电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MVSMBJ5938BTR

产品描述Zener Diode, 36V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMBJ, 2 PIN
文件大小420KB,共4页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

MVSMBJ5938BTR概述

Zener Diode, 36V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMBJ, 2 PIN

MVSMBJ5938BTR规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
Objectid1098263226
零件包装代码DO-214AA
包装说明R-PDSO-C2
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL0
其他特性TR, 7 INCH: 750
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-214AA
JESD-30 代码R-PDSO-C2
JESD-609代码e0
湿度敏感等级1
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
极性UNIDIRECTIONAL
最大功率耗散1.25 W
参考标准MIL-19500
标称参考电压36 V
表面贴装YES
技术ZENER
端子面层TIN LEAD
端子形式C BEND
端子位置DUAL
最大电压容差5%
工作测试电流10.4 mA

文档预览

下载PDF文档
SMBG5913 thru SMBG5956B, e3
SMBJ5913 thru SMBJ5956B, e3
SILICON 2.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 2.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200
volts with different tolerances as identified by suffix letter on the part
number. This series is equivalent to the JEDEC registered 1N5913 thru
1N5956B with identical electrical characteristics except it is rated at 2.0 W
instead of 1.5 W with the lower thermal resistance features of the surface
mount packaging. It is available in J-bend design (SMBJ) with the DO-
214AA package for greater PC board mounting density or in Gull-wing
design (SMBG) in the DO-215AA for visible solder connections. It is also
available as RoHS Compliant with an e3 suffix. Microsemi also offers
numerous other Zener products to meet higher and lower power
applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Surface mount equivalent to 1N5913 to 1N5956B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-19500
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating
current and temperature range
Wide selection from 3.3 to 200 V
Popular DO-214AA or DO-215AA packages
and footprints for either high density J-bend or
Gull-wing designs for visible solder joints
Nonsensitive to ESD per MIL-STD-750 Method
1020
Withstands high surge stresses (see Figure 2)
Moisture classification: Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified
J-bend) tin-lead or RoHS compliant annealed
matte-Tin plating solderable per MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band.
Diode to be operated with banded end positive
with respect to opposite end for Zener
regulation
MARKING: Includes part number without
prefix (e.g. 5913B, 5913Be3, 5948C, 5956D,
etc.)
TAPE & REEL option: Standard per
EIA-481-1-
A
with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel
(add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
for JAN, JANTX, and JANTXV are available by adding MQ,
MX, or MV prefixes respectively to part numbers.
RoHS Compliant devices available by adding an “e3” suffix
MAXIMUM RATINGS
Power dissipation at 25
º
C: 2.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 35
º
C/W junction to lead, or
100
º
C/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint (see
last page)
Steady-State Power: 2 watts at T
L
< 80
o
C, or 1.25
watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (maximum)
SMBG(J)5913–5956B, e3
Copyright
©
2007
6-21--2007 REV H
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
请教关于CreateFile的入门级问题
// 打开 驱动 hFlashFile = CreateFile(TEXT("COM1:"), GENERIC_READ | GENERIC_WRITE, 0, NULL, OPEN_EXISTING, 0, 0); 我想请问我如何在com驱动中知道我打开的是COM1,还是其他COM,比如C ......
jimmy0524 嵌入式系统
请教中文字库的问题。
升级原来单片机的手持设备,用ARM7替换。原来字库存放在一片AM29F040 FLASH里。 现在用ARM跑,我觉得字不是很多,字比较少,大概200种。想用程序来写。请教思路。 前提是字模提取的方法不变 ......
wangzicc 嵌入式系统
【设计工具】FPGA 白皮书之浮点DSP算法实现
浮点运算一直是通用CPU、DSP和GPU的专长,现在却越来越多的被FPGA实现,这主要是受医疗成像、无线或者国防设备等需要大动态范围同时又需要简化设计的新兴应用所拉动,本文介绍了用FPGA实现浮点 ......
GONGHCU FPGA/CPLD
能量采集芯片越来越火了哈
如果某个终端在天花板上(比如烟雾报警器、灯),那你一定很厌烦每隔一段时间就去爬梯子更换电池。再或者,电池在探井里、人造的移植心脏里......情况是不是更棘手? 所以如今许多公司都开发了 ......
抛砖引玉 电源技术
AD打印预览图到Word中没有焊盘
Altium Designer 打印预览复制粘贴到Word2013中,焊盘丢失,输出图片EMF格式有焊盘,复制到Word中焊盘也丢失,怎么解决? ...
E飞翔 PCB设计

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 652  1372  2230  2916  1985  14  28  45  59  40 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved