SAC305 No Clean Solder Paste
4900P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4900P
Description
The 4900P
No Clean Solder Paste
is made from a blend of high-purity, non-recycled tin, silver, and copper
metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for
extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It
provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high
thermal stability yield solder joints with smooth surfaces.
Applications & Usages
The solder paste is designed to accommodate high speed printing. It can yield brick-like prints even when
using an ultra-fine pitch stencils down to 0.3 mm.
Benefits and Features
•
•
•
•
•
•
•
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Repeatable and consistent print characteristics
Long stencil and tack life to accommodate high speed printing
Excellent wettability
Suitable for air or nitrogen atmosphere
Medium soft, non-cracking residues
C
OMPLIANCE
✓
Dobb-Frank (DRC
conflict free)
✓
REACH (compliant)
✓
RoHS (compliant)
Solder Alloy Composition
Properties
MAIN INGREDIENTS
Sn
Ag
Cu
Value
96.8 to 95.7%
02.8
to 3.2%
00.4
to 0.6%
Properties
IMPURITIES
Pb
Sb
Bi
In
As
Fe
Ni
Au
Al
Cd
Zn
Value
a)
≤0.05% Max
≤0.05%
Max
≤0.05%
Max
≤0.05%
Max
≤0.01%
Max
≤0.01%
Max
≤0.005%
Max
≤0.002%
Max
≤0.001%
Max
≤0.001%
Max
≤0.001%
Max
a) Exceeds the requirements of J-STD-006C and meets ASTM B 32.
Particle Size
The powder distribution complies with the J-STD-005 Type 3 (with 80% min. between 25-45 µm) particle
sizes. Solder powder distribution is measured utilizing laser diffraction, optical analysis and sieve analysis.
Careful control of solder powder manufacturing processes ensures the particles’ shape are 95% spherical
minimum (aspect ratio <1.5) and that the alloy contains a typical maximum oxide level of 80 ppm.
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Date: 13 February 2018 / Ver. 2.04
SAC305 No Clean Solder Paste
4900P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4900P
Properties of Type 5 SAC305 Lead Free Solder Paste
Flux Properties
Flux Classification
Flux Type
Flux Activity
Halides %(wt)
Acid Number (mgKOH/g sample)
Copper Mirror
Corrosion Test
Surface Insulation Resistance (SIR)
Bellcore (Telecordia)
Electromigration
Post Reflow Flux Residue
Paste Properties
Metal Loading
Viscosity
Malcom
(2)
poise
Thixotropic Index
Slump Test
25 °C, 0.63 vertical/horizontal
150 °C, 0.63 vertical/horizontal
25 °C, 0.33 vertical/horizontal
150 °C, 0.33 vertical/horizontal
Solder Ball Test
Tack
Initial
Tack retention @ 24 h
Tack retention @ 72 h
Stencil Life
Abandon Time
Method
J-STD-004B
Value
ROL0
Rosin
Low
<0.05%
117
No removal of copper film
Pass
2.01 x 10
10
Ω
5.25 x 10
11
Ω
Pass
5.5%
Value
88.5%
1600-1900
0.50-0.60
No bridges all spacings
"
"
"
Pass
124 gf
111 gf
98 gf
>8 h
60 min
IPC-TM-650 2.3.13
IPC-TM-650 2.3.32
IPC-TM-650 2.6.15
IPC-TM-650 2.6.3.3
Bellcore GR-78-CORE 13.1.3
Bellcore GR-78-CORE 13.1.4
TGA Analysis
Method
IPC-TM-650 2.2.20
IPC-TM-650 2.4.34.3 modified
IPC-TM-650 2.4.35
"
"
"
IPC-TM-650 2.4.43
JIS Z 3284
"
"
QIT 3.44.5
QIT 3.44.6
Note:
The force in grams is denoted with the unit gf.
Pressure
The pressure applied in the syringe should be kept at a minimum, and the head pressure kept in the range
of 107–270 g/cm [0.6-1.5 lb/in] according to the length of the blade. The external air pressure supply
should be maintained constant.
Solder Paste Application
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the
paste enough time to reach thermal equilibrium with the environment. The flow rate of paste in a
dispensing application depends on viscosity, which can be altered by temperature change. If solder paste
is purchased in syringes pre-mixing is not necessary due to the shear action produced from the
dispensing.
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Date: 13 February 2018 / Ver. 2.04
SAC305 No Clean Solder Paste
4900P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4900P
Reflow
Best results have been achieved when the 4900P is reflowed in a forced air convection oven with a
minimum of 7 zones (top and bottom).
The following is a recommended profile for a forced air convection reflow process. The melting
temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e.
density, thickness, etc.) determine the actual reflow profile.
The Preheat Zone,
which is also referred to as the ramp zone, is used to elevate the temperature of the
PCB to the desired soak temperature. In the preheat zone, the rate of temperature rise should not exceed
2.5 °C/s to avoid thermal chock stresses. The oven preheat zone normally occupies 25–33% of the heated
tunnel length.
The Soak Zone
normally occupies 33–50% of the heated tunnel length. It exposes the PCB to a relatively
stable temperature that allows the components of different mass to reach a uniform temperature. The
soak zone also allows the flux to concentrate and the volatiles to escape from the paste.
The Reflow Zone,
or spike zone, elevates the temperature of the PCB assembly from the activation
temperature to the recommended peak temperature. The activation temperature is always slightly below
the alloy melting point, while the peak temperature is always above its melting point.
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Date: 13 February 2018 / Ver. 2.04
SAC305 No Clean Solder Paste
4900P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4900P
Cleaning
The 4900P is a no clean formulation; therefore, the residues do not need to be removed for typical
applications. For spot residue removal, you may use MG 8241-T or 8241-W Isopropyl Alcohol Wipes.
Storage and Shelf Life
Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation, and
chemical activity. Store syringes in an upright position with tip down to prevent flux separation and air
entrapment.
Bring the paste to room temperature prior to use. To warm the refrigerated paste, let stand 3 hours at
ambient temperature before use. For faster warm up, place the sealed container in a water bath at
ambient temperature for 30 minutes.
Unopened Container 2–10 °C [35–50 °F] 24 months from date of manufacture.
Unopened Container 20–25 °C [68–77 °F] 12 months from date of manufacture.
Reusing Solder Paste
Reusing solder paste is not normally recommended because it typically generates more complications than
it is worth. If you do decide to reuse solder paste, keep the following pointers in mind:
•
•
•
Keep the paste tightly sealed and refrigerated when not in use.
Store syringes upright position with tip down to prevent flux separation and air entrapment.
Before reuse, check
that the paste hasn’t separated or thickened relative to its usual state.
Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of
between 20–25 °C [68-77 °F] at a relative humidity of 40–65% will ensure consistent performance and
maximum life of paste.
Cleaning Misprint Boards
In case of a misprinted board, the paste may be cleaned by hand using the MG 8241 Alcohol Wipes.
Stencil Cleaning
Periodic cleaning of the stencil during production is recommended to prevent unwanted deposits outside
the print areas. Insufficient stencil cleaning increases solder balling. After printing 5 to 10 boards, we
therefore recommend a dry wipe. And after every 15 to 25 boards, we recommend a wet wipe with MG
8241-T or 8241-W Alcohol Wipe. For fine pitch boards, the cleaning frequency generally needs to be
increased.
Disposal
The 4900P should be stored in a sealed container and disposed of in accordance with state & local
authority requirements.
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Date: 13 February 2018 / Ver. 2.04
SAC305 No Clean Solder Paste
4900P Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4900P
Health and Safety
Please see the 4900P
SAC305 No Clean Solder Paste
Safety Data Sheet
(SDS) for more details on
transportation, storage, handling and other security guidelines.
Environmental Impact:
Very toxic to aquatic life with long lasting effects.
This product meets the European Directive
2011/65/EU Annex II (ROHS);
recasting 2002/95/EC.
Health and Safety:
This product may cause serious eye irritation. It is widely used in the packing and
food industry.
HMIS® RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
Approximate HMIS and NFPA Risk Ratings Legend:
0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe)
NFPA® 704 CODES
*
1
0
0
0
1
1
0
Packaging and Supporting Products
Cat. No.
4900P-25G
4900P-250G
Packaging
Syringe
Jar
Net Weight
25 g
250 g
0.88 oz
8.81 oz
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Date: 13 February 2018 / Ver. 2.04
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