CHIPSESD DEVICES
Littelfuse’s ChipSESD family of Silicon ESD devices,
available in EIA-0201 and EIA-0402 sized rectangular SMT
passive component packages, can help protect electronic
circuits against damage from electrostatic discharge
(ESD) events.
The SESD0201P1BN-0400-090, 0201-sized ChipSESD
device’s miniature footprint (0.6mm x 0.3mm x 0.3mm) is
approximately 70% smaller than prior-generation devices.
This offers designers flexibility in space constrained
applications.
The
ChipSESD
devices
are
high-capacitance,
bi-
directional devices that can be used for low-speed generic
interfaces such as keypads, power buttons, speakers
and microphone ports in a portable electronics. The bi-
directional operation eliminates orientation constraints
and the need for polarity inspections. The surface mount
technology (SMT) passive component package allows the devices to be easily installed onto the printed circuit board
using the standard PCB assembly process. Once soldered onto the boards, the ChipSESD’s solder fillets at the end
terminals can easily be visually inspected.
The ChipSESD devices offer 10kV contact and 16kV air discharge protection per the IEC61000-4-2, level 4 standard
with a surge rating of 2A under 8x20μs pulse.
BENEFITS
• Silicon ESD devices in an EIA-0201 and EIA-0402
sized rectangular SMT passive component package
• Bi-directional operation eliminates orientation
constraints
• Standard PCB assembly and rework process
• ESD protection in space-constrained portable
electronics and mobile handsets
• Helps protect electronic circuits against damage
from ESD
• Assists equipment to pass IEC61000-4-2, level 4 testing
APPLICATIONS
• Mobile phones and portable electronics
• Digital cameras and camcorders
• Notebooks, set top boxes, motherboards
• USB 2.0 and computer I/O ports
• Applications requiring high ESD performance in a
small package
FEATURES
• Input capacitance -4.0pF (typ) & 4.5pF (typ)
• Low leakage current – 1.0μA (max)
• Low working reverse voltage - 6.0V (max)
• Capable of withstanding numerous ESD strikes
• RoHS compliant
• Halogen free
(refers to: Br
≥
900ppm, Cl
≥
900ppm, Br+Cl
≥
1500ppm)
HF
Halogen Free
RoHS Compliant, ELV Compliant
Specifications subject to change without notice. ©2016 Littelfuse, Inc.
67
ChipSESD Devices
Table CE1 — Maximum Ratings
IEC61000-4-2, level 4 (ESD Withstand)
Contact
Air
Part Number
SESD0201P1BN-0400-090
SESD0402P1BN-0450-090
(kV)
±10*
±10*
(kV)
±16
±16
Temperature
Operating
(°C)
-40 to +125
-40 to +125
Storage
(°C)
-40 to +125
-40 to +125
Table CE2 — Electrical Characteristics @T=25°C
Input Capacitance*
Part Number
SESD0201P1BN-0400-090
SESD0402P1BN-0450-090
* @ Vr=0V, f=1MHz
† V
br
is measured at test current I
T
Typ
(pF)
4.0
4.5
Max
(pF)
5.0
5.5
Leakage Current (max)
I
L
@ V
RWM
= 6.0V (µA)
1.0
1.0
Breakdown Voltage (min) Working Reverse Voltage
V
br
@ I
T†
= 1mA (V)
V
RWM
@ peak (V)
9.0
9.0
6.0
6.0
Clamping Voltage (typ)
V
CL
@ lpp=2A,
tp=(8/20µs) (V)*
+10.0
+10.0
Figure CE1 — ESD Clamping Voltage - 8kV Contact
100
90
80
70
60
Voltage (V)
Figure XX ESD Clamping Voltage - 8kV Contact for ChipSESD Devices
Replace of Figure SE1 & SE2 - Capacitance vs. Frequency for SESD Devices.
ChipSESD
ESD 8kV Contact per IEC6100-4-2 Level 4
50
40
30
20
10
0
0
10
20
30
40
50
Time (ns)
60
70
80
90
100
Figure CE2 — ESD Clamping Voltage - 8x20μs, 2A Surge
ChipSESD
Typical Clamping Performance
8x20µs - 2A Surge
14
12
10
Voltage (V)
8
6
4
2
0
0.0E+00
1.0E-04
2.0E-04
3.0E-04
4.0E-04
5.0E-04
6.0E-04
7
.0E-04
8.0E-04
9.0E-04
1.0E-03
Time (s)
68
Specifications subject to change without notice. ©2016 Littelfuse, Inc.
HF
Halogen Free
RoHS Compliant, ELV Compliant
Bottom View
A
Bottom View
S
ChipSESD Devices
B
Pad 1
Pad 2
F
D
D
Table CE3 - Dimensions in Millimeters and
E
(Mils)*
Side View
A
D
1
2
C
E
A
Top View
Part Number
SESD0201P
SESD0402P
A
0.60 ± 0.05
(23.62 ± 2.00)
1.10 ± 0.10
(43.31 ± 0.40)
C
B
C
0.30 ± 0.05
(11.81 ± 2.00)
0.50 ± 0.10
G
Pad 2
(19.69 ± 4.00)
D
0.21 ±
B 1
0.07
(8.27 ± 2.80)
0.25 ± 0.15
(9.84 ± 6.00)
F
Figure
CE3
2
CE3
2
0.30 ± 0.05
(11.81 ± 2.00)
0.50 ± 0.10
Pad 1
(19.69 ± 4.00)
* Round off approximation
Figure CE3
A
B
C
D
D
Table CE4 - PCB Pad Layout in Millimeters and (Mils)*
Part Number
SESD0201P
SESD0402P
L
0.28 ± 0.01
(11.00 ± 0.40)
0.61 ± 0.05
(24.00 ± 2.00)
* Round off approximation
S
0.19 ± 0.01
(7
.50 ± 0.40)
0.52 ± 0.05
(21.00 ± 2.00)
W
0.30 ± 0.01
(11.80 ± 0.40)
0.50 ± 0.05
(20.00 ± 2.00)
Figure
CE4
CE4
Figure CE4
Recommended Landing Pattern
PC Board
Pin 1
cathode
Typical SESD
Protected Signal
SESD0402S-005
Uni-directional Board P
an
W
Pad 1
Pad 2
Pin 1
Pi
Orient Pin 1 to P
L
S
L
ChipSESD Devices Can be Oriented Either Direction
RoHS Compliant, ELV Compliant
HF
Halogen Free
Specifications subject to change without notice. ©2016 Littelfuse, Inc.
69
ChipSESD Devices
T
Table CE5 — Tape Specifications
øD
T
2
0
P
2
P
0
[10 pitches cumulative tolerance
on tape ±0.2mm]
Tape Dimension
EIA Mark
A
B
D
E
F
W
P
0
P
1
P
2
T
T
1
Cover Tape
B
1
is for tape feeder reference only,
including draft concentric about B
0
SESD0201P1BN-0400-090
Dimension (mm)
0.35 ± 0.02
K
0
B
1
A
0
F
E
1
SESD0402P1BN-0450-090
Dimension (mm)
0.58 ± 0.03
W
0.67 ± 0.02
1.55 ± 0.05
1.75 ± 0.05
3.50 ± 0.05
8.00 ± 0.10
4.00
Center Lines of Cavity
±
0.10
P
1
øD
1
Embossment
1.20 ± 0.03
1.55 ± 0.05
1.75 ± 0.05
3.50 ± 0.05
8.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
2.00 ± 0.05
0.60 ± 0.03
B
0
E
2
2.00 ± 0.05
2.00 ± 0.05
0.42 ± 0.03
User Direction of Unreeling
Figure CE5
Full Radius
T
P
0
P
2
D
E
Access Hole at
Slot Location
(ø40mm min.)
F
W
A
D
B
C
(
Arbor hole diameter)
A
P
1
B
If present,
tape slot in core
for tape start:
4.5 ± 0.05 width x 10.0mm (min) depth
Table CE6 — Reel Specifications
Reel Dimension
EIA Mark
A
B
C
D
E
F
G
Dimension (mm)
178.0 ± 2.0
2.0 ± 0.5
13.0 ± 0.5
21.0 ± 0.8
62.0 ± 1.5
9.0 ± 0.5
13.0 ± 1.0
Figure CE6
G
F
B
D
C E A
Label
70
Specifications subject to change without notice. ©2016 Littelfuse, Inc.
HF
Halogen Free
RoHS Compliant, ELV Compliant
ChipSESD Devices
Definition of Terms
I
L
V
RWM
V
br
I
T
V
CL
Reverse Leakage Current @ V
RWM
Working Peak Reverse Voltage
Breakdown Voltage @ I
T
Test Current
Clamping Voltage
Part Numbering System
SESD 0201 P1BN - 0400 - 090
Breakdown Voltage (min)
090 = 9.0V
Input Capacitance (typ)
0400 = 4.0pF
0450 = 4.5pF
N - No Common Pin
B - Bi-directional
1 - One Channel
Package
P - Packaged SMD
EIA Size
0201
0402
Series
Silicon ESD
Notice:
Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining
or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may
result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall
be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising
out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject
to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse.
RoHS Compliant, ELV Compliant
HF
Halogen Free
Specifications subject to change without notice. ©2016 Littelfuse, Inc.
71
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