INTERCONNECTS
SERIES 800 & 801 • .100” GRID (.030” DIA. PINS),
SOLDERLESS PRESS-FIT • SINGLE ROW STRIPS
Number of Pins
X .100"
.100
•
The unique compliant tail pins conform to
.040”+ .003” nished hole without stressing
inner layers. Patent No. 4,799,904
thicknesses of .060” - .100” and .090” - .130”.
See ordering information for details
#5602 compliant tail pins featuring a .030”
dia. mating lead. See page 220 for details
Hi-Rel, 6- nger BeCu #47 contact rated at
4.5 amps. Receptacles accept .030” diameter
pins & .025” square pins. See pg. 256 for details
.030 DIA.
.191
.110
•
Headers and sockets are available for board
.104
.045 DIA.
•
Series 800 pin headers use MM #5601 and
.100
.035 DIA.
.018
SLOT
•
Series 801 sockets MM #4614 or #4615 use
FIG. 1
.100
Number of Pins
X .100"
•
Insulators are high temperature thermoplastic
.030 DIA.
.191
ORDERING INFORMATION
Compliant Tail Pin Header for .060” - .100” Thick Boards
.143
.110
.045 DIA.
FIG. 1
.100
800 XX 0_ _ 61 001000
Specify number of pins
01-64
.035 DIA.
.018
SLOT
Compliant Tail Pin Header for .090” - .130” Thick Boards
FIG. 2
.025-.037
.025 * .025
.100
Number of Pins
X .100"
FIG. 2
RoHS - 2
800 XX 0_ _ 62 001000
Specify number of pins
XX=Plating Code
See Below
10
10
µ”
Au
01-64
For
Electrical, Mechanical
& Enviromental Data,
See page 264
2011/65/EU
.088
.240
.276
SPECIFY PLATING CODE XX=
.104
90
200
µ”
Sn/Pb
40
200
µ”
Sn
.045 DIA.
Pin Plating
.100
.040 DIA.
.018
SLOT
Compliant Tail Socket for .060” - .100” Thick Boards
FIG. 3
.025-.037
.025 * .025
FIG. 3
Number of Pins
X .100"
801 XX 0_ _ 61 001000
Specify number of pins
01-50
Compliant Tail Socket for .090” - .130” Thick Boards
PAGE 56 | INTERCONNECTS
.100
FIG. 4
RoHS - 2
801 XX 0_ _ 62 001000
Specify number of pins
01-50
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.088
.240
.276
.045 DIA.
.143
2011/65/EU
XX=Plating Code
See Below
91
10
µ”
Au
.040 DIA.
.018
SLOT
.100
SPECIFY PLATING CODE XX=
Sleeve (Pin)
Contact (Clip)
93
99
41
43
200
µ”
Sn
30
µ”
Au
200
µ”
Sn/Pb 200
µ”
Sn/Pb 200
µ”
Sn/Pb
200
µ”
Sn
FIG. 4
30
µ”
Au
100
µ”
Sn/Pb
10
µ”
Au
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
NXP MCU
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