CMS03
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS03
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
•
•
•
•
Repetitive peak reverse voltage : V
RRM
= 30 V
: I
F (AV)
= 3 A
Average forward current
Peak forward voltage
: V
FM
= 0.45 V (max)
Suitable for compact assembly due to small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Unit: mm
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Non-repetitive peak forward surge current
Junction temperature
Storage temperature
Symbol
V
RRM
I
F (AV)
I
FSM
T
j
T
stg
Rating
30
3 (Note 1)
40 (50 Hz)
−40
to 150
−40
to 150
Unit
V
A
A
°C
°C
Note 1: Tℓ
=
117.6°C
Ta
=
28.4°C
Rectangular waveform (α
=
180°), V
R
=
15 V
Device mounted on a ceramic board
Board size
: 50 mm
×
50 mm
Soldering land size : 2 mm
×
2 mm
Board thickness
: 0.64 mm
JEDEC
JEITA
TOSHIBA
―
―
3-4E1A
Note 2: Using continuously under heavy loads (e.g. the application of
Weight: 0.023 g (typ.)
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Symbol
V
FM (1)
Peak forward voltage
V
FM (2)
V
FM (3)
Repetitive peak reverse current
Junction capacitance
I
RRM (1)
I
RRM (2)
C
j
Test Condition
I
FM
=
0.5 A (pulse test)
I
FM
=
1 A (pulse test)
I
FM
=
3 A (pulse test)
V
RRM
=
5 V (pulse test)
V
RRM
=
30 V (pulse test)
V
R
=
10 V, f
=
1 MHz
Device mounted on a ceramic board
board size
: 50 mm
×
50 mm
soldering land size : 2 mm
×
2 mm
board thickness : 0.64 mm
Device mounted on a glass-epoxy board
board size
: 50 mm
×
50 mm
soldering land size : 6 mm
×
6 mm
board thickness : 1.6 mm
Min
Typ.
0.35
0.37
0.42
3
30
190
Max
0.45
500
60
µA
pF
V
Unit
Thermal resistance(junction to ambient)
R
th (j-a)
135
°C/W
Thermal resistance (junction to lead)
R
th (j-ℓ)
16
Start of commercial production
1
2000-07
2018-04-04
CMS03
Marking
Abbreviation Code
S3
Part No.
CMS03
Land pattern dimensions for reference only
Unit: mm
1.4
3.0
1.4
Handling Precaution
1)
Schottky barrier diodes (SBDs) have reverse current greater than other types of diodes. This makes SBDs more
vulnerable to damage due to thermal runaway under high-temperature and high-voltage conditions. Thus, both
forward and reverse power losses of SBDs should be considered for thermal and safety design.
The absolute maximum ratings are rated values that must not be exceeded during operation, even for an instant.
The following are the recommended general derating methods for designing a circuit board using this device.
V
RRM
: Use this rating with reference to 1) above. V
RRM
has a temperature
coefficient of 0.1%/℃ at low temperatures. Take this coefficient into account when designing a
circuit board that will be operated in a low-temperature environment.
I
F(AV)
: We recommend that the worst-case current be no greater than 80% of the absolute maximum
rating of I
F(AV)
and that the worst-case junction temperature, T
j
, be kept below 120℃. When using
this device,
allow margins, referring to the T
a(max)
-I
F(AV)
curve.
I
FSM
: This rating specifies peak non-repetitive forward surge current. This only applies to an abnormal
operation, which seldom occurs during the lifespan of a device.
T
j
: Derate device parameters in proportion to this rating in order to ensure high reliability.
We recommend that the junction temperature (T
j
) of a device be kept below 120℃.
2)
3)
Thermal resistance (junction-to-ambient) varies with the mounting conditions of a device on a circuit board. An
appropriate thermal resistance value should be used, considering the heatsink, circuit board design and land
pattern dimensions (provided for reference only).
For other design considerations, see the Rectifiers databook or the Toshiba website.
4)
2.1
2
2018-04-04
CMS03
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
•
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
•
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE").
Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields.
IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.
For details, please contact your
TOSHIBA sales representative.
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
•
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
•
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive.
TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
5
2018-04-04
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