.
DS70005120A-page 2
2015 Microchip Technology Inc.
RN52
FIGURE 1-1:
MODULE DIMENSIONS
(Top View)
12.75
0.75
(Side View)
26.00
26.00
Dimensions are in millimeters
Tolerances:
PCB Outline: +/- 0.13 mm
PCB Thickness: +/- 0.100 mm
21.20
20.00
18.80
17.60
16.40
15.20
14.00
12.80
11.60
10.40
9.20
8.00
6.80
5.60
4.40
3.20
2.00
0.0
21.40
21.40
0.70
0.00
0.00
0.85
2.55
3.75
4.95
6.15
7.35
8.55
9.75
10.95
12.65
13.50
FIGURE 1-2:
RECOMMENDED PCB FOOTPRINT
(Top View)
3.25
4.65
6.05
7.45
8.85
10.25
0.8mm
1.6mm
26.00
21.20
20.00
18.80
17.60
16.40
15.20
14.00
12.80
11.60
10.40
9.20
8.00
6.80
5.60
4.40
3.20
2.00
0.0
21.40
20.70
Ground Pads
0.8 x 1.0 mm
0.80mm
Dimensions are in millimeters
Figure 1-3
shows the pinout and
Table 1-4
describes
the module’s pins.
2015 Microchip Technology Inc.
0.00
0.85
2.55
3.75
4.95
6.15
7.35
8.55
9.75
10.95
12.65
13.50
2.70
0.80
0.00
Host Ground Plane Edge
(See Mounting Details)
DS70005120A-page 3
RN52
FIGURE 1-3:
PIN DIAGRAM
TABLE 1-4:
Pin
1
2
Symbol
GND
GPIO3
PIN DESCRIPTION
(1)
(SHEET 1 OF 3)
I/O Type
Ground.
Digital
Ground.
Driving this pin high during bootup will put the
module in Device Firmware Update (DFU)
mode. The device will enter DFU mode in 3
seconds. The pin should only be asserted high
before the device enters DFU mode and not
after. (USB device powers VBUS. PIO3 requires
47K to ground and 22K to USB VBUS if USB
VBUS is supplying power to the main board.)
During runtime, if the pin is driven high, the
device will reset and reboot.
Note: Device will reset within 500 ms after the IO
is driven high. A reset pulse of 100 ms is recom-
mended. If IO continues to be driven high after
reset, the device will naturally enter DFU mode.
The device will enter DFU mode in 3 seconds.
Reserved, event indicator pin. A microcontroller
can enter Command mode and poll the state
register using the
Q
action command
Analog programmable input/output line
Input
Low
Description
Directio
n
Defau
lt
3
GPIO2
Digital
Output
High
4
AIO0
Bidirectional
I/O
DS70005120A-page 4
2015 Microchip Technology Inc.
RN52
TABLE 1-4:
Pin
5
Symbol
GPIO4
Digital
PIN DESCRIPTION
(1)
(SHEET 2 OF 3)
I/O Type
Description
Factory Reset mode. To reset the module to the
factory defaults, GPIO4 should be high on
power-up and then toggle low, high, low, high
with a 1 second wait between the transitions.
During runtime, the module will enter voice com-
mand mode if this pin is driven low.
Reserved. Not available for reconfiguring as a
general purpose IO pin.
Programmable I/O
Directio
n
Input
Defau
lt
Low
6
GPIO5
Bidirectional with program-
mable strength internal
pull-up/down
Bidirectional with program-
mable strength internal
pull-up/down
Bidirectional with program-
mable strength internal
pull-up/down
Bidirectional with program-
mable strength internal
pull-up/down
Bidirectional with program-
mable strength internal
pull-up/down
Digital
I/O
High
7
GPIO12
Programmable I/O
I/O
High
8
GPIO13
Programmable I/O
I/O
High
9
GPIO11
Programmable I/O
I/O
High
10
GPIO10
Programmable I/O
I/O
High
11
GPIO9
When you drive this signal low, the module’s
UART goes into Command mode. If this signal is
asserted high, the UART is in Data mode.
Reserved
USB data minus
USB data plus with selectable internal 1.5 Kohm
pull-up resistor
Input
High
12
13
14
15
16
17
18
19
USBD-
USBD+
Bidirectional
Bidirectional
I/O
I/O
Output
Input
Output
Input
UART_RTS CMOS output, tri-state, with UART request to send active low
weak internal pull-up
UART_CTS CMOS input with weak
internal pull-down
UART_TX
UART_RX
GND
GPIO7
UART clear to send active low
CMOS output, tri-state, with UART data output
weak internal pull-up
CMOS input with weak
internal pull-down
Ground
Bidirectional with program-
mable strength internal
pull-up/down
Bidirectional with program-
mable strength internal
pull-up/down
Analog
3.3-V power input
CMOS input, with weak
internal pull down
UART data input
Ground
Driving this pin low sets the UART baud rate to
9,600. By default, the pin is high with a baud rate
of 115,200
Programmable I/O
I/O
High
20
GPIO6
I/O
High
21
22
23
PWREN
VDD
PCM_IN
Pull high to power up RN52
3.3V power input
Synchronous data input, configurable for
SPDIF_IN or SD_IN (I
2
S)
Input
Input
Low
2015 Microchip Technology Inc.
DS70005120A-page 5
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