VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere
MECHANICAL DATA
* Case: Molded plastic
* Epoxy: UL 94V-0 rate flame retardant
* Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
* Polarity: As marked
* Mounting position: Any
* Weight: 0.064 gram
FEATURES
* ldeal for surface mounted applications
* Low leakage current
* Glass passivated junction
SMA ( DO-214AC )
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
o
C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
PARAMETER
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge Input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current at T
A
= 75℃
Peak Forward Surge Current: 8.3 ms single half sine-wave
Superimposed on rated load (JEDEC Method)
Maximum Forward Voltage at 1.0A DC
@T
A
= 25℃
Maximum DC Reverse Current at
Rated DC Blocking Voltage
@T
A
= 125℃
Maximum Reverse Recovery Time (Note 1 )
Typical Junction Capacitance ( Note 2 )
Typical Thermal Resistance ( Note 3 )
Operating and Storage Temperature Range
Notes:
SYMBOL
V
RRM
V
RMS
V
DC
I
O
I
FSM
V
F
I
R
trr
C
J
Rθ
JL
T
J,
T
STG
SMA4001 SMA4002 SMA4003 SMA4004 SMA4005 SMA4006 SMA4007
UNITS
GS1A/M1 GS1B/M2 GS1D/M3 GS1G/M4 GS1J/M5 GS1K/M6 GS1M/M7
50
35
50
100
70
100
200
140
200
400
280
400
1.0
30
1.1
5.0
50
2.5
30
15
-65 to +175
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amps
Amps
Volts
uAmps
uSec
pF
℃/W
℃
1.Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
2
2
2. Thermal Resistance from Junction to Ambient, .24” (6.0mm ) copper pads to each Terminal.
3. Measured at 1.0MHz and applied reverse voltage of4.0V
DC
Wing Shing Computer Components Co., (H.K.)Ltd.
Homepage:
http://www.wingshing.com
Tel:(852)2341 9276 Fax:(852)2797 8153
E-mail: wsccltd@hkstar.com
FPGA/CPLD
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